JPS62286372A - Contact type image sensor - Google Patents

Contact type image sensor

Info

Publication number
JPS62286372A
JPS62286372A JP61129932A JP12993286A JPS62286372A JP S62286372 A JPS62286372 A JP S62286372A JP 61129932 A JP61129932 A JP 61129932A JP 12993286 A JP12993286 A JP 12993286A JP S62286372 A JPS62286372 A JP S62286372A
Authority
JP
Japan
Prior art keywords
printed circuit
chips
bonding
boards
reed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61129932A
Inventor
Shinichirou Nagakusa
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP61129932A priority Critical patent/JPS62286372A/en
Publication of JPS62286372A publication Critical patent/JPS62286372A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE: To protect the moving of an original from being hindered by the semiconductor ship of a photoelectric transducer and to miniaturize the titled sensor by inserting said chip in the clearance between an element board and a printed circuit board for control circuit, and mechanically supporting and connecting the wires by means of a tape-supported foil-shaped conductor.
CONSTITUTION: On both sides of the transparent glass base plate 1 supporting the photoelectric transducer 3, the printed circuit boards 21 are disposed with the clearances 10 in-between. On the boards 21, wiring patterns 22 for control circuit are printed. In the clearances10, the LSI chips 11 are disposed, and the electrodes of the chips 11 are connected to the wiring pattern 7 of the glass plate 1 by bonding a reed 13 on a film tape 12 and to the wiring pattern 22 on the printed circuit board 21 by bonding a reed on a film tape 14. For the reeds 13 and 15, a metal conductor of a large sectional area is used so that the LSI chips 11 can be supported by the glass plate 1 and the printed circuit boards 21. At the same time, the bonding part between the chips and the electrodes is made a eutectic alloy in order to improve the reliability.
COPYRIGHT: (C)1987,JPO&Japio
JP61129932A 1986-06-04 1986-06-04 Contact type image sensor Pending JPS62286372A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61129932A JPS62286372A (en) 1986-06-04 1986-06-04 Contact type image sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61129932A JPS62286372A (en) 1986-06-04 1986-06-04 Contact type image sensor

Publications (1)

Publication Number Publication Date
JPS62286372A true JPS62286372A (en) 1987-12-12

Family

ID=15021985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61129932A Pending JPS62286372A (en) 1986-06-04 1986-06-04 Contact type image sensor

Country Status (1)

Country Link
JP (1) JPS62286372A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5557238A (en) * 1994-04-29 1996-09-17 Sgs-Thomson Microelectronics S.A. Differential amplifier with common mode regulation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5557238A (en) * 1994-04-29 1996-09-17 Sgs-Thomson Microelectronics S.A. Differential amplifier with common mode regulation

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