JPS62286257A - フラツトベ−ス形半導体装置 - Google Patents
フラツトベ−ス形半導体装置Info
- Publication number
- JPS62286257A JPS62286257A JP12966586A JP12966586A JPS62286257A JP S62286257 A JPS62286257 A JP S62286257A JP 12966586 A JP12966586 A JP 12966586A JP 12966586 A JP12966586 A JP 12966586A JP S62286257 A JPS62286257 A JP S62286257A
- Authority
- JP
- Japan
- Prior art keywords
- base
- semiconductor element
- electrode
- block
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 238000007789 sealing Methods 0.000 claims abstract description 5
- 239000000696 magnetic material Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- 238000003466 welding Methods 0.000 description 9
- 229910052742 iron Inorganic materials 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000012212 insulator Substances 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000002788 crimping Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Die Bonding (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12966586A JPS62286257A (ja) | 1986-06-04 | 1986-06-04 | フラツトベ−ス形半導体装置 |
| DE19873718598 DE3718598A1 (de) | 1986-06-04 | 1987-06-03 | Halbleiteranordnung |
| US07/289,441 US4893173A (en) | 1986-06-04 | 1988-12-22 | Low-inductance semiconductor apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12966586A JPS62286257A (ja) | 1986-06-04 | 1986-06-04 | フラツトベ−ス形半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62286257A true JPS62286257A (ja) | 1987-12-12 |
| JPH0469818B2 JPH0469818B2 (enrdf_load_stackoverflow) | 1992-11-09 |
Family
ID=15015122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12966586A Granted JPS62286257A (ja) | 1986-06-04 | 1986-06-04 | フラツトベ−ス形半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62286257A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6108026B1 (ja) * | 2016-12-16 | 2017-04-05 | 富士電機株式会社 | 圧接型半導体モジュール |
-
1986
- 1986-06-04 JP JP12966586A patent/JPS62286257A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6108026B1 (ja) * | 2016-12-16 | 2017-04-05 | 富士電機株式会社 | 圧接型半導体モジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0469818B2 (enrdf_load_stackoverflow) | 1992-11-09 |
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