JPS62280736A - Radiation sensitive resin composition - Google Patents

Abstract

PURPOSE:To obtain the titled composition capable of forming a polyimide cured film having excellent heat-resisting and solvent-resisting properties by radiating the titled composition by comprising the composition of a solution which dissolves a specific polyimide and an aromatic bisazide compd. in a solvent so as to contain >=95wt% the total of the specific polyimide and the aromatic bisazide compd. on the weight basis of the solid contg. in said solution. CONSTITUTION:The titled composition is composed of the solution which dissolves the polyimide and the aromatic bisazide compd. in the solvent. Said polyimide and the aromatic bisazide compd. are obtd. by reacting an aliphatic tetracarboxylic acid or its anhydride and a diamine compd. or a diisocyanate compd. And, said solution contains >=95wt% the total of the polyimide and the aromatic bisazide compd. on the weight basis of the solid contd. in the solution. Thus, the titled composition capable of forming the polyimide cured film having excellent heat-resisting and solvent-resisting properties by radiating the radiation such as a visible ray is obtd.

Description

Detailed Description of the Invention 3. Detailed Description of the Invention (Field of Industrial Application) The present invention provides five radioactive resin compositions, specifically visible light, ultraviolet rays, deep ultraviolet rays, X-rays, electron beams, molecular beams, The present invention relates to a polyimide-based radiation-sensitive resin composition that is cured by irradiation with radiation such as gamma rays or proton beams, and forms a polyimide cured film with excellent heat resistance without requiring a subsequent heat treatment step.

(Prior Art) It is well known that polyimide has excellent heat resistance. BACKGROUND ART Conventionally, attention has been focused on the excellent heat resistance of this polyimide, and research has been conducted to obtain a composition that has photosensitivity and forms polyimide by heat treatment, such as a photosensitive resin composition suitable for a photoresist. Such photosensitive resin compositions include photosensitive resins in which a polymerizable unsaturated compound and a photopolymerization initiator are blended with a polyimide precursor with an acid value residual rate of 40% or less obtained from an aliphatic tetracarboxylic acid and a diamine. Composition (Japanese Unexamined Patent Publication No. 59-68331), an epoxy compound having a polymerizable unsaturated bond is added to a polyimide precursor having an acid value residual rate of 40-5% obtained from an aliphatic tetracarboxylic acid and a diamine. The resulting polymerizable non-#2! Photosensitive resin compositions (JP-A-59-68332), which are prepared by blending a photopolymerization initiator and optionally a polymerizable unsaturated compound with a polyimide precursor having a sum bond, are known. However, the cured film obtained using the photosensitive resin composition may have voids or may contain residual low-molecular compounds generated by imidization in the cured film, resulting in poor heat resistance, resolution, etc. There are problems such as a decrease in

(Problems to be Solved by the Invention) The present invention solves the above-mentioned problems and uses visible light that does not require imidization by high temperature treatment after coating film formation as in conventional 8-light resin compositions. It forms a polyimide cured film with excellent heat resistance and solvent resistance by curing only by irradiation with radiation such as 5. The object of the present invention is to provide a radioactive resin composition.

(Means for Solving the Problems) The present invention comprises (A) a polyimide obtained from an aliphatic tetracarboxylic acid or its anhydride and a diamine compound or a diisocyanate compound, and (B) an aromatic bisazide compound dissolved in a solvent. 95% by weight or more of the solid content in the solution consists of the polyimide (A) and (
B) A radiation-sensitive resin composition characterized by being an aromatic bisazide compound is provided.

The present invention will be explained in detail below.

Examples of aliphatic tetracarboxylic acids or anhydrides thereof (hereinafter collectively referred to as component (a)) used in the present invention include ethylenetetracarboxylic acid, 1°2.3.4-butanetetracarboxylic acid, 1,1゜2.2-Cyclopropanetetracarboxylic acid, 1゜1.2.3-cyclobutanetetracarboxylic fi, 1゜2.3.4-cyclopenkunetetracarboxylic acid, 1.2.3.4-cyclohexanetetracarboxylic acid acid, 1.2.4.5-cyclohexanetetracarboxylic acid, 2,3.5-)lycarboxycyclopentyl acetic acid, methyl-cyclohexenetetracarboxylic acid, 3.
5.6-tricarboxynorbornane-2-acetic acid, bicyclo[2,2,2]-octo-7-nin-tetracarboxylic acid, 5-[2,5-dioxotetrahydrofuryl-3-methyl-cyclohexenedicarbone Examples include chain or cycloaliphatic tetracarboxylic acids such as ethylenetetracarboxylic acid, 1.2.3.4-butanetetracarboxylic acid, and anhydrides thereof, but cycloaliphatic tetracarboxylic acids are preferred.

The above aliphatic tetracarboxylic acids or anhydrides thereof can be used alone or in combination of two or more. Among the above, anhydrides are preferred, especially 2,3.5-
Tricarboxycyclopentyl acetic dianhydride, 1.2.
3.4-cyclopenkune tetracarboxylic dianhydride, 1
, 2.3.4-butanetetracarboxylic dianhydride is preferred.

The diamine compound used in the present invention has the following general formula % (wherein R1 is a divalent hydrocarbon group, and the hydrocarbon contains a silicon atom, an oxygen atom, and/or a sulfur atom). Examples include compounds represented by the following formulas. A concise example of R1 in the above general formula is the following general formula % formula % (wherein, X+, X2.X3 and X4 may be the same or different, are a hydrogen atom or a methyl group, and Y is CHa, C2H4, -0-, S.

-C(CH3)2, C(CFt)2-1-8○
2-1, n is O or l) or a sulfur-containing hydrocarbon group, -(CH2
). - (where n is an integer of 2-9), an aliphatic hydrocarbon group having about 6 to 13 carbon atoms and the following general formula: (wherein, Xs and X6 are the same or different; may be a hydrogen atom, methyl group or phenyl group, and 5.P
and Q may be the same or different, -C-82
, l- (where n is an integer of 1-20), and m is an integer of 0 or 1 or more.

In particular, in order to further improve the heat resistance of the polyimide cured film obtained by curing the radiation-sensitive resin composition, it is preferable that R1 is an aromatic group.

Specific examples of the diamine compounds include para-phenylene diamine, meta-phenylene diamine, 4°4°-diaminodiphenylmethane, 4,4'-diaminodiphenylethane, 2,2-di(p-aminophenyl)hexafluoropropane, 4.4°-diaminodiphenylpropane, benzidine, 4°4°-diaminodiphenyl sulfide,
4,4°-diaminodiphenylsulfone, 4,4°-diaminodiphenyl ether, 1,5-diaminonaphthalene, 3,3°-dimethyl-4,4′-diaminobiphenyl, 3,4°-diaminobenzanilide, 3, 4°-diaminodiphenyl ether, metaxylylene diamine,
Paraxylylene diamine, ethylene diamine, propane diamine, tetramethylene diamine, pentamethylene diamine, hexamethylene diamine, heptamethylene diamine, octamethylene diamine, nonamethylene diamine.

4.4'-dimethylhbutamethylenediamine l114-
Diaminocyclohexane, tetrahydrodicyclopentadiphenylenediamine, hexahydro-4,7-methanoindanilenesymethylenediamine, tricyclo[6,2
, l, 02.〒]-undecylenedimethyldiamine, di(β-aminoethoxy)phenylmethylsilane, di(β-aminoethoxy)phenylmethylsilane, di(β-aminoethoxy)phenylmethylsilane,
-aminoethoxy)dimethylsilane, di(β-aminopropoxy)dimethylsilane, di(β-aminopropoxy)diphenylsilane, etc., preferably paraphenylenediamine, metaphenylenediamine, 4.4°-diaminodiphenylmethane, 4.4 Examples include '-diaminodiphenyl sulfone and 4,4'-diaminodiphenyl ether. These diamine compounds can be used alone or in combination.

As the diisocyanate compound used in the present invention,
Diisocyanate compounds represented by the following general formula % (in the formula, R2 represents a 2fillF hydrocarbon group) can be mentioned.

Specific examples of the diisocyanate compounds include aliphatic diisocyanates such as hexamethylene diisocyanate, alicyclic diisocyanates such as cyclohexane diisocyanate, and diphenylmethane-4,4'
-Diisocyanate, diphenyl ether-4,4'-
Diisocyanate, diphenylsulfone-4,4'-diisocyanate, diphenylsulfide-4,4°-diisocyanate, 1,2-diphenylethane-p.

p''-diisocyanate, 2,2-diphenylpropane-p,p'-diisocyanate, 2,2-diphenyl-
1,l,1,3,3,3-hexafluoropropane-p
, p'-diisocyanate.

2.2-Diphenylbutane-p,p'-diisocyanate, diphenyldichloromethane-4,4"-diisocyanate, diphenylfluoromethane-4,4'-diisocyanate, benzophenone-4,4'-diisocyanate, N-phenylbenzoic acid amide Examples include aromatic diisocyanates such as -4,4'-diisocyanate. Preferred examples of R2 in the above general formula include the same aromatic hydrocarbon group as mentioned as R1 in one of the above formulas of the diamine compound. Specific examples include diphenylmethane-4,4'-diisocyanate, diphenyl ether-4,4'-diisocyanate, diphenylsulfone-4,4'-cysocyanate and diphenylsulfide-4,4'-diisocyanate. Particularly preferred are diphenylmethane-4,4°-diisocyanate. These diisocyanate compounds can be used alone or in combination.

Hereinafter, the diamine compound and diisocyanate compound will be collectively referred to as component (b).

The polyimide used in the present invention is the above component (a) and (b)
It can be prepared directly or via a polyamic acid by reacting the components with a conventionally known method. In this reaction, it is preferable to use a solvent that dissolves both components (a) and (b) in order to increase the molecular weight of the polyimide. Specific examples thereof include γ-butyrolactone, N- Methyl-2-pyrrolidone.

N,N-dimethylformamide, N,N-dimethylacetamide, dimethylsulfoxide, tetramethylurea,
Mention may be made of aprotic dipolar polar solvents such as hexamethylphosphortriamide. In addition, organic solvents such as alcohols, phenols, ketones, ethers, etc., which are most commonly used, such as ethyl alcohol, isopropyl alcohol, ethylene glycol, propylene glycol, l,4-butanediol, triethylene glycol , ethylene glycol monomethyl ether, phenol, cresol, methyl ethyl ketone,
Tetrahydrofuran and the like can also be used. The amount of these solvents used is usually 0.5 to 20 times the total amount of components (a>component and (b)) by weight.

The ratio of component (a) and component (b) used is preferably equimolar, but there may be some excess or deficiency as long as the purpose of the present invention can be achieved.In order to obtain a high molecular weight polyimide,
Usually, 0.7-mol of component (b) is added to 1 mole of component (a).
About 1.3 mol is used. Further, in order to adjust the molecular weight of the polyimide, dicarboxylic acids or their anhydrides such as phthalic acid, maleic acid, phthalic anhydride, maleic anhydride, etc. can be used. The amount of these dicarboxylic acids or their anhydrides used is preferably 0.3 mol or less per 1 mol of the tetracarboxylic acid component.

In the above polyimide production reaction, an imidization catalyst and a dehydrating agent that are used as a shell for imidization can be used. Imidization catalysts include triethylamine, pyridine, lutidine, collidine, triphenylamine, 1.4
-Diazabicyclo[2,2,2-cooctane, etc., and dehydrating agents include acid anhydrides such as acetic anhydride, propionic anhydride, isobutyric anhydride, and benzoic anhydride.

The imidization reaction temperature varies depending on the combination of components (a) and (b), but is usually in the range of 0-300°C, preferably in the range of 0-180°C.

The intrinsic viscosity of the polyimide used in the present invention is normal, 0,
1-5 (ηs p / c in dimethylformamide, temperature 30 °C), preferably 0.2-2 (ηs p
/c in dimethylformamide, temperature 30°C).

The polyimide used in the present invention means a polyimide that has been substantially imidized, but it may contain an amic acid structure which is a precursor of imide to the extent that the effect is not impaired.For example, the polyimide used in the present invention When using the radiation-sensitive resin composition for applications that require particularly high heat resistance, it is preferable to use 100% imidized polyimide; Polyimides partially having an amic acid structure can also be used. Acid value residual rate, which indicates the remaining proportion of carboxyl groups after imidization reaction, assuming that the acid value of component (a) in the system before imidization (the acid value is expressed in mg equivalent of carboxyl groups per 1 g of sample) is 100%. When expressed as , the acid value residual rate of the polyimide used in the present invention is preferably about 5
% or less.

The polyimide obtained as described above contains methanol,
It can be purified by precipitation in a solvent such as ethanol, acetone, toluene, or water.

Usually, after purification, the reaction solution is redissolved in a solvent suitable for the purpose of use, but depending on the purpose, the reaction solution can be used as it is. The solvent used in the above-mentioned imidization reaction can be used to redissolve the polyimide.

The present invention is based on the discovery that an aromatic bisazide compound can crosslink the above-mentioned polyimide by irradiation with radiation. Examples of these aromatic bisazide compounds include 4.4'-diazidostilbene, 4.4°
-Diazidostilbene-2,2°-sodium disulfonate, l,5-diazidonaphthalene, ■,5-diazidnaphthalene-sodium 3,7-disulfonate, 4.4'
-Diazidobenzophenone, 4,4'-diazidophenylmethane, 4,4'-diazidochalcone.

4.4'-Diazidobenzylacetone, 2.6-di(4
(benzyl) cyclohexanone.

2.6-di(4'-azidobenzal)-4-methylcyclohexanone, 6-azido-2-(4°-azidostyryl)benzimidazole, 2.6-di(4''-azidobenzyl)cyclopentanone, 4. 4'-diazidobiphenyl, 3.3'-diazidobiphenyl, 4.4'-diazidiphenylmethane, 3.3'-diazidiphenylmethane.

4.4′-Diazidiphenylethane, 3.3′-Diazidiphenylethane, 4.4″-Diazidiphenyl ether, 3.3°-Diazidiphenyl ether, 4
．． Examples include 4'-diazido diphenyl sulfide, 3,3'-diazido diphenyl sulfide, 4,4'-diazido diphenyl sulfone, and 3,3°-diazido diphenyl sulfone.

The above aromatic bisazide compounds may be used alone or in combination of two or more.

The amount of the aromatic bisazide compound used is 1
Preferably 0.05-30 parts by weight per 00 parts by weight,
Particularly preferred is 0.5-25 parts by weight.

8 The radioactive resin composition of the present invention essentially consists of the above-mentioned polyimide resin and aromatic bisazide compound, but may contain appropriate additives as necessary.
Additives include antioxidants such as hydroquinone, p
-methoxyphenol, pt-butylcatechol, 2
．． 6-di is monobutyl, aromatic hydroxy compounds such as p-cresol, β-naphthol, and pyrogallol, quinones such as benzoquinone and p-toluquinone, amines such as naphthylamine, p-toluidine, and phenothiazine, and N-nitrosophenylhydroxylamine. Mention may be made of the aluminum and ammonium salts of and nitrobenzene.

The amount of these additives used is less than about 5% by weight of the total solid weight of the radiation sensitive resin composition. If it is 5% by weight or more, the heat resistance of the cured film tends to decrease.

The viscosity of the radiation-sensitive resin composition of the present invention is usually 10-5,
0OOcps, preferably 50-10.000cps, and the solid content concentration is usually 0.5-30! ! %, preferably 5-20 times.

When the radiation-sensitive resin composition of the present invention is used, for example, as a resist, the polyimide resin and the aromatic bisazide compound are first mixed in a suitable organic solvent, for example, the components (a) and (b) in the method for producing the polyimide. Next, this solution is applied to substrates such as silicon wafers for semiconductors, glass plates, aluminum plates, ceramic plates, bimetal plates, printed circuit boards, polyethylene, polypropylene, polyethylene terephthalate, and polyvinyl chloride. , films such as nylon,
It is applied to the surface of paper, cloth, fiber, metal, ceramics, pottery, etc. by spin cord, spraying, dipping, etc., and dried at a temperature of 80-200℃ to remove the solvent in the coating and form a uniform film. A 8-radiation-sensitive resin composition coating with a thickness of 0.01-50 μm is formed. At this time, in order to improve the adhesion to the substrate, the surface of the substrate is pretreated with a coupling agent such as a silane coupling agent, or a coupling agent is added to the radiation-sensitive resin composition in advance. Next, the coating film of the obtained radiation-sensitive resin composition is partially irradiated with radiation, and then developed with a developer to leave the irradiated areas and remove the non-irradiated areas to form the desired image. form a pattern. The developer may be a solvent for both the polyimide and the aromatic bisazide compound described above, such as γ-nibutyrolactone, N-methylpyrrolidone, N,N-dimethylacetamide, N,N-dimethylformamide, etc. alone or in a mixture of two or more thereof. and can be used. Furthermore, alcohols such as methanol, ethanol, and propatool, cellosolves such as ethyl cellosolve and butyl cellosolve, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, ethers such as dioxane and tetrahydrofuran, and ethyl celloacetate may be added to these solvents. It is also possible to use a mixture of solvents such as esters.

After development, rinse with alcohols such as methanol, ethanol, and propatool, ketones such as acetone, methyl ethyl ketone, and cyclohexane, ethers such as dioxane and tetrahydrofuran, esters such as ethyl cellosolve acetate, or solvents such as water. Afterwards, heat drying at 80-200°C to remove the solvent. In addition to the above solvents, solvents used for rinsing include γ-butyrolactone, N-methylpyrrolidone, N,N-dimethylacetamide, N,N-dimethylformamide, dimethylsulfoxide, tetramethylurea, and hexamethylphosphoramide. , m-cresol, p-talolophenol in a small amount, for example, 40% by weight or less, preferably 20% by weight of the rinse solution.
It can contain the following:

(Example) Hereinafter, the present invention will be described in more detail by citing Example 1.

Example 1 2.3.5-) 11.28 g (0.0503 mol) of lycarboxycyclopentyl acetic dianhydride and 10.4°-diaminodiphenyl ether. OIg (0.05 mol) was dissolved in 355.5 g of dimethylformamide and reacted at room temperature for 20 hours. Furthermore, pyridine 19.89
g (0,25 mol) and acetic anhydride 15,41 g (0,
15 moles).

Pyridine and acetic anhydride were added dropwise in this order (dropping time 15 minutes).
The reaction temperature was raised from room temperature to 130°C, and the reaction was carried out for a total of 4 hours, including the time for dropwise addition of pyridine and acetic anhydride. After returning the temperature of the solution to room temperature, the reaction solution was slowly poured into 31 methanol.

The polymer was precipitated. The precipitated polymer was thoroughly washed with methanol and vacuum-dried at 80° C. under a reduced pressure of 1 mmHg.

When the IR spectrum of the obtained polymer was measured,
1710cm, 1980cm-' and 1370cm
Absorption due to imide carbonyl groups was observed in ``, and absorption due to carboxyl groups was not observed, indicating that polyimide was produced and that its imidization rate was 98% or more.

The imidization rate can be determined by measuring the absorbance of the carboxyl group in the IR spectrum of the polyamic acid obtained from component (a) and the diamine compound, and measuring the absorbance of the carboxyl group of the polyimide for which the imidization rate is to be determined, as in the case of polyamic acid. The imidization rate was calculated based on the measurement at the same molar concentration.

The obtained polyimide (ηs p / c = 1, ·
026d! , /g, C=0.5 g/l 00 mK, in dimethyl formamide, temperature 30'C) in a dimethyl formamide solution (polyimide concentration 12% by weight), 5 parts by weight of 2.6- Di(4'-
Azidobenzal)-4-methylcyclohexanone was added and dissolved to prepare a solution of the radiation-sensitive resin composition of the present invention.

This solution was applied onto a glass substrate by spin coating, and then dried with hot air at 130°C for 15 minutes to a thickness of 5.
A uniform resist coating film with a thickness of μm was formed. The coating film was irradiated with a light energy of 100 mJ/cm2 using a high-pressure mercury lamp (newly manufactured by Oak Seisakusho) through a mask for measuring resolution, then developed with N,N-dimethylacetamide for 30 seconds, and rinsed with dioxane. After that, it was dried at a temperature of 170° C. for 30 minutes to form a resist pattern.

As a result, it was found that a clear resist pattern with line and spaces of 100 μm was obtained, and the resolution was high. This resist pattern had no pinholes, and when observed under a microscope, the pattern edges were sharp.

This resist pattern was heated at 200°C for 1 hour.
No change was observed in the resist pattern.

Further, a solution of the radiation-sensitive resin composition of this example was applied to another glass substrate in the same manner as above, dried, the entire surface was irradiated with radiation, and a polyimide cured film was heated at 200°C for 1 hour. A cross-cut test (cross-cutting with a knife, applying commercially available tape, then peeling it off to check for peeling of the film) revealed 1. It didn't come off at all. Furthermore, the cured polyimide film is insoluble in almost all organic solvents such as dimethylformamide, N-methylpyrrolidone, and dimethylacetamide, and the resist pattern formed from the radiation-sensitive resin composition of the present invention has excellent adhesion, solvent resistance, and It had excellent heat resistance.

Example 2 N of the radiation-sensitive resin composition obtained in Example 1.

When the N-dimethylformamide solution was coated on an aluminum substrate to a dry film thickness of 0.8 μm and evaluated in the same manner as in Example 1, a resist pattern with a resolution of 100 μm was obtained as in Example 1. Also, like Example 1, this resist pattern had excellent adhesion, solvent resistance, and heat resistance.

Example 3 N of the radiation-sensitive resin composition obtained in Example 1.

Evaluation was performed in the same manner as in Example 1 except that an N-dimethylformamide solution was used and an aluminum substrate was used instead of the glass substrate. As in Example 1, a resist pattern with a resolution of 100 μm was obtained. Similar to Example 1, the resist pattern had excellent adhesion, solvent resistance, and heat resistance.

Example 4 2.3.5-) 22.4 g of lycarboxycyclobentylacetic dianhydride, 25.4'-diphenylmethane diisocyanate. Next, 4 g of triethylamine was added as a catalyst, and the reaction was started at 8 o'clock at a temperature of 180-190°C. After returning the temperature of this reaction solution to room temperature, 3! The reaction solution was slowly poured into methanol to precipitate the polymer. Thoroughly wash the precipitated polymer with methanol,
Vacuum drying was performed at 80° C. under a reduced pressure of mmHg.

When the IR spectrum of the obtained polymer was measured,
1710cm-', 1780cm-' and +370-
In 1, absorption due to imidocarbonyl groups was observed, and absorption due to carboxyl groups was not observed, indicating that polyimide was produced, and furthermore, the imidization rate was 98%.
It turns out that's all.

The imidization rate was determined in the same manner as in Example 1.

The obtained polyimide (ηsp/c=0.962dl!/
g, C=1g/100m! ,, polyimide 100'! in dimethylaceamide solution (polyimide concentration 10 wt 1%) in dimethylformamide (temperature 30°C). ! 5 parts of 2,6-di(4'-akidobenzal)
-4-Methylcyclohexanone was added and dissolved to prepare a solution of the radiation-sensitive resin composition.

When this solution was evaluated on a glass substrate in the same manner as in Example 1, a clear resist pattern with a line angle of 60 μm was obtained, and there were no pinholes in this resist pattern. The pattern edges were also found to be sharp.

This resist pattern was heated at 200'C for 1 hour, but no change was observed in the resist pattern.

In addition, a cured polyimide film was prepared by applying a solution of the radiation-sensitive resin composition of this example on another glass substrate in the same manner as above, drying it, irradiating the entire surface with radiation, and heating it at 200°C for 1 hour. When I did a cross-cut test, it did not come off at all. Also dimethylporamide. It is insoluble in almost all organic solvents such as N-methylpyrrolidone and dimethylacetamide, and the resist pattern obtained from the radiation-sensitive resin composition of the present invention has good adhesion, solvent resistance, and heat resistance as in Example 1. It was excellent.

(Effects of the Invention) In the radiation-sensitive resin composition of the present invention, a cured polyimide film with excellent heat resistance and solvent resistance can be formed simply by irradiating with radiation. In addition, since the radiation-sensitive resin composition of the present invention consists essentially of polyimide and an aromatic bisazide compound, when used as a resist, the obtained polyimide cured film has excellent resolution, residual film rate, profile, etc. It can be suitably used as a printed circuit board resist, a solder resist, a metal plate etching resist, and the like. Furthermore, since the cured film obtained from the radiation-sensitive resin composition of the present invention is substantially composed of polyimide, it retains the excellent heat resistance inherent to polyimide. Furthermore, since the radiation-sensitive resin composition of the present invention does not contain polyamic acid as a polyimide precursor, it has various advantages such as excellent storage stability. For this reason, in addition to resists, protective films and insulating films such as junction protective films, alpha ray shield films, multilayer wiring insulating films, glabellar insulating films, liquid crystal alignment films, paints such as photocurable heat-resistant enamel, and photocurable heat-resistant adhesives are used. It can be used for etc.

Claims (1)

[Claims] It consists of a solution obtained by dissolving (A) a polyimide obtained from an aliphatic tetracarboxylic acid or its anhydride and a diamine compound or a diisocyanate compound and (B) an aromatic bisazide compound in a solvent, and the solid content in the solution is 9.
A radiation-sensitive resin composition characterized in that 5% by weight or more is the polyimide (A) and the aromatic bisazide compound (B).