JPS622638A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS622638A JPS622638A JP14214885A JP14214885A JPS622638A JP S622638 A JPS622638 A JP S622638A JP 14214885 A JP14214885 A JP 14214885A JP 14214885 A JP14214885 A JP 14214885A JP S622638 A JPS622638 A JP S622638A
- Authority
- JP
- Japan
- Prior art keywords
- connecting terminals
- external connection
- outer connecting
- semiconductor device
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は半導体装置に関し、詳しくは外部接続端子に改
良を施したＺＩＰ型半導体装置に係わる。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor device, and more particularly to a ZIP type semiconductor device with improved external connection terminals.
従来、ｚＩＰ型半導体装置としては、例えば第２図（畠
）〜（ｃ）に示すものが知られている。ここで、第２図
（、）は正面図、同図（ｂ）は同図（息）の裏面図、同
図（ｃ）は同図（＆）の側面図である。Conventionally, as a zIP type semiconductor device, those shown in FIGS. 2 (Hata) to (c), for example, are known. Here, FIG. 2(,) is a front view, FIG. 2(b) is a back view of the same figure (breath), and FIG. 2(c) is a side view of the same figure (&).
図中の１は、ＩＣ本体である。このＩＣ本体１の底部に
は、複数の外部接続端子２．．２．が千鳥状にその先端
が下方を向いて設けられている。1 in the figure is the IC main body. At the bottom of the IC body 1, there are a plurality of external connection terminals 2. ．． 2. are arranged in a staggered manner with their tips facing downward.
こうした構造の半導体装置をプリント基板に取り付ける
際は、第３図に示す如くプリント基板３に前記外部接続
端子２．．２．に対応した穴４を設け、これら穴４に前
記外部接続端子２．。When attaching a semiconductor device having such a structure to a printed circuit board, the external connection terminals 2 and 3 are attached to the printed circuit board 3 as shown in FIG. ．． 2. Holes 4 corresponding to the external connection terminals 2. are provided in these holes 4. .
２、に差し込むことにより行なっている。This is done by inserting it into 2.
しかしながら、従来の半導体装置によれば、プリント基
板３に複数の穴４を設け、これら穴４に外部接続端子２
．．２．を差し込むようになりているため、外部接続端
子２１１２！のビ、チが前記穴イのピッチに左右され、
外部接続端子２１ ・２禦のピッチを狭くできない。ま
た、プリント基板３に穴４を設けるため、作業性が低い
゛という欠点を有する。However, according to the conventional semiconductor device, a plurality of holes 4 are provided in the printed circuit board 3, and external connection terminals 2 are provided in these holes 4.
．． ．． 2. External connection terminal 2112! The width and width of the hole A depend on the pitch of the hole A,
External connection terminal 21 - The pitch of the two wires cannot be narrowed. Furthermore, since the holes 4 are provided in the printed circuit board 3, there is a drawback that the workability is low.
本発明は上記事情に鑑みてなされたもので、外部接続端
子のピッチを狭くでき、かつプリント基板に従来のよう
に穴を開ける必要のない半導体装置を提供できる。The present invention has been made in view of the above circumstances, and it is possible to provide a semiconductor device in which the pitch of external connection terminals can be narrowed and there is no need to make holes in a printed circuit board as in the past.
本発明は、ＩＣ本体と、このＸＣ本体に千鳥状に設けら
れた複数の外部接続端子とを具備した半導体装置におい
て、前記外部接続端子を夫々平板状でかつ一定位置でほ
ぼ直角に屈曲させたことを特徴とし、外部接続端子のピ
ッチを狭くできるとともに、プリント基板に穴を開ける
作業を省略できる。The present invention provides a semiconductor device comprising an IC body and a plurality of external connection terminals provided in a staggered manner on the XC body, in which each of the external connection terminals is shaped like a flat plate and bent at a substantially right angle at a certain position. This feature allows the pitch of the external connection terminals to be narrowed, and the work of drilling holes in the printed circuit board can be omitted.
以下、本発明の一実施例を第１図（ａ）〜（Ｃ）を参照
して説明する。ここで、第１図（、）は本発明に係る半
導体装置の正面図、同図（ｂ）は同図（、）の裏面図、
同図（ｃ）は同図（、）の側面図である。Hereinafter, one embodiment of the present invention will be described with reference to FIGS. 1(a) to (C). Here, FIG. 1 (,) is a front view of the semiconductor device according to the present invention, FIG. 1 (b) is a back view of the same figure (,),
Figure (c) is a side view of figure (,).
図中の１１は、ＩＣ本体である。このＩＣ本体１１の底
部には、複数の平板状の外部接続端子１２□ 、１２．
が゛千鳥状に設けられている。ここで、一方の外部接続
端子１２．・・・は、一定の位置で例えば矢印Ａ方向に
９０度屈曲している。11 in the figure is an IC main body. At the bottom of the IC body 11, there are a plurality of flat external connection terminals 12□, 12.
are arranged in a staggered manner. Here, one external connection terminal 12. ... is bent at a certain position, for example, by 90 degrees in the direction of arrow A.
また、他方の外部接続端子１２！・・・は、前記と同位
置で矢印Ｂ方向（外部接続端子１２１と逆）Ｋ９０度屈
白している。Also, the other external connection terminal 12! ... is bent by 90 degrees K in the direction of arrow B (opposite to external connection terminal 121) at the same position as above.
こうした構造の半導体装置をプリント基板に取り付ける
際は、第４図に示す如くプリント基板１３に複数の接続
端子１４を設け、これら接続端子１４に前記外部接続端
子１２．．２２゜を接続することにより行５゜
しかして、本発明によれば、ＩＣ本体１１の底部に、複
数の平板状の外部接続端子１２．．１２゜を千鳥状に交
互に外側に９０度屈曲して設けた構造となっているため
、プリント基板１３に従来の如く穴を開けることなく、
外部接続端子１２１ｒ１’＊を容易にプリント基板１３
の接続端子１４に接続できる。従って、外部接続端子１
ｊｌ 、１２．のピッチａを従来と比べ狭くできる。When attaching a semiconductor device having such a structure to a printed circuit board, a plurality of connection terminals 14 are provided on the printed circuit board 13 as shown in FIG. ．． According to the present invention, a plurality of flat external connection terminals 12. ．． Since it has a structure in which 12 degrees are alternately bent outward at 90 degrees in a staggered manner, there is no need to drill holes in the printed circuit board 13 as in the conventional case.
Easily connect the external connection terminal 121r1'* to the printed circuit board 13
It can be connected to the connection terminal 14 of. Therefore, external connection terminal 1
jl, 12. The pitch a can be made narrower than in the past.
また、プリント基板１３に従来のように穴を設ける手間
を省け、作業性がよい。Further, the work required for forming holes in the printed circuit board 13 as in the conventional method can be omitted, resulting in good workability.
なお、上記実施例では外部接続端子を外側に９０度屈曲
させた場合について述べたが、これに限らず、これに近
い角度（好ましくは９０度より若干大きい角度）であれ
ばよい。In the above embodiment, a case was described in which the external connection terminal was bent outward by 90 degrees, but the bending angle is not limited to this, and any angle close to this (preferably slightly larger than 90 degrees) may be used.
以上詳述した如く本発明によれば、従来と比べ外部接続
端子間のピッチを狭くできるとともに、外部接続端子を
容易にプリント基板に接続できる半導体装置を提供でき
る。As described in detail above, according to the present invention, it is possible to provide a semiconductor device in which the pitch between external connection terminals can be narrowed compared to the conventional one, and in which the external connection terminals can be easily connected to a printed circuit board.
第１図（、）は本発明の一実施例に係る半導体装置の正
面図、同図（ｂ）は同図（、）の裏面図、同図（、）は
同図（＆）の側面図、第２図（、）は従来の半導体装置
の正面図、同図（ｂ）は同図（、）の裏面図、同図（Ｃ
）は同図（、）の側面図、第３図は従来の半導体装置を
プリント基板に取付ける状態を説明するための図、第４
図は本発明の半導体装置をプリント基板に取付ける状態
を説明するための図である。
１１・・・ＩＣ本体、１２１．１２．・・・外部接続端
子、１３・・・プリント基板、１４・・・接続端子。
出虎艷人イマ狸Ｋ 毒ニド 斜上ＳＮ彦第１図
第２ 図1(,) is a front view of a semiconductor device according to an embodiment of the present invention, FIG. 1(b) is a back view of the same figure (,), and FIG. 1(,) is a side view of the same figure (&). , Figure 2 (,) is a front view of a conventional semiconductor device, Figure 2 (b) is a back view of Figure 2 (,), Figure 2 (C
) is a side view of the same figure (,), Figure 3 is a diagram for explaining the state in which a conventional semiconductor device is attached to a printed circuit board, and Figure 4 is a side view of the same figure.
The figure is a diagram for explaining how the semiconductor device of the present invention is attached to a printed circuit board. 11...IC body, 121.12. ...External connection terminal, 13...Printed circuit board, 14...Connection terminal. Detora Rinto Ima Tanuki K Poison Nido Slanting SN Hiko Figure 1 Figure 2
Claims (1)
外部接続端子とを具備した半導体装置において、前記外
部接続端子を夫々平板状でかつ一定位置でほぼ直角に屈
曲させたことを特徴とする半導体装置。A semiconductor device comprising an IC body and a plurality of external connection terminals provided in a staggered manner on the IC body, characterized in that each of the external connection terminals is flat and bent at a substantially right angle at a certain position. semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14214885A JPS622638A (en) | 1985-06-28 | 1985-06-28 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14214885A JPS622638A (en) | 1985-06-28 | 1985-06-28 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS622638A true JPS622638A (en) | 1987-01-08 |
Family
ID=15308478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14214885A Pending JPS622638A (en) | 1985-06-28 | 1985-06-28 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS622638A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62136060A (en) * | 1985-12-09 | 1987-06-19 | Mitsubishi Electric Corp | Semiconductor device |
| JPH01187960A (en) * | 1988-01-22 | 1989-07-27 | Mitsubishi Electric Corp | Semiconductor device |
| JPH0227740U (en) * | 1988-08-12 | 1990-02-22 | ||
| JPH07115162A (en) * | 1993-10-14 | 1995-05-02 | Nec Corp | Surface-mount type semiconductor device |
| US5630270A (en) * | 1994-03-03 | 1997-05-20 | Alcatel Network Systems, Inc. | Circuit board identification method |
-
1985
- 1985-06-28 JP JP14214885A patent/JPS622638A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62136060A (en) * | 1985-12-09 | 1987-06-19 | Mitsubishi Electric Corp | Semiconductor device |
| JPH01187960A (en) * | 1988-01-22 | 1989-07-27 | Mitsubishi Electric Corp | Semiconductor device |
| JPH0227740U (en) * | 1988-08-12 | 1990-02-22 | ||
| JPH07115162A (en) * | 1993-10-14 | 1995-05-02 | Nec Corp | Surface-mount type semiconductor device |
| US5630270A (en) * | 1994-03-03 | 1997-05-20 | Alcatel Network Systems, Inc. | Circuit board identification method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS622638A (en) | Semiconductor device | |
| JPS60160089A (en) | Connection cartridge for integrated circuit memory card | |
| JPH09307208A (en) | Connecting end part structure of flexible printed board | |
| JPH06310827A (en) | Surface mounting component arrangement structure | |
| JPS63128654A (en) | Semiconductor device mounting body | |
| JPS62134945A (en) | Molded transistor | |
| JPH0353313Y2 (en) | ||
| JPS6018566U (en) | Connection positioning structure between circuit boards | |
| JPS633194Y2 (en) | ||
| JPH0431742Y2 (en) | ||
| JPH0529508Y2 (en) | ||
| JPS5811027Y2 (en) | connector | |
| JPH02199856A (en) | Package for ic | |
| JPS585753U (en) | Thermal head with wiring pattern | |
| JPS6026778U (en) | right angle pin header | |
| JPS59161892A (en) | Pattern circuit board | |
| JPS6145957B2 (en) | ||
| JPH01179491A (en) | Circuit substrate | |
| JPS59170873U (en) | Electrical components with multiple terminals | |
| JPS6076156A (en) | Connecting terminal for integrated circuit | |
| JPS6138952U (en) | electronic components | |
| JPS6260861B2 (en) | ||
| JPS5968993A (en) | Device for mounting lead wire on transistor or other semico-nductor | |
| JPH01106077U (en) | ||
| JPS58184787U (en) | flexible cable |