JPS62256781A - 金属被膜の形成方法 - Google Patents

金属被膜の形成方法

Info

Publication number
JPS62256781A
JPS62256781A JP9878886A JP9878886A JPS62256781A JP S62256781 A JPS62256781 A JP S62256781A JP 9878886 A JP9878886 A JP 9878886A JP 9878886 A JP9878886 A JP 9878886A JP S62256781 A JPS62256781 A JP S62256781A
Authority
JP
Japan
Prior art keywords
powder
silicate
metal coating
substrate
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9878886A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0455153B2 (forum.php
Inventor
浩造 松本
静安 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP9878886A priority Critical patent/JPS62256781A/ja
Publication of JPS62256781A publication Critical patent/JPS62256781A/ja
Publication of JPH0455153B2 publication Critical patent/JPH0455153B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Ceramic Products (AREA)
  • Chemically Coating (AREA)
JP9878886A 1986-04-28 1986-04-28 金属被膜の形成方法 Granted JPS62256781A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9878886A JPS62256781A (ja) 1986-04-28 1986-04-28 金属被膜の形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9878886A JPS62256781A (ja) 1986-04-28 1986-04-28 金属被膜の形成方法

Publications (2)

Publication Number Publication Date
JPS62256781A true JPS62256781A (ja) 1987-11-09
JPH0455153B2 JPH0455153B2 (forum.php) 1992-09-02

Family

ID=14229109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9878886A Granted JPS62256781A (ja) 1986-04-28 1986-04-28 金属被膜の形成方法

Country Status (1)

Country Link
JP (1) JPS62256781A (forum.php)

Also Published As

Publication number Publication date
JPH0455153B2 (forum.php) 1992-09-02

Similar Documents

Publication Publication Date Title
EP0153737B1 (en) Circuit substrate having high thermal conductivity
JPS5921032A (ja) 半導体装置用基板
US4901137A (en) Electronic apparatus having semiconductor device
JP3834351B2 (ja) セラミックス回路基板
JP2001332854A (ja) セラミックス回路基板
JPH0679989B2 (ja) 窒化アルミニウム上の銅電極形成法
JPS61281089A (ja) 窒化アルミニウム製基材の表面構造
JPH0323512B2 (forum.php)
JPH0243700B2 (forum.php)
JP3183090B2 (ja) パッケージ用セラミックスリッド
JPH0570954B2 (forum.php)
JPS61119094A (ja) 高熱伝導性回路基板の製造方法
JPS62256781A (ja) 金属被膜の形成方法
JP2000086368A (ja) 窒化物セラミックス基板
JPS5933851A (ja) 気密封止半導体容器
JPS5961054A (ja) 半導体装置
JPS62297286A (ja) 窒化アルミニウムセラミツクスのメタライズ方法
JPS61281074A (ja) メタライズ用高熱伝導性窒化アルミニウム焼結体
JPS60107845A (ja) 半導体用回路基板
JPS60136390A (ja) セラミツクモジユ−ル
JPH04218950A (ja) ＡｌＮ基板
JPH02240995A (ja) 電子部品実装用セラミックス基板
JPS63115393A (ja) 高熱伝導性回路基板
JPH08125310A (ja) セラミックプリント配線板及びその製造方法
JPH0283255A (ja) ムライト系セラミツク材料を用いた多層回路板及び半導体モジュール