JPS62247597A - 絶縁層の構造 - Google Patents

絶縁層の構造

Info

Publication number
JPS62247597A
JPS62247597A JP8921986A JP8921986A JPS62247597A JP S62247597 A JPS62247597 A JP S62247597A JP 8921986 A JP8921986 A JP 8921986A JP 8921986 A JP8921986 A JP 8921986A JP S62247597 A JPS62247597 A JP S62247597A
Authority
JP
Japan
Prior art keywords
polyimide film
insulating layer
filler
film
photosensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8921986A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0546998B2 (enrdf_load_stackoverflow
Inventor
光 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP8921986A priority Critical patent/JPS62247597A/ja
Publication of JPS62247597A publication Critical patent/JPS62247597A/ja
Publication of JPH0546998B2 publication Critical patent/JPH0546998B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP8921986A 1986-04-19 1986-04-19 絶縁層の構造 Granted JPS62247597A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8921986A JPS62247597A (ja) 1986-04-19 1986-04-19 絶縁層の構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8921986A JPS62247597A (ja) 1986-04-19 1986-04-19 絶縁層の構造

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP231793A Division JPH0831696B2 (ja) 1993-01-11 1993-01-11 絶縁層の構造

Publications (2)

Publication Number Publication Date
JPS62247597A true JPS62247597A (ja) 1987-10-28
JPH0546998B2 JPH0546998B2 (enrdf_load_stackoverflow) 1993-07-15

Family

ID=13964614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8921986A Granted JPS62247597A (ja) 1986-04-19 1986-04-19 絶縁層の構造

Country Status (1)

Country Link
JP (1) JPS62247597A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0298995A (ja) * 1988-10-06 1990-04-11 Ibiden Co Ltd 多層配線板の製造方法
JPH03276794A (ja) * 1990-03-27 1991-12-06 Fujitsu Ltd 回路基板
JPH04103196A (ja) * 1990-08-23 1992-04-06 Nec Corp 高密度多層配線基板のコーティング方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101525664B1 (ko) * 2013-06-12 2015-06-03 현대중공업 주식회사 액화가스 처리 시스템 및 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52149358A (en) * 1976-06-08 1977-12-12 Fujitsu Ltd Multilayer wiring method
JPS55105399A (en) * 1979-02-08 1980-08-12 Cho Lsi Gijutsu Kenkyu Kumiai Multilayer wired circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52149358A (en) * 1976-06-08 1977-12-12 Fujitsu Ltd Multilayer wiring method
JPS55105399A (en) * 1979-02-08 1980-08-12 Cho Lsi Gijutsu Kenkyu Kumiai Multilayer wired circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0298995A (ja) * 1988-10-06 1990-04-11 Ibiden Co Ltd 多層配線板の製造方法
JPH03276794A (ja) * 1990-03-27 1991-12-06 Fujitsu Ltd 回路基板
JPH04103196A (ja) * 1990-08-23 1992-04-06 Nec Corp 高密度多層配線基板のコーティング方法

Also Published As

Publication number Publication date
JPH0546998B2 (enrdf_load_stackoverflow) 1993-07-15

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term