JPS62232137A - Position aligning method - Google Patents

Position aligning method

Info

Publication number
JPS62232137A
JPS62232137A JP7241886A JP7241886A JPS62232137A JP S62232137 A JPS62232137 A JP S62232137A JP 7241886 A JP7241886 A JP 7241886A JP 7241886 A JP7241886 A JP 7241886A JP S62232137 A JPS62232137 A JP S62232137A
Authority
JP
Japan
Prior art keywords
image
deviating
computed
camera
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP7241886A
Other languages
Japanese (ja)
Other versions
JPH0652755B2 (en
Inventor
Yuji Yasufuku
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP61072418A priority Critical patent/JPH0652755B2/en
Priority claimed from US07/031,134 external-priority patent/US4870288A/en
Publication of JPS62232137A publication Critical patent/JPS62232137A/en
Publication of JPH0652755B2 publication Critical patent/JPH0652755B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE: To perform position alignment at a specified aligning accuracy in a short time, by performing θ alignment of a planar body such as a wafer, which has a suitable pattern on its surface, by an image recognizing device and the like, thereby automating the θ alignment.
CONSTITUTION: An (x) stage 1 is moved, and an image, which is taken by a camera 8, is compared with an image, which is stored before, in an image recognizing device. Thus deviating amounts Δx1 and Δy1 in the directions (x) and (y) are obtained. A deviating amount θ1 between a moving direction 39 of the (x) stage 1 and a scribing line in the direction of the (x) axis of a wafer 4 can be computed based on the deviating amounts Δx1 and Δy1. When the (x) stage 1 is moved more than a position 34, coordinates X2 and Y2 of the position 37, at which the camera 8 arrives, are computed by using the value of θ1. The (x) and (y) stages are moved to the position 37, and the image taken by the camera 8 is compared with the image stored before, and deviating amounts Δ2 and Δy2 are obtained. When θ1 is a correct value, the camera 8 takes the same image at a position 31, which is stored before, at a position 33. Based on the deviating amounts Δx2 and Δy2, actual deviating amout θ2 between the moving direction 39 of the (x) stage and the scribing line of the wafer 4 is computed. A chuck 3 is rotated by the computed devaiting amount θ2.
COPYRIGHT: (C)1987,JPO&Japio
JP61072418A 1986-04-01 1986-04-01 Alignment method Expired - Fee Related JPH0652755B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61072418A JPH0652755B2 (en) 1986-04-01 1986-04-01 Alignment method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP61072418A JPH0652755B2 (en) 1986-04-01 1986-04-01 Alignment method
US07/031,134 US4870288A (en) 1986-04-01 1987-03-30 Alignment method

Publications (2)

Publication Number Publication Date
JPS62232137A true JPS62232137A (en) 1987-10-12
JPH0652755B2 JPH0652755B2 (en) 1994-07-06

Family

ID=13488713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61072418A Expired - Fee Related JPH0652755B2 (en) 1986-04-01 1986-04-01 Alignment method

Country Status (1)

Country Link
JP (1) JPH0652755B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3028307U (en) * 1996-02-23 1996-09-03 伸昭 篠田 Zipper gloves

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5886739A (en) * 1981-11-19 1983-05-24 Nippon Telegr & Teleph Corp <Ntt> Automatically positioning method for wafer
JPS5923467A (en) * 1982-07-29 1984-02-06 Shin Kobe Electric Mach Co Ltd Manufacture of sealed type nickel cadmium storage battery anode plate
JPS60254743A (en) * 1984-05-31 1985-12-16 Fujitsu Ltd Position detecting method of semiconductor chip

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5886739A (en) * 1981-11-19 1983-05-24 Nippon Telegr & Teleph Corp <Ntt> Automatically positioning method for wafer
JPS5923467A (en) * 1982-07-29 1984-02-06 Shin Kobe Electric Mach Co Ltd Manufacture of sealed type nickel cadmium storage battery anode plate
JPS60254743A (en) * 1984-05-31 1985-12-16 Fujitsu Ltd Position detecting method of semiconductor chip

Also Published As

Publication number Publication date
JPH0652755B2 (en) 1994-07-06

Similar Documents

Publication Publication Date Title
JPH01253247A (en) Die positioning method and device
JPS62232137A (en) Position aligning method
JPS631034A (en) Simulation method
JPS63140548A (en) Alignment method of planar object
JPH0350752A (en) Wafer aligning method and device
JPH04290455A (en) Wafer prealignment system
JPS60207350A (en) Adjusting method of wafer dicing line angle
JPS5553418A (en) Semiconductor wafer positioning
JPH01184824A (en) Positioning method
JPS60245134A (en) Positioning device
JPH03228308A (en) Alignment process
JPH01103292A (en) Camera mounting method to robot
JPS638618A (en) Focused point detecting method
JPH02202012A (en) Charged particle beam lithography device
JPS62183517A (en) Exposure apparatus
JPS63170968A (en) Semiconductor device and its manufacture
JPS63128639A (en) Prealignment method
JPS62299029A (en) Aligner
JPH04233250A (en) Semiconductor dicing equipment
JPH02210815A (en) Forming method of resist pattern
JPH04174305A (en) Coordinate conversion system of measuring apparatus
JPH03236243A (en) Method for determining position of chip of semiconductor wafer
JPS57198641A (en) Pattern detection
JPS63313820A (en) Manufacture of semiconductor device
JPH03272151A (en) Correction of position of wire bonding device

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees