JPS62216340A - Manufacture of hoop material with integrated circuit element - Google Patents
Manufacture of hoop material with integrated circuit elementInfo
- Publication number
- JPS62216340A JPS62216340A JP61060041A JP6004186A JPS62216340A JP S62216340 A JPS62216340 A JP S62216340A JP 61060041 A JP61060041 A JP 61060041A JP 6004186 A JP6004186 A JP 6004186A JP S62216340 A JPS62216340 A JP S62216340A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- integrated circuit
- strip
- group
- pieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims description 15
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000005520 cutting process Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 12
- 230000002950 deficient Effects 0.000 claims description 9
- 239000011295 pitch Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 238000011990 functional testing Methods 0.000 claims description 3
- 238000007689 inspection Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
この発明は、導電材料製の帯状体に長手方向に等ピッチ
で端子片群が一体に設けられ、各端子片群に集積回路素
子が夫々一体に接続固定されている集積回路素子付フー
プ材の製造方法に関するものである。[Detailed Description of the Invention] (Industrial Application Field) This invention provides a strip-shaped body made of a conductive material, in which groups of terminal pieces are integrally provided at equal pitches in the longitudinal direction, and each group of terminal pieces has an integrated circuit element. The present invention relates to a method of manufacturing a hoop material with an integrated circuit element that is integrally connected and fixed.
(従来の技術)
従来、集積回路素子に端子を取り付ける方法としては、
例えば、導電材料製の帯状体を成形加工して、所定本数
一組の端子片群を帯状体に長手方向に等ピッチで順次形
成し、この各端子片群に集積回路素子を順次接続固定さ
せる様にした取り付は方法がある。この様にして端子片
が取り付けられた集積回路素子は、端子の基部の部分で
帯状体から切断分離されて、次の検査工程に送られ、正
常に動作するか否かの機能検査が行われていた。(Prior art) Conventionally, the methods for attaching terminals to integrated circuit elements are as follows:
For example, a strip made of a conductive material is molded, a predetermined number of groups of terminal strips are sequentially formed on the strip at equal pitches in the longitudinal direction, and integrated circuit elements are sequentially connected and fixed to each group of terminal strips. There is a way to install it in such a way. The integrated circuit element with the terminal piece attached in this way is cut and separated from the strip at the base of the terminal and sent to the next inspection process, where a functional test is performed to determine whether it operates normally. was.
そして、この検査工程で不良品は除去され、残りの正常
な集積回路素子がまとめて部品管理されていた。In this inspection process, defective products are removed, and the remaining normal integrated circuit elements are collectively managed.
(発明が解決しようとする問題点)
しかしながら、この様に分離した集積回路素子を検査す
る場合には、集積回路素子を所定姿勢で検査装置に供給
しなければならず、その供給装置が複雑且つ高価となり
、余り好ましいものではなかった。しかも、この様に集
積回路素子を分離して管理した場合には、部品管理が容
易でないという問題があった。(Problems to be Solved by the Invention) However, when testing separated integrated circuit elements in this way, the integrated circuit elements must be fed to the testing equipment in a predetermined posture, and the feeding equipment is complicated and It was expensive and not very desirable. Moreover, when integrated circuit elements are managed separately in this way, there is a problem that component management is not easy.
また、この様にして部品管理された集積回路素子をプリ
ント基板に組付ける電子部品自動組付装置が従来からあ
るが、集積回路素子を電子部品自動組付装置に供給する
場合も、集積回路素子を所定姿勢で整列させて供給する
必要があるため、その供給のための装置も複雑且つ高価
となり、好ましいものではなかった。In addition, although there have been conventional electronic component automatic assembly equipment that assembles integrated circuit elements whose components have been managed in this way onto printed circuit boards, when supplying integrated circuit elements to an electronic component automatic assembly equipment, integrated circuit elements Since it is necessary to line up the materials in a predetermined posture and supply them, the device for supplying them is also complicated and expensive, which is not desirable.
そこで、この発明は、集積回路素子の部品管理が容易で
、検査装置や電子部品自動組付装置への集積@路素子の
供給を容易に行うことができる集積回路素子付フープ材
の製造方法を提供することを目的とするものである。Therefore, the present invention provides a method for manufacturing a hoop material with integrated circuit elements, which allows easy component management of integrated circuit elements and facilitates the supply of integrated circuit elements to inspection equipment and automatic electronic component assembly equipment. The purpose is to provide
(問題点を解決するための手段)
この目的を達成するため、この発明は、所定本数一組の
端子片群が長手方向に等ピッチで多数一体に形成され且
つ前記各端子片群に集積回路素子が夫々一体に接続固定
された導電材料製の帯状体を設けて、前記各端子片群の
うちアース端子又は遊び端子以外の機能端子を前記帯状
体側基部から切断分離した後、前記各端子片群を用いて
前記各集積回路素子の機能検査を順次行い、この検査に
より不良品と判定された集積回路素子を前記帯状体から
除去する集積回路素子付フープ材の製造方法としたこと
を特徴とするものである。(Means for Solving the Problems) In order to achieve this object, the present invention provides a method in which a predetermined number of terminal strip groups are integrally formed at equal pitches in the longitudinal direction, and are integrated into each terminal strip group. After providing a band-shaped body made of a conductive material to which circuit elements are connected and fixed to each other, and cutting and separating the functional terminals other than the ground terminal or idle terminal from the base of the band-shaped body side among the terminal piece groups, each of the terminals is separated. A method for manufacturing a hoop material with an integrated circuit element is characterized in that a functional test is sequentially performed on each of the integrated circuit elements using a group of pieces, and integrated circuit elements determined to be defective by the test are removed from the strip. That is.
(作 用)
この方法によって形成された集積回路素子付フープ材を
電子部品供給装置に供給することにより、集積回路素子
は順次所定姿勢で電子部品供給装置に供給されることに
なるので、集積回路素子を所定姿勢にするための装置は
不要となる。しかも、多数の集積回路素子のうち良品の
みを帯状体に取り付けた集積回路素子付フープ材としあ
るので、多数の集積回路素子の管理も容易である。(Function) By supplying the hoop material with integrated circuit elements formed by this method to the electronic component supply apparatus, the integrated circuit elements are sequentially supplied to the electronic component supply apparatus in a predetermined posture. A device for placing the element in a predetermined posture is not required. In addition, since the hoop material with integrated circuit elements is formed by attaching only non-defective integrated circuit elements to the strip, it is easy to manage the large number of integrated circuit elements.
(実施例) 以下、この発明の実施例を図面に基づいて説明する。(Example) Embodiments of the present invention will be described below based on the drawings.
第1図において、導電材料製の帯状体1の図中左側に連
設されている図示しない部分は、材料供給装置(図示せ
ず)にロール状態で装着されている。In FIG. 1, a portion (not shown) of a strip 1 made of a conductive material that is continuous to the left side of the drawing is attached in a rolled state to a material supply device (not shown).
このロールされた帯状体1は、先ず、材料供給装置から
間欠的にプレス打抜装置2に供給される。This rolled strip 1 is first intermittently supplied to a press punching device 2 from a material supply device.
このプレス打抜装置2は、所定本数一組の端子片群3を
帯状体1の一側に長手方向に等ピッチで順次形成する。This press punching device 2 sequentially forms a predetermined number of terminal pieces 3 on one side of the strip 1 at equal pitches in the longitudinal direction.
この端子片群3は第2図に示した如く左右のアース端子
片4,5と中央の機能端子片6,7,8.9から構成さ
れている。As shown in FIG. 2, this terminal piece group 3 is composed of left and right ground terminal pieces 4, 5 and a central functional terminal piece 6, 7, 8.9.
この様にして形成された帯状体1の端子片群3は端子接
続装置10に送られ、この端子接続装置10はアース端
子片4,5及び機能端子片6,7,8.9を集積回路素
子11の所定の部分に圧着して半田付する。The terminal strip group 3 of the strip-shaped body 1 formed in this way is sent to a terminal connecting device 10, and this terminal connecting device 10 connects the ground terminal strips 4, 5 and the functional terminal strips 6, 7, 8, 9 to an integrated circuit. It is crimped and soldered to a predetermined portion of the element 11.
この集積回路素子11及び此れが取り付けられた端子片
群3は端子切断分離装置12に供給され、この端子切断
分離装置12は第3図の如く端子片群3のうち機能端子
片6,7,8.9を基部の部分で帯状体1から切断分離
する。この状態では集積回路素子11は、左右のアース
端子片4,5で帯状体1に支持されているので、帯状体
1に対する捻じれも生じにくい状態となっている。This integrated circuit element 11 and the terminal strip group 3 to which it is attached are supplied to a terminal cutting/separating device 12, and this terminal cutting/separating device 12 is configured to operate the functional terminal strips 6, 7 of the terminal strip group 3 as shown in FIG. , 8.9 are cut and separated from the strip 1 at the base portion. In this state, the integrated circuit element 11 is supported by the strip 1 by the left and right ground terminal pieces 4 and 5, so that twisting of the strip 1 is less likely to occur.
=4=
この様にして機能端子片6,7,8.9が切断された端
子片群3及び集積回路素子11は検査装置13に供給さ
れる。この検査袋[13は、接触子14,15,16゜
17、18を帯状体1及び機能端子片6,7,8.9に
接触させた後、中央演算処理装置19及び入出力袋W2
0により集積回路素子11が正常に動作しているか否か
を検査する。=4= The terminal strip group 3 and the integrated circuit element 11 from which the functional terminal strips 6, 7, 8.9 have been cut in this manner are supplied to the inspection device 13. After this inspection bag [13 has brought the contacts 14, 15, 16, 17, 18 into contact with the strip 1 and the functional terminal pieces 6, 7, 8.9, the central processing unit 19 and the input/output bag W2
0, it is checked whether the integrated circuit element 11 is operating normally.
そして、この検査装置13の中央演算処理装置19は、
集積回路素子11が良品か不良品かを判定して、その結
果を表示器21に表示させる。ここで、集積回路素子1
1が不良品と判定されると、中央演算処理装置19は素
子除去装置22に不良な集積回路素子11が素子除去装
置22に供給されたときに作動する動作信号を送る。こ
れにより、不良な集積回路素子11が素子除去装置22
に供給されると、この素子除去装置22は集積回路素子
11の切断されていないアース端子片4,5を帯状体1
から切断して集積回路素子11を帯状体1から除去する
。従って、帯状体1には多数の集積回路素子11のうち
良品のみが残されることになるので、この帯状体1をフ
ープ状に捲回することにより、多数の集積回路素子11
を容易に管理できる。尚、図中18は帯状体1の長手方
向に等ピッチで形成された送り孔である。The central processing unit 19 of this inspection device 13 is
It is determined whether the integrated circuit element 11 is a good product or a defective product, and the result is displayed on a display 21. Here, integrated circuit element 1
1 is determined to be a defective product, the central processing unit 19 sends an operation signal to the device removal device 22 that is activated when the defective integrated circuit device 11 is supplied to the device removal device 22. As a result, the defective integrated circuit element 11 is removed from the element removal device 22.
, the device removing device 22 removes the uncut ground terminal pieces 4 and 5 of the integrated circuit device 11 from the strip 1.
The integrated circuit element 11 is removed from the strip 1 by cutting. Therefore, only good products among the large number of integrated circuit elements 11 are left on the strip 1, so by winding the band 1 into a hoop shape, a large number of integrated circuit elements 11 are left on the strip 1.
can be easily managed. In the figure, reference numeral 18 denotes feed holes formed at equal pitches in the longitudinal direction of the strip 1.
この方法によって形成された集積回路素子付フープ材を
電子部品供給装置に供給することにより、集積回路素子
は順次所定姿勢で電子部品供給装置に供給されることに
なるので、集積回路素子を所定姿勢にするための装置は
不要となる。By supplying the hoop material with integrated circuit elements formed by this method to the electronic component supply apparatus, the integrated circuit elements are sequentially supplied to the electronic component supply apparatus in a predetermined posture. There is no need for any equipment to do this.
尚、以上説明した実施例では、アース端子4,5を切断
せずに帯状体1に一体に設けるようにしたが、必ずしも
此れに限定されるものではない。例えば、プリント基板
に安定支持させるためにのみ使用する遊び端子を集積回
路素子に設けて、この遊び端子をアース端子4,5に代
えて帯状体1に切断せずに一体に設けておくようにして
もよい。In the embodiments described above, the ground terminals 4 and 5 are integrally provided on the strip 1 without being cut, but the present invention is not necessarily limited to this. For example, an idle terminal used only for stably supporting the printed circuit board may be provided on the integrated circuit element, and the idle terminal may be provided integrally with the strip 1 instead of being cut into the ground terminals 4 and 5. It's okay.
また、以上説明した実施例では、本発明の製造方法を「
−側にのみ端子片群を接続した装積回路素子付のフープ
材」の製造に適用した例を示したが、「端子片群を両側
に接続したタイプの集積回路素子術のフープ材の製造」
に本発明の製造方法を適用しても良いことは勿論である
。In addition, in the examples described above, the manufacturing method of the present invention is described as “
An example was shown in which it was applied to the manufacture of a hoop material with an integrated circuit element in which a group of terminal strips were connected only on the negative side, but it was applied to the manufacturing of a hoop material for an integrated circuit device with a group of terminal strips connected on both sides. ”
Of course, the manufacturing method of the present invention may be applied to.
(発明の効果)
この発明は、以上説明したように、所定本数一組の端子
片群が長手方向に等ピッチで多数一体に形成され且つ前
記各端子片群に集積回路素子が夫々一体に接続固定され
た導電材料製の帯状体を設けて、前記各端子片群のうち
アース端子又は遊び端子以外の機能端子を前記帯状体側
基部から切断分離した後、前記各端子片群を用いて前記
各集積回路素子の機能検査を順次行い、この検査により
不良品と判定された集積回路素子を前記帯状体から除去
する集積回路素子付フープ材の製造方法としたので、集
積回路素子の部品管理が容易で、検査装置や電子部品自
動組付装置への集積回路素子の供給を容易に行うことが
できる。(Effects of the Invention) As explained above, the present invention provides a method in which a predetermined number of terminal strip groups are integrally formed at equal pitches in the longitudinal direction, and an integrated circuit element is integrally formed in each of the terminal strip groups. After providing a fixedly connected strip made of a conductive material and cutting and separating the functional terminals other than the ground terminal or idle terminal from the strip-side base of each of the terminal strip groups, use each of the terminal strip groups to Since the method for manufacturing the hoop material with integrated circuit elements is such that the function of each integrated circuit element is sequentially inspected and the integrated circuit elements determined to be defective by this inspection are removed from the strip, the parts management of the integrated circuit elements is simplified. This makes it easy to supply integrated circuit elements to inspection equipment and electronic component automatic assembly equipment.
第1図はこの発明に係る集積回路素子付フープ材の製造
方法の説明図、第2図は第1図の部分拡大図、第3図は
第1図に示した検査装置の説明図である。
1・・・帯状体
3・・・端子片群
4.5・・・アース端子片
6.7,8.9・・・機能端子片
11・・・集積回路素子
=8−FIG. 1 is an explanatory diagram of a method for manufacturing a hoop material with an integrated circuit element according to the present invention, FIG. 2 is a partially enlarged view of FIG. 1, and FIG. 3 is an explanatory diagram of the inspection apparatus shown in FIG. 1. . 1... Band-shaped body 3... Terminal piece group 4.5... Earth terminal piece 6.7, 8.9... Functional terminal piece 11... Integrated circuit element = 8-
Claims (1)
体に形成され且つ前記各端子片群に集積回路素子が夫々
一体に接続固定された導電材料製の帯状体を設けて、前
記各端子片群のうちアース端子又は遊び端子以外の機能
端子を前記帯状体側基部から切断分離した後、前記各端
子片群を用いて前記各集積回路素子の機能検査を順次行
い、この検査により不良品と判定された集積回路素子を
前記帯状体から除去することを特徴とする集積回路素子
付フープ材の製造方法。A belt-shaped body made of a conductive material is provided, in which a predetermined number of terminal strip groups are integrally formed at equal pitches in the longitudinal direction, and each terminal strip group is integrally connected and fixed with an integrated circuit element. After cutting and separating the functional terminals other than the ground terminal or idle terminal from the base of the strip-shaped body in each group of terminal strips, a functional test of each integrated circuit element is sequentially performed using each group of terminal strips. A method for manufacturing a hoop material with an integrated circuit element, characterized in that integrated circuit elements determined to be non-defective are removed from the strip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61060041A JPS62216340A (en) | 1986-03-18 | 1986-03-18 | Manufacture of hoop material with integrated circuit element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61060041A JPS62216340A (en) | 1986-03-18 | 1986-03-18 | Manufacture of hoop material with integrated circuit element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62216340A true JPS62216340A (en) | 1987-09-22 |
Family
ID=13130593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61060041A Pending JPS62216340A (en) | 1986-03-18 | 1986-03-18 | Manufacture of hoop material with integrated circuit element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62216340A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5533014A (en) * | 1978-08-29 | 1980-03-08 | Towa Electric | Method of and device for automatically sorting and picking up electric part |
-
1986
- 1986-03-18 JP JP61060041A patent/JPS62216340A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5533014A (en) * | 1978-08-29 | 1980-03-08 | Towa Electric | Method of and device for automatically sorting and picking up electric part |
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