JPS6221550U - - Google Patents

Info

Publication number
JPS6221550U
JPS6221550U JP11275185U JP11275185U JPS6221550U JP S6221550 U JPS6221550 U JP S6221550U JP 11275185 U JP11275185 U JP 11275185U JP 11275185 U JP11275185 U JP 11275185U JP S6221550 U JPS6221550 U JP S6221550U
Authority
JP
Japan
Prior art keywords
area
widened
semiconductor integrated
wiring material
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11275185U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11275185U priority Critical patent/JPS6221550U/ja
Publication of JPS6221550U publication Critical patent/JPS6221550U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP11275185U 1985-07-22 1985-07-22 Pending JPS6221550U (US06168776-20010102-C00041.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11275185U JPS6221550U (US06168776-20010102-C00041.png) 1985-07-22 1985-07-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11275185U JPS6221550U (US06168776-20010102-C00041.png) 1985-07-22 1985-07-22

Publications (1)

Publication Number Publication Date
JPS6221550U true JPS6221550U (US06168776-20010102-C00041.png) 1987-02-09

Family

ID=30993914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11275185U Pending JPS6221550U (US06168776-20010102-C00041.png) 1985-07-22 1985-07-22

Country Status (1)

Country Link
JP (1) JPS6221550U (US06168776-20010102-C00041.png)

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