JPS622107A - Thin film inspection and its apparatus - Google Patents

Thin film inspection and its apparatus

Info

Publication number
JPS622107A
JPS622107A JP14053485A JP14053485A JPS622107A JP S622107 A JPS622107 A JP S622107A JP 14053485 A JP14053485 A JP 14053485A JP 14053485 A JP14053485 A JP 14053485A JP S622107 A JPS622107 A JP S622107A
Authority
JP
Japan
Prior art keywords
light
wafer
observation
operator
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14053485A
Other languages
Japanese (ja)
Inventor
Hiroshi Inoue
Nobushi Suzuki
Yukihiro Goto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP14053485A priority Critical patent/JPS622107A/en
Publication of JPS622107A publication Critical patent/JPS622107A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To enable accurate and rapid inspection, by detecting a recessed part of a thin film by reflecting scattering light and by detecting ununiform film thicknesses by intensities of their positive reflected beams of light by projecting scattering light of narrow band wave length.
CONSTITUTION: A beam of observation light 4 is projected onto the surface of a wafer 1 obliquely downward for observation of scattering light beams 8 by the beam of observation light 4. If a recessed part 18 is found on the surface of the wafer 1 due to misaligned focus, etc., the observation light is scattered and an operator 10 can detect it as a local bright point and ununiform glare. Next, in case of inspection by a positive reflected beam a beam of the narrow bond wave length is emitted from the No.2 protector 3 to be scattered by a reflecting diffusing surface 12 and the beam is projected onto the wafer 1 as the No.2 observation beam to be observed by the operator 10 after positive reflection. If the positive reflected beam 16 causes 'ununiformity' of thickness on a resist film on the wafer 1 by interference of the thin film on the wafer 1, brightness of the interference light is observed in a different, enabling the operator to detect 'ununiformity of resist'.
COPYRIGHT: (C)1987,JPO&Japio
JP14053485A 1985-06-28 1985-06-28 Thin film inspection and its apparatus Pending JPS622107A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14053485A JPS622107A (en) 1985-06-28 1985-06-28 Thin film inspection and its apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14053485A JPS622107A (en) 1985-06-28 1985-06-28 Thin film inspection and its apparatus

Publications (1)

Publication Number Publication Date
JPS622107A true JPS622107A (en) 1987-01-08

Family

ID=15270905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14053485A Pending JPS622107A (en) 1985-06-28 1985-06-28 Thin film inspection and its apparatus

Country Status (1)

Country Link
JP (1) JPS622107A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02189447A (en) * 1989-01-18 1990-07-25 Nippon Columbia Co Ltd Inspecting method of defect of substrate surface and illuminating device
JPH04137050U (en) * 1991-06-18 1992-12-21
US5729343A (en) * 1995-11-16 1998-03-17 Nikon Precision Inc. Film thickness measurement apparatus with tilting stage and method of operation
JPH11351830A (en) * 1998-06-05 1999-12-24 Dainippon Printing Co Ltd Method for inspecting film thickness unevenness of coating material

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02189447A (en) * 1989-01-18 1990-07-25 Nippon Columbia Co Ltd Inspecting method of defect of substrate surface and illuminating device
JPH04137050U (en) * 1991-06-18 1992-12-21
US5729343A (en) * 1995-11-16 1998-03-17 Nikon Precision Inc. Film thickness measurement apparatus with tilting stage and method of operation
JPH11351830A (en) * 1998-06-05 1999-12-24 Dainippon Printing Co Ltd Method for inspecting film thickness unevenness of coating material

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