JPS62190357U - - Google Patents
Info
- Publication number
- JPS62190357U JPS62190357U JP1986077889U JP7788986U JPS62190357U JP S62190357 U JPS62190357 U JP S62190357U JP 1986077889 U JP1986077889 U JP 1986077889U JP 7788986 U JP7788986 U JP 7788986U JP S62190357 U JPS62190357 U JP S62190357U
- Authority
- JP
- Japan
- Prior art keywords
- fluid
- face
- rectifying
- semiconductor
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000005219 brazing Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986077889U JPS62190357U (US07576130-20090818-C00114.png) | 1986-05-23 | 1986-05-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986077889U JPS62190357U (US07576130-20090818-C00114.png) | 1986-05-23 | 1986-05-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62190357U true JPS62190357U (US07576130-20090818-C00114.png) | 1987-12-03 |
Family
ID=30926321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986077889U Pending JPS62190357U (US07576130-20090818-C00114.png) | 1986-05-23 | 1986-05-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62190357U (US07576130-20090818-C00114.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6029225A (ja) * | 1983-07-20 | 1985-02-14 | Toshiba Corp | ワイヤ放電加工機における加工液衝突位置検出装置 |
-
1986
- 1986-05-23 JP JP1986077889U patent/JPS62190357U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6029225A (ja) * | 1983-07-20 | 1985-02-14 | Toshiba Corp | ワイヤ放電加工機における加工液衝突位置検出装置 |
