JPS62188163U - - Google Patents
Info
- Publication number
- JPS62188163U JPS62188163U JP7712986U JP7712986U JPS62188163U JP S62188163 U JPS62188163 U JP S62188163U JP 7712986 U JP7712986 U JP 7712986U JP 7712986 U JP7712986 U JP 7712986U JP S62188163 U JPS62188163 U JP S62188163U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- optical coupling
- coupling part
- light
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000000149 argon plasma sintering Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7712986U JPS62188163U (US20100012521A1-20100121-C00001.png) | 1986-05-21 | 1986-05-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7712986U JPS62188163U (US20100012521A1-20100121-C00001.png) | 1986-05-21 | 1986-05-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62188163U true JPS62188163U (US20100012521A1-20100121-C00001.png) | 1987-11-30 |
Family
ID=30924845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7712986U Pending JPS62188163U (US20100012521A1-20100121-C00001.png) | 1986-05-21 | 1986-05-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62188163U (US20100012521A1-20100121-C00001.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6327067U (US20100012521A1-20100121-C00001.png) * | 1986-08-06 | 1988-02-22 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55166971A (en) * | 1979-06-14 | 1980-12-26 | Nec Corp | Photocoupling device |
-
1986
- 1986-05-21 JP JP7712986U patent/JPS62188163U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55166971A (en) * | 1979-06-14 | 1980-12-26 | Nec Corp | Photocoupling device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6327067U (US20100012521A1-20100121-C00001.png) * | 1986-08-06 | 1988-02-22 |
