JPS6218467A - Transparent, heat-resistant thermoplastic resin composition having excellent platability - Google Patents

Transparent, heat-resistant thermoplastic resin composition having excellent platability

Info

Publication number
JPS6218467A
JPS6218467A JP60157845A JP15784585A JPS6218467A JP S6218467 A JPS6218467 A JP S6218467A JP 60157845 A JP60157845 A JP 60157845A JP 15784585 A JP15784585 A JP 15784585A JP S6218467 A JPS6218467 A JP S6218467A
Authority
JP
Japan
Prior art keywords
weight
component
copolymer
parts
vinyl monomer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60157845A
Other languages
Japanese (ja)
Inventor
Kiyotaka Saito
清高 斉藤
Takashi Chiba
尚 千葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Priority to JP60157845A priority Critical patent/JPS6218467A/en
Publication of JPS6218467A publication Critical patent/JPS6218467A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1635Composition of the substrate
    • C23C18/1639Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641Organic substrates, e.g. resin, plastic

Abstract

PURPOSE:To provide the titled compsn. having excellent platability, heat resistance and transparency and useful as a material in the fields of automobile, household appliance, precision equipment, etc., by blending a thermoplastic resin consisting of an imide copolymer and a specified copolymer with a polycarbonate resin. CONSTITUTION:An arom. vinyl monomer (a), an unsaturated dicarboxylic acid imide derivative (b) (e.g. N-phenylmaleimide) and a copolymerizable vinyl monomer (c) (e.g. acrylonitrile), etc. are copolymerized in a solvent at 80-350 deg.C to obtain an imide copolymer (A) composed of 30-90% (by weight; the same applies herein below) residue of component (a), 3-7% residue of component (b) and 0-40% residue of component (c). 5-95% thermoplastic resin consisting of 10-90pts.wt. component A and 90-10pts.wt. rubbery copolymer having a number-average particle size of 200mmu or below, obtd. by grafting 30-80% arom. vinyl monomer, 0-40% vinyl cyanide monomer and 0-40% other copolymerizable monomer onto 3-7% rubbery polymer (e.g. polybutadiene) is blended with 95-5% polycarbonate resin.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明はメッキ性にすぐれ、しかも透明性かつ耐熱性に
すぐれた熱可塑性樹脂組成物;て関するものであり、本
発明組成物は自動車関%、家電関%、精密機器関係等に
使用することができる。
Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a thermoplastic resin composition with excellent plating properties, transparency and heat resistance; %, home appliances, precision equipment, etc.

(従来の技術及びその欠点) 従来から芳香族ビニル単量体及び不飽和ノカルボン酸無
水物からなる共重合体とポリカーボネート樹脂からなる
組成物が知られている(特公昭57−27133)。又
衝繋強度を改良する目的でコ8ム変性された芳香族ビニ
ル単量体及び不飽和ソカルボン酸無水物からなる共重合
体とポリカーボネート樹脂からなる組成物が提案されて
いる(特開昭56−92950)。
(Prior Art and its Disadvantages) A composition comprising a copolymer comprising an aromatic vinyl monomer and an unsaturated nocarboxylic acid anhydride and a polycarbonate resin has been known (Japanese Patent Publication No. 57-27133). Furthermore, for the purpose of improving the bonding strength, a composition comprising a copolymer comprising a co-modified aromatic vinyl monomer and an unsaturated socarboxylic acid anhydride and a polycarbonate resin has been proposed (Japanese Unexamined Patent Application Publication No. 1983-1999) -92950).

しかしこれら不飽和ジカルボン酸無水物を共重合しだ共
重合体とポリカーボネート樹脂との組成物は共重合体連
鎖中に不飽和ノカルポン酸無水物に起因する酸無水物基
が存在するために、高温時の水に対しては勿論のこと、
熱に対しても化学変化を起こし分解しやすく射出又は押
出加工する際に著しい制約を受け、又加工品は水又は水
蒸気に接触させたシ高温下にさらしたシする場合、機械
的物性の低下を引き起こす欠点があった。又、ポリカー
ボネート樹脂は機械的、熱的特性にすぐれているが溶融
粘度が高く成形加工性に劣る事や、耐油性及び耐熱水性
が悪い事などが欠点として指摘されておシ例えば射出成
形により成形品を製造する場合、高い射出圧力や高い成
形温度を必要とし成形歪や熱劣化の原因となる。また成
形品をガソリン、ブレーキオイルなどの油や沸騰水中に
浸漬した場合、クラックが発生し著しく強度の低下をき
たす。ところで近年、自動車分野で軽量化が推進されて
おり、金属からプラスチックへの代替が積極的に進めら
れているがプラスチックの耐久性は金属には及ばないの
が実情である。そこでプラスチックにメッキを施して耐
久性を向上させるとともに装飾性を付与することが行な
われるようになった。ところが透明かつ耐熱性樹脂であ
るポリカーボネート樹脂の場合、メッキ性が著しく劣る
欠点を有している。
However, compositions of these unsaturated dicarboxylic anhydride copolymers and polycarbonate resins cannot be used at high temperatures due to the presence of acid anhydride groups resulting from the unsaturated nocarboxylic anhydride in the copolymer chain. Of course, against the water of time,
Chemical changes occur when exposed to heat, resulting in decomposition, which poses significant restrictions during injection or extrusion processing.Also, when processed products are brought into contact with water or steam or exposed to high temperatures, mechanical properties may deteriorate. There was a drawback that caused Although polycarbonate resin has excellent mechanical and thermal properties, it has been pointed out that its disadvantages include high melt viscosity, poor moldability, and poor oil resistance and hot water resistance.For example, it cannot be molded by injection molding. When manufacturing products, high injection pressure and high molding temperature are required, which causes molding distortion and thermal deterioration. Furthermore, if a molded product is immersed in oil such as gasoline or brake oil, or boiling water, cracks will occur and the strength will significantly decrease. Incidentally, in recent years, weight reduction has been promoted in the automobile field, and the replacement of metals with plastics has been actively promoted, but the reality is that plastics are not as durable as metals. Therefore, it has become common practice to plate plastics to improve their durability and give them decorative properties. However, polycarbonate resin, which is a transparent and heat-resistant resin, has the disadvantage of extremely poor plating properties.

(問題点を解決するための手段) 本発明者はかかる欠点を解決すべく研究を重ねた結果、
不飽和ノカルボン酸イミド誘導体、グラフト共重合体中
にゴム状重合体が数平均粒径200mμ以下゛となるよ
うに分散させた共重合体及びポリカーボネート樹脂を混
合することによシ耐熱性かつ透明でメッキ性にすぐれた
組成物が得られた。
(Means for Solving the Problems) As a result of repeated research to solve these drawbacks, the present inventor has found that
By mixing an unsaturated nocarboxylic acid imide derivative, a copolymer in which a rubber-like polymer is dispersed in a graft copolymer so that the number average particle size is 200 mμ or less, and a polycarbonate resin, a heat-resistant and transparent product can be obtained. A composition with excellent plating properties was obtained.

即ち本発明は、 A成分:芳香族ビニル単量体残基30〜90重量%、不
飽和ジカル?ン酸イミド誘導 体残基3〜70重量%、及びこれらの 基以外のビニル単量体残基0〜40重 量%からなるイミド化共重合体10〜 90重量部と、 B成分:ゴム状重合体3〜70重量%に芳香族ビニル単
量体30〜80重量%、シア ン化ビニル単量体0〜40重量%及び これらと共重合可能なビニル単量体0 〜40重量%がグラフト共重合したも ので、共重合体中のゴム状重合体の数 平均粒径が200mμ以下である共重 合体10〜90重量部 を含有してなる熱可塑性樹脂5〜95重量%と、C成分
ニーリカーボネート樹脂5〜95重量%からなるメッキ
性にすぐれた透明1耐熱性熱可塑性樹脂組成物である。
That is, the present invention has the following components: A component: 30 to 90% by weight of aromatic vinyl monomer residue, unsaturated radical ? 10 to 90 parts by weight of an imidized copolymer consisting of 3 to 70% by weight of phosphoric acid imide derivative residues and 0 to 40% by weight of vinyl monomer residues other than these groups, and component B: rubber-like polymer. 3 to 70% by weight of aromatic vinyl monomers, 30 to 80% by weight of vinyl cyanide monomers, and 0 to 40% by weight of vinyl monomers copolymerizable with these are graft copolymerized. 5 to 95% by weight of a thermoplastic resin containing 10 to 90 parts by weight of a copolymer in which the number average particle diameter of the rubbery polymer in the copolymer is 200 mμ or less, and C component Neelicarbonate resin. It is a transparent 1 heat-resistant thermoplastic resin composition with excellent plating properties consisting of 5 to 95% by weight.

ますA成分のイミド化共重合体およびその調法を説明す
る。
First, the imidized copolymer of component A and its preparation method will be explained.

A成分共重合体の製法としては、第1の製法として芳香
族ビニル単量体、不飽和ジカルボン酸イミド誘導体、不
飽和ジカルボン酸無水物単量体、及びこれらと共重合可
能なビニル単量体混合物を共重合させる方法、第2の製
法として芳香族ビニル単量体、不飽和ノカルポン酸無水
物及びこれらと共重合可能なビニル単量体混合物を共重
合させた重合体に該重合体中の酸無水物基に対し0.8
〜1.05モル当量のアンモニア及び/又は第1級アミ
ンを反応させて酸無水物基をイミド基に変換させる方法
が挙げられ、いずれの方法によってもイミド化共重合体
を得ることができる。
The first method for producing the component A copolymer includes aromatic vinyl monomers, unsaturated dicarboxylic imide derivatives, unsaturated dicarboxylic anhydride monomers, and vinyl monomers copolymerizable with these. A method of copolymerizing a mixture, the second production method is a polymer obtained by copolymerizing an aromatic vinyl monomer, an unsaturated nocarboxylic acid anhydride, and a vinyl monomer mixture copolymerizable with these. 0.8 for acid anhydride group
Examples include a method of converting an acid anhydride group into an imide group by reacting with 1.05 molar equivalents of ammonia and/or a primary amine, and an imidized copolymer can be obtained by any of the methods.

A成分共重合体第1の製法に使用される芳香族ビニル単
量体としてはスチレン、α−メチルスチレン、ビニルト
ルエン、t−ブチルスチレン、クロロスチレン等のスチ
レン単量体およびその置換単量体であシ、これらの中で
スチレンが特に好ましい。
Aromatic vinyl monomers used in the first production method of component A copolymer include styrene monomers such as styrene, α-methylstyrene, vinyltoluene, t-butylstyrene, chlorostyrene, and substituted monomers thereof. Of these, styrene is particularly preferred.

不飽和ジカルボン酸イミド誘導体としてはマレイミド、
N−メチルマレイミド、N−ブチルマレイミド、N−フ
ェニルマレイミド、N−メチルフェニルマレイミド、N
−ヒドロキシフェニルマレイミド、N−メトキシフェニ
ルマレイミド、N−クロロフェニルマレイミド、N−カ
ルボキシフェニルマレイミド、N−ニトロフェニルマレ
イミド、N−シクロへキシルマレイミド、N−イングロ
ビルマレイミド等のマレイミド誘導体、N−メチルイタ
コン酸イミド、N−フェニルイタコン酸イミド等のイタ
コン酸イミド誘導体等が挙げられ、これらの中でN−フ
ェニルマレイミドが特に好ましい。
As unsaturated dicarboxylic acid imide derivatives, maleimide,
N-methylmaleimide, N-butylmaleimide, N-phenylmaleimide, N-methylphenylmaleimide, N
-Maleimide derivatives such as hydroxyphenylmaleimide, N-methoxyphenylmaleimide, N-chlorophenylmaleimide, N-carboxyphenylmaleimide, N-nitrophenylmaleimide, N-cyclohexylmaleimide, N-inglobylmaleimide, N-methylitaconic acid imide, itaconic acid imide derivatives such as N-phenyl itaconic acid imide, and the like, and among these, N-phenyl maleimide is particularly preferred.

不飽和ノカルデン酸無水物としては、マレイン酸、イタ
コン酸、シトラコン酸、アコニット酸等の無水物があシ
、マレイン酸無水物が特に好ましい。
As the unsaturated nocaldic acid anhydride, anhydrides such as maleic acid, itaconic acid, citraconic acid, and aconitic acid, and maleic acid anhydride are particularly preferred.

またこれらと共重合可能なビニル単量体としては、アク
リロニトリル、メタクリロニトリル、α−クロロアクリ
ロニトリル等のシアン化ビニル単量体、メチルアクリル
酸エステル、エチルアクリル酸エステル等のアクリル酸
エステル単量体、メチルメタクリル酸エステル、エチル
メタクリル酸エステル等のメタクリル酸エステル単量体
、アクリル酸、メタクリル酸等のビニルカルボン酸単量
体、アクリル酸アミド、メタクリル酸アミド等があって
これらの中でアクリロニトリル、メタクリル酸エステル
、アクリル酸、メタクリル酸などの単量体が好ましい。
Vinyl monomers that can be copolymerized with these include vinyl cyanide monomers such as acrylonitrile, methacrylonitrile, and α-chloroacrylonitrile, and acrylic ester monomers such as methyl acrylate and ethyl acrylate. , methacrylic acid ester monomers such as methyl methacrylic acid ester and ethyl methacrylic acid ester, vinyl carboxylic acid monomers such as acrylic acid and methacrylic acid, acrylamide, and methacrylic acid amide. Among these, acrylonitrile, Monomers such as methacrylic acid ester, acrylic acid, and methacrylic acid are preferred.

また第2の製法に使用される芳香族ビニル単量体、不飽
和ジカルボン酸無水物及びこれらと共重合可能なビニル
単量体は前記の第1の製法に使用されるものが使用でき
る。
Further, as the aromatic vinyl monomer, unsaturated dicarboxylic acid anhydride, and vinyl monomer copolymerizable with these used in the second production method, those used in the first production method can be used.

また、イミド化反応に用いるアンモニアや第1級アミン
は無水又は水溶液のいずれの状態であってもよく、また
第1級アミンの例としてメチルアミン、エチルアミン、
ブチルアミン、シクロヘキシルアミン等のアルキルアミ
ン、およびこれらのクロル又はブロム置換アルキルアミ
ン、アニリン、トリルアミン、ナフチルアミン等の芳香
族アミンおよびクロル又はブロム置換アニリン等のハロ
ダン置換芳香族アミンがあげられる。
In addition, ammonia and primary amines used in the imidization reaction may be in either an anhydrous or aqueous solution state, and examples of primary amines include methylamine, ethylamine,
Alkylamines such as butylamine and cyclohexylamine, chloro- or bromine-substituted alkylamines thereof, aromatic amines such as aniline, tolylamine, naphthylamine, and halodane-substituted aromatic amines such as chloro- or bromine-substituted aniline are mentioned.

さらに、イミド化反応を溶液状態又は懸濁状態で行う場
合は、通常の反応容器、例えばオートクレーブなどを用
いるのが好ましく、塊状溶融状態で行なう場合は脱揮装
置の付いた押出機を用いてもよい。またイミド化する際
に触媒を存在させてもよく、例えば第3級アミン等が好
ましく用いられる。
Furthermore, when the imidization reaction is carried out in a solution or suspension state, it is preferable to use an ordinary reaction vessel such as an autoclave, and when carried out in a bulk molten state, an extruder equipped with a devolatilization device may be used. good. Further, a catalyst may be present during imidization, and for example, a tertiary amine or the like is preferably used.

イミド化反応の温度は、約80〜350℃であり、好ま
しくは100〜300℃である。
The temperature of the imidization reaction is about 80 to 350°C, preferably 100 to 300°C.

80℃未満の場合には反応速度が遅く、反応に長時間を
要し実用的でない。一方350℃を越える場合には重合
体の熱分解による物性低下をきだす。
If the temperature is lower than 80°C, the reaction rate is slow and the reaction takes a long time, which is not practical. On the other hand, if the temperature exceeds 350°C, the physical properties will deteriorate due to thermal decomposition of the polymer.

溶液状態でイミド化する場合の溶剤としては、アセトン
、メチルエチルケトン、メチルイソ/チルケトン、アセ
トフェノン、テトラヒドロフラン、ジメチルホルムアミ
ド等があシこれらの中でメチルエチルケトン、メチルイ
ソブチルケトンが好ましい。非水性媒体中での懸濁状態
でイミド化する時の非水性媒体にはへブタン、ヘキサン
、ペンタン、オクタン、2−メチルペンタン、シクロ被
ンタン、シクロヘキサン等ノ脂肪族炭化水素がある。
The solvent for imidization in a solution state includes acetone, methyl ethyl ketone, methyl iso/tyl ketone, acetophenone, tetrahydrofuran, dimethylformamide, etc. Among these, methyl ethyl ketone and methyl isobutyl ketone are preferred. Non-aqueous media for imidization in suspension in non-aqueous media include aliphatic hydrocarbons such as hebutane, hexane, pentane, octane, 2-methylpentane, cyclopentane, and cyclohexane.

A成分重合体は芳香族ビニル単量体残基30〜90重量
%、好ましくは40〜70重量%、不飽和ジカルデン酸
イミド誘導体残基3〜70重量%、好ましくは10〜6
0重量%、およびこれらとの残基の基となる化合物と共
重合可能なビニル単量体の残基0〜40重量%、好まし
くは0〜30重量%からなるイミド化共重合体である。
The component A polymer contains 30 to 90% by weight of aromatic vinyl monomer residues, preferably 40 to 70% by weight, and 3 to 70% by weight of unsaturated dicardenimide derivative residues, preferably 10 to 6% by weight.
It is an imidized copolymer consisting of 0% by weight, and 0 to 40% by weight, preferably 0 to 30% by weight, of vinyl monomer residues that can be copolymerized with the compound forming the residue thereof.

芳香族ビニル単量体残基の量が30重量−未満であると
成形性及び寸法安定性が損われ、90重量%を越えると
、衝撃強度及び耐熱性が損われる。不飽和ジカル?ン酸
イミド訪導体残基の量が3重量%未満の場合は耐熱性改
良の効果が十分でなく、一方70重量%を越えると樹脂
組成物がもろくなり成形性も著しく悪くなる。これらの
基以外のビニル単量体残基の量が40重量%を超えると
、寸法安定性及び耐熱性が損われる。
If the amount of aromatic vinyl monomer residue is less than 30% by weight, moldability and dimensional stability will be impaired, and if it exceeds 90% by weight, impact strength and heat resistance will be impaired. Unsaturated radical? If the amount of the acid imide visiting conductor residue is less than 3% by weight, the effect of improving heat resistance will not be sufficient, while if it exceeds 70% by weight, the resin composition will become brittle and the moldability will deteriorate significantly. If the amount of vinyl monomer residues other than these groups exceeds 40% by weight, dimensional stability and heat resistance will be impaired.

次にB成分およびその製法について説明する。Next, component B and its manufacturing method will be explained.

B成分に用いられるゴム状重合体は、ブタジェン単独又
はこれと共重合可能なビニル単量体よシなる重合体、エ
チレン−プロピレン共重合体、エチレン−プロぎレンー
ジエン共重合体あるいはアクリル酸エステル単独又はこ
れと共重合可能なビニル単量体よシなる重合体がある。
The rubbery polymer used for component B is a polymer consisting of butadiene alone or a vinyl monomer copolymerizable with it, an ethylene-propylene copolymer, an ethylene-propylene-diene copolymer, or an acrylic ester alone. Alternatively, there are polymers such as vinyl monomers that can be copolymerized with this.

B成分に用いられる芳香族ビニル単量体としてはスチレ
ン、α−メチルスチレン、クロロスチレン等のスチレン
単量体およびその置換単量体であシ、これらの中でスチ
レンおよびα−メチルスチレンなどの単量体が特に好ま
しい。
The aromatic vinyl monomer used in component B includes styrene monomers such as styrene, α-methylstyrene, and chlorostyrene, and their substituted monomers. Monomers are particularly preferred.

シアン化ビニル単量体としてはアクリロニトリル、メタ
クリロニトリル、α−クロロアクリロニトリル等があシ
、特にアクリロニトリルが好ましい。またこれらと共重
合可能なビニル単量体としてはメチルアクリル酸エステ
ル、エチルアクリル酸エステル、ブチルアクリル酸エス
テル等のアクリル酸エステル、メチルメタクリル酸エス
テル、エチルメタクリル酸エステル等のメタクリル酸エ
ステル単量体、アクリル酸、メタクリル酸等のビニルカ
ルボン酸単量体、アクリル酸アミド、メタクリル酸アミ
ド等があげられる。これらの中でメチルメタクリル酸エ
ステル、アクリル酸、メタクリル酸が特に好ましい。
Examples of vinyl cyanide monomers include acrylonitrile, methacrylonitrile, and α-chloroacrylonitrile, with acrylonitrile being particularly preferred. Vinyl monomers that can be copolymerized with these include acrylic esters such as methyl acrylate, ethyl acrylate, and butyl acrylate, and methacrylic ester monomers such as methyl methacrylate and ethyl methacrylate. , vinyl carboxylic acid monomers such as acrylic acid and methacrylic acid, acrylamide, and methacrylic acid amide. Among these, methyl methacrylate, acrylic acid, and methacrylic acid are particularly preferred.

B成分のグラフト共重合体の製法はゴム状重合体3〜7
0i量%存在下に芳香族ビニル単量体30〜80重量%
、シアン化ビニル単量体0〜4Ofi量%及びこれらと
共重合可能なビニル単量体0〜40重世襲からなる単量
体混合物30〜97重量%をグラフト共重合して得られ
る。重合は公知のいずれの重合技術も採用可能であシ例
えば懸濁重合、乳化重合の如き水性不均一重合、塊状重
合、溶液重合および生成重合体の非溶媒中での沈殿重合
等があるがゴム粒匝を制御しやすいという点から乳化重
合が好ましい。又、グラフト共重合体中のゴム状重合体
の数平均粒径は200mμ以下であり200mμよシ大
きいと組成物の透明性が失われる。
The method for producing the graft copolymer of component B is rubbery polymers 3 to 7.
30-80% by weight of aromatic vinyl monomer in the presence of 0i% by weight
It is obtained by graft copolymerizing 30 to 97 weight % of a monomer mixture consisting of 0 to 4 Ofi weight % of a vinyl cyanide monomer and 0 to 40 vinyl monomers copolymerizable with these monomers. Any known polymerization technique can be employed for polymerization, such as suspension polymerization, aqueous heterogeneous polymerization such as emulsion polymerization, bulk polymerization, solution polymerization, and precipitation polymerization of the resulting polymer in a non-solvent. Emulsion polymerization is preferred from the viewpoint of easy control of grain size. Further, the number average particle size of the rubbery polymer in the graft copolymer is 200 mμ or less, and if it is larger than 200 mμ, the transparency of the composition will be lost.

C成分に用いられるポリカーゴネート樹脂となる繰返し
単位を有するものであり列えばホスク゛ン法又はエステ
ル交換法によって得られる。
It has a repeating unit that becomes the polycargonate resin used for component C, and can be obtained by the fosquin method or the transesterification method.

2リカーボネート樹脂として好ましいものはビス(ヒド
ロキシアリール)アルカン系ポリカーゴネート樹脂であ
シ、例えばビス(4−ヒドロキシフェニル)メタン、ビ
ス(4−ヒドロキシフェニル)エタン、2.2−ビス(
4−ヒドロキシフェニル)f口/Jン、2.2−ビス(
4−ヒドロキシ−3,5−ジクロロフェニルプロ・ゼン
もしくはビス(4−ヒドロキシフェニル)フェニルメタ
ン等のビス(ヒドロキジアリール)アルカンとホスゲン
あるいはジアリールカーがネートとよシ得られるもので
あシこれらは単独あるいは混合して使用される。
Preferred 2-recarbonate resins are bis(hydroxyaryl)alkane-based polycargonate resins, such as bis(4-hydroxyphenyl)methane, bis(4-hydroxyphenyl)ethane, 2,2-bis(
4-hydroxyphenyl) f/Jn, 2,2-bis(
Bis(hydroxydiaryl) alkanes such as 4-hydroxy-3,5-dichlorophenylprozene or bis(4-hydroxyphenyl)phenylmethane and phosgene or diarylcars can be obtained together with nates. used in combination.

本発明においてA成分、B成分およびC成分の割合はA
成分10〜90重量部、好ましくは20〜80重量部で
、B成分10〜90重量部、好ましくは20〜80重量
部よシなる熱可塑性樹脂5〜95重量%、好ましくは1
0〜80重量%、C成分5〜95重量%、好ましくは2
0〜90fi量係の範囲である。A成分が10重量部未
満であると耐熱性向上の効果が不十分で、一方A成分が
90重量部を越えると耐衝撃性が低下し成形性も悪くな
る。B成分は10重量部未満であると耐衝撃性及びメッ
キ性が不十分であシ、B成分が90重量部を越えると耐
熱性が損なわれる。A成分及びB成分よりなる熱可塑性
樹脂が10重量%未満であると耐熱性及びメッキ性が不
十分であシ、90重量%を越えると耐衝撃性が低下する
。C成分は5重量%未満では耐衝撃性が低下し95重量
%を越えるとメッキ性、成形性が低下する。
In the present invention, the ratio of A component, B component and C component is A
10-90 parts by weight, preferably 20-80 parts by weight of component B, 5-95 parts by weight of thermoplastic resin, preferably 10-90 parts by weight of component B, preferably 1
0 to 80% by weight, C component 5 to 95% by weight, preferably 2
It is in the range of 0 to 90 fi quantity coefficient. If the amount of component A is less than 10 parts by weight, the effect of improving heat resistance will be insufficient, while if the amount of component A exceeds 90 parts by weight, impact resistance will decrease and moldability will also deteriorate. If the B component is less than 10 parts by weight, the impact resistance and plating properties will be insufficient, and if the B component exceeds 90 parts by weight, the heat resistance will be impaired. If the thermoplastic resin consisting of component A and component B is less than 10% by weight, heat resistance and plating properties will be insufficient, and if it exceeds 90% by weight, impact resistance will decrease. If the C component is less than 5% by weight, the impact resistance will decrease, and if it exceeds 95% by weight, the plating properties and moldability will decrease.

本発明でA成分、B成分、C成分の混合方法は特に制限
がなく公知の手段を使用することができる。その手段と
して例えばバンバリーミキサ−、タンブラ−ミキサー、
混合ロール、1軸又は2軸押出機等があげられる。混合
形態としては通常の溶融混合、マスターペレット等ヲ用
いる多段階溶融混線、溶液中でのブレンド等によシ組酸
物を得る方法がある。
In the present invention, the method of mixing component A, component B, and component C is not particularly limited, and known means can be used. For example, a Banbury mixer, a tumbler mixer,
Examples include a mixing roll, a single-screw or twin-screw extruder, and the like. As for the mixing form, there are methods of obtaining a recombinant acid such as ordinary melt mixing, multi-stage melt mixing using master pellets, blending in a solution, etc.

本発明の樹脂組成物を用いて得られる成形品は化学メッ
キに先立って、酸水溶液によるエツチング処理を施す。
A molded article obtained using the resin composition of the present invention is subjected to an etching treatment using an acid aqueous solution prior to chemical plating.

本発明で用いられる酸水溶液の好ましい例としては無水
クロム酸と濃硫酸との混合物が挙げられる。このように
して粗面化された成形品にメッキする方法としては一般
的にプラスチックメッキで採用されている方法を採用す
ることができる。一般的な方法としては粗面化された成
形品を活性化液に浸漬後、無電解メッキによシ銅あるい
はニッケルの被膜全形成させ、しかる後電気メッキによ
シ金属′fI!膜を形成させる。
A preferred example of the acid aqueous solution used in the present invention is a mixture of chromic anhydride and concentrated sulfuric acid. As a method for plating the molded product whose surface has been roughened in this manner, a method generally used for plastic plating can be employed. The general method is to immerse the roughened molded product in an activating solution, then apply electroless plating to form a full copper or nickel coating, and then electroplate the metal'fI! Form a film.

(実施例) 以下本発明を実施例及び比較例により説明するが実施例
中の部、チはいずれも重量基準で表わしだ。
(Examples) The present invention will be explained below with reference to Examples and Comparative Examples, in which all parts and parts are expressed on a weight basis.

撹拌機を備えだオートクレーブ中にスチレン100部、
及びメチルイソブチルケトン50部を仕込み系内を窒素
ガスで置換した。温度を83℃に昇温後熱水マレイン酸
67部とベンゾイル−ぐ−オキサイド0.2部をメチル
イソブチルケトン400部に溶解した溶液を8時間で添
加した。粘稠な反応液の一部をサンプリングしてガスク
ロマトグラフィーによシ未反応単量体の定量を行なった
結果重合率はスチレン99%、無水マレイン酸99%で
あった。ここで得られた共重合体溶液に無水マレイン酸
に対して1.0モル当量のアニリン63,6部、トリエ
チルアミン1部を加え140℃で7時間反応させた。脱
気処理し得られたイミド化重合体を重合体A−1とする
100 parts of styrene in an autoclave equipped with a stirrer.
and 50 parts of methyl isobutyl ketone were charged, and the inside of the system was purged with nitrogen gas. After raising the temperature to 83 DEG C., a solution of 67 parts of hydrothermal maleic acid and 0.2 parts of benzoyl gum oxide dissolved in 400 parts of methyl isobutyl ketone was added over 8 hours. A portion of the viscous reaction solution was sampled and unreacted monomers were determined by gas chromatography. As a result, the polymerization rate was 99% for styrene and 99% for maleic anhydride. To the copolymer solution obtained here were added 63.6 parts of aniline and 1 part of triethylamine in an amount of 1.0 molar equivalent to maleic anhydride, and the mixture was reacted at 140° C. for 7 hours. The imidized polymer obtained by degassing is referred to as Polymer A-1.

実験例(1)のスチレン100部の代わシにスチレン1
00部とアクリロニトリル17部を用い、無水マレイン
酸67部を50部にし、アニリン63.6部を47.4
部に代えた以外は実験例(1)と全く同じ操作を行ない
イミド化重合体を得た。
1 part of styrene instead of 100 parts of styrene in Experimental Example (1)
00 parts and 17 parts of acrylonitrile, 67 parts of maleic anhydride was made into 50 parts, and 63.6 parts of aniline was made into 47.4 parts.
An imidized polymer was obtained by carrying out exactly the same operation as in Experimental Example (1) except that the amount was changed.

これを重合体A−2とする。なおこの重合体の重合率は
スチレン98%、無水マレイン酸98係であった。
This will be referred to as Polymer A-2. The polymerization rate of this polymer was 98% for styrene and 98% for maleic anhydride.

撹拌機を備えたオートクレーブ中にスチレン100部、
メチルイソブチルケトン50部を仕込み系内を窒素置換
後温度を83℃に昇温しN−フェニルマレイミド85部
、無水マレイン酸15部、ベンゾイルパーオキサイド0
.2部をメチルイソブチルケトン400部に溶解した溶
液を8時間で添加した以外は実験例(1)と同じ操作を
行ない共重合体を得た。重合率はスチレン96%、N−
フェニルマレイミド95%であった。これを重合体A−
3とする。
100 parts of styrene in an autoclave equipped with a stirrer,
After charging 50 parts of methyl isobutyl ketone and purging the system with nitrogen, the temperature was raised to 83°C, and 85 parts of N-phenylmaleimide, 15 parts of maleic anhydride, and 0 parts of benzoyl peroxide were added.
.. A copolymer was obtained by carrying out the same operation as in Experimental Example (1) except that a solution of 2 parts dissolved in 400 parts of methyl isobutyl ketone was added over 8 hours. The polymerization rate is 96% of styrene, N-
It was 95% phenylmaleimide. This is polymer A-
Set it to 3.

ポリブタノエンラテックス80部(固形分50%、平均
粒径100771μ)、ステアリン酸ソーダ1部、ソノ
ラムホルムアルデヒドスルホキシレート0.1部、テト
ラソノラムエチレンジアミンテトラアセチックアシッド
0.03 部、硫酸第1鉄0.003部及び水200部
を65℃に加熱し、これにアクリロニトリル30%及び
スチレン70%よりなる単量体混合物60部、を−ドデ
シルメルカプタフ0.3部、キュメンハイドロA’−オ
キサイド0.2部を4時間で連続添加し、さらに添加終
了後65℃で2時間重合した。
80 parts of polybutanoene latex (solid content 50%, average particle size 100771μ), 1 part of sodium stearate, 0.1 part of sonorum formaldehyde sulfoxylate, 0.03 part of tetrasonorum ethylenediamine tetraacetic acid, sulfuric acid 0.003 parts of ferrous iron and 200 parts of water were heated to 65°C, and 60 parts of a monomer mixture consisting of 30% acrylonitrile and 70% styrene, 0.3 parts of dodecyl mercaptaf, and Cumen Hydro A were added. 0.2 part of '-oxide was continuously added over 4 hours, and after the addition was completed, polymerization was further carried out at 65° C. for 2 hours.

重合率は96%であった。得られたラテックスに酸化防
止剤を添加した後、塩化カルシウムで凝固し、水洗、乾
燥後白色粉末状の重合体を得た。これをABSと表示す
る。
The polymerization rate was 96%. After adding an antioxidant to the obtained latex, it was coagulated with calcium chloride, washed with water, and dried to obtain a white powdery polymer. This is indicated as ABS.

実施例1 実験例(1)で得られた重合体A−130部(A成分)
、実験例(4)で得られたABS樹脂20部(B成分)
、ポリカーボネート樹脂(帝人化成、パンライトに=1
300 ) 30部(C成分)をブレンドし、このブレ
ンド物を30mxφ脱揮装置付スクリュー押出機によシ
押出しイレット化した。得られた(レットを乾燥後、ア
ーブルグ成形機で試験片を成形した。(12,5龍×1
25+++mX厚さ3關)得られた試験片を脱脂、洗浄
後、無水クロム酸40017773と濃硫酸200m1
/lとの混酸浴に65℃で5分間浸漬し、さらに中和液
で処理し、次に活性化液および化学ニッケルメッキ液に
よって化学メッキ処理を施した。化学メッキされた試験
片を、硫酸鋼メッキ液中で3.5への電流で90分間電
気メツキに供し、水洗後100℃で1時間乾燥させ金属
被覆化した試験片を得た。これらの試験片のメッキ膜の
剥離強度を測定した。試験片の物性及びメッキ膜の剥離
強度を第1表に示した。
Example 1 130 parts of polymer A obtained in Experimental Example (1) (component A)
, 20 parts of ABS resin obtained in Experimental Example (4) (component B)
, polycarbonate resin (Teijin Kasei, Panlite = 1
300) (component C) was blended, and this blend was extruded into an islet using a screw extruder equipped with a 30 m x φ devolatilization device. After drying the obtained (lett), a test piece was molded using an Arburg molding machine.
25+++m x thickness 3cm) After degreasing and washing the obtained test piece, chromic anhydride 40017773 and concentrated sulfuric acid 200ml
/l for 5 minutes at 65° C., further treated with a neutralizing solution, and then chemically plated with an activating solution and a chemical nickel plating solution. The chemically plated test piece was subjected to electroplating in a sulfuric acid steel plating solution at a current of 3.5 for 90 minutes, washed with water, and then dried at 100° C. for 1 hour to obtain a metal-coated test piece. The peel strength of the plating film of these test pieces was measured. Table 1 shows the physical properties of the test piece and the peel strength of the plating film.

実施例2〜3 実施例1において重合体A−IK代え重合体A−2およ
びA−3を用いた以外は同様に行なった。
Examples 2 to 3 The same procedure as in Example 1 was carried out except that polymers A-2 and A-3 were used instead of polymer A-IK.

実施例1においてA成分、B成分およびC成分の配合量
を変えた以外は同様に行なった。
The same procedure as in Example 1 was carried out except that the amounts of component A, component B, and component C were changed.

比較例1 実験例(1)で得られたスチレン−無水マレイン酸共重
合体をイミド化せずに用いた以外は同様に行なった。
Comparative Example 1 The same procedure was carried out except that the styrene-maleic anhydride copolymer obtained in Experimental Example (1) was used without being imidized.

比較例2 実施例1においてB成分のABS樹脂を用いなかった以
外は同・沫に行なった。
Comparative Example 2 The same procedure as in Example 1 was carried out except that the ABS resin of component B was not used.

比較例3 実施例1においてC成分のポリカー?ネート樹脂のみで
行なった。
Comparative Example 3 In Example 1, C component polycarbon? It was carried out using only nate resin.

なお物性の測定は下記の方法によった。The physical properties were measured by the following method.

(1)ビカット軟化温度: 5#荷重でASTM  D−1525に準じた。(1) Vicat softening temperature: According to ASTM D-1525 with 5# load.

(2)アイゾツト衝寧強度: ノツチ付1/4 (7チ、ASTM  D−256K準
じた。
(2) Izot impact strength: Notched 1/4 (7 inches, according to ASTM D-256K).

(3)剥離強度: エツチングによる成形品の粗面化の効果は被覆金属膜と
基材樹脂との接着強度で表わせる。10朋幅の被覆金属
面を基材に対して垂直方向に引き剥す際の強さく # 
/ cm )で示した。
(3) Peel strength: The effect of roughening the surface of a molded product by etching can be expressed by the adhesive strength between the coated metal film and the base resin. Strength when peeling off a coated metal surface with a width of 10 cm in the direction perpendicular to the base material #
/cm).

0)耐ヒートサイクル性: 金属と樹脂との熱膨張係数が異なるため急激な温度変化
でフクレやクラックを生ずる。
0) Heat cycle resistance: Because the thermal expansion coefficients of metal and resin are different, blisters and cracks occur due to sudden temperature changes.

そのためメッキされた成形品を低温及び高温雰囲気に交
互にさらす熱サイクルテストが一般に行なわれる。本発
明では一40℃で60分間と+90℃で60分間を1サ
イクルとする条件下に10サイクル試験し試験後の金属
膜にフクレあるいはクラックが発生したものを「×」、
フクレあるいはクラックが発生しないものを「○」で示
した。
Therefore, a thermal cycle test is generally performed in which plated molded products are exposed to alternately low and high temperature atmospheres. In the present invention, a test is performed for 10 cycles under the conditions of -40°C for 60 minutes and +90°C for 60 minutes, and those in which blisters or cracks have occurred in the metal film after the test are marked "x".
Those in which no blistering or cracking occurred were marked with "○".

(5)成形加工性: 射出成形機による成形加工を行ない、ポリカーブネート
樹脂と同等あるいはそれ以上の成形温度及び/又は射出
圧力を必要とするものを「×」、ポリカーブネート樹脂
よシ低い成形温度及び射出圧力で成形可能なものを「○
」で示した。
(5) Molding processability: ``x'' indicates that the molding process is performed using an injection molding machine and requires a molding temperature and/or injection pressure that is equal to or higher than that of polycarnate resin; Items that can be molded at the molding temperature and injection pressure are marked with "○".
”.

(6)耐油性: 試験片を室温のガソリンに24時間浸漬させ、クラック
発生のあるものを「×」、クラック発生のないものを「
○」で示した。
(6) Oil resistance: The test pieces were immersed in gasoline at room temperature for 24 hours, and those with cracks were rated "x", and those with no cracks were rated "x".
Indicated with ○.

(7)耐熱水注二 試験片を沸騰水中に24時間浸漬させクラック発生のあ
るものを「×」、クラック発生のないものを「○」で示
した。
(7) Hot water Note 2 test pieces were immersed in boiling water for 24 hours, and those with cracks were marked with an "x", and those with no cracks were marked with an "o".

Claims (1)

【特許請求の範囲】  A成分:芳香族ビニル単量体残基30−90重量%、
不飽和ジカルボン酸イミド誘導 体残基3〜70重量%、及びこれらの 基以外のビニル単量体残基0〜40重 量%からなるイミド化共重合体10〜 90重量部と、  B成分:ゴム状重合体3〜70重量%に芳香族ビニル
単量体30〜80重量%、シア ン化ビニル単量体0〜40重量%及び これらと共重合可能なビニル単量体0 〜40重量%がグラフト共重合したも ので、共重合体中のゴム状重合体の数 平均粒径が200mμ以下である共重 合体10〜90重量部 を含有してなる熱可塑性樹脂5〜95重量%と、C成分
:ポリカーボネート樹脂95〜5重量%からなるメッキ
性にすぐれた透明耐熱性熱可塑性樹脂組成物。
[Claims] Component A: 30-90% by weight of aromatic vinyl monomer residues,
10 to 90 parts by weight of an imidized copolymer consisting of 3 to 70% by weight of unsaturated dicarboxylic acid imide derivative residues and 0 to 40% by weight of vinyl monomer residues other than these groups, and component B: rubbery. 3 to 70% by weight of the polymer, 30 to 80% by weight of aromatic vinyl monomer, 0 to 40% by weight of vinyl cyanide monomer, and 0 to 40% by weight of vinyl monomer copolymerizable with these are grafted together. 5 to 95 weight % of a thermoplastic resin containing 10 to 90 parts by weight of a polymerized copolymer in which the number average particle size of the rubbery polymer in the copolymer is 200 mμ or less, and component C: A transparent heat-resistant thermoplastic resin composition with excellent plating properties consisting of 95 to 5% by weight of polycarbonate resin.
JP60157845A 1985-07-17 1985-07-17 Transparent, heat-resistant thermoplastic resin composition having excellent platability Pending JPS6218467A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60157845A JPS6218467A (en) 1985-07-17 1985-07-17 Transparent, heat-resistant thermoplastic resin composition having excellent platability

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60157845A JPS6218467A (en) 1985-07-17 1985-07-17 Transparent, heat-resistant thermoplastic resin composition having excellent platability

Publications (1)

Publication Number Publication Date
JPS6218467A true JPS6218467A (en) 1987-01-27

Family

ID=15658608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60157845A Pending JPS6218467A (en) 1985-07-17 1985-07-17 Transparent, heat-resistant thermoplastic resin composition having excellent platability

Country Status (1)

Country Link
JP (1) JPS6218467A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008246722A (en) * 2007-03-29 2008-10-16 Daicel Polymer Ltd Plated resin molding

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57125241A (en) * 1981-01-28 1982-08-04 Denki Kagaku Kogyo Kk Heat-resistant resin composition
JPS60141756A (en) * 1983-12-27 1985-07-26 アトランテイツク・リツチフイ−ルド・カンパニ− Polymer composition
JPS61174247A (en) * 1985-01-29 1986-08-05 Mitsubishi Rayon Co Ltd Heat-resistant, impact-resistant thermoplastic resin composition
JPS61179252A (en) * 1985-02-04 1986-08-11 Mitsubishi Rayon Co Ltd Thermoplastic resin composition having excellent resistance to heat and impact

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57125241A (en) * 1981-01-28 1982-08-04 Denki Kagaku Kogyo Kk Heat-resistant resin composition
JPS60141756A (en) * 1983-12-27 1985-07-26 アトランテイツク・リツチフイ−ルド・カンパニ− Polymer composition
JPS61174247A (en) * 1985-01-29 1986-08-05 Mitsubishi Rayon Co Ltd Heat-resistant, impact-resistant thermoplastic resin composition
JPS61179252A (en) * 1985-02-04 1986-08-11 Mitsubishi Rayon Co Ltd Thermoplastic resin composition having excellent resistance to heat and impact

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008246722A (en) * 2007-03-29 2008-10-16 Daicel Polymer Ltd Plated resin molding

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