JPS62177052U - - Google Patents
Info
- Publication number
- JPS62177052U JPS62177052U JP6529086U JP6529086U JPS62177052U JP S62177052 U JPS62177052 U JP S62177052U JP 6529086 U JP6529086 U JP 6529086U JP 6529086 U JP6529086 U JP 6529086U JP S62177052 U JPS62177052 U JP S62177052U
- Authority
- JP
- Japan
- Prior art keywords
- cooling body
- semiconductor
- semiconductor device
- utility
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims 4
- 238000006243 chemical reaction Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
Description
第１図及び第２図はそれぞれ本考案に関わる三
相一組で使用される半導体素子の構成の実施例を
示す概略側面図を、第３図及び第４図はそれぞれ
従来の三相一組で使用される半導体素子の異なつ
た構成を例示する概略側面図を表す。
１…半導体素子、２…冷却体、３，４…銅板。
1 and 2 are schematic side views showing an example of the configuration of a semiconductor element used in a three-phase set related to the present invention, and FIGS. 3 and 4 are respectively schematic side views of a conventional three-phase set. 1A and 1B represent schematic side views illustrating different configurations of semiconductor devices used in the present invention. 1... Semiconductor element, 2... Cooling body, 3, 4... Copper plate.
Claims (1)
装置に三相一組にして使用される半導体素子にお
いて、一組をなす如くに適宜の手段により相互に
密接して連結される標準化された冷却体に、３個
の半導体素子を密着して結合する如くにしてなる
ことを特徴とする三相一組で使用される半導体素
子。 (2) 実用新案登録請求の範囲第１項に記載の半
導体素子において、前記冷却体が熱伝導性に優れ
た金属板により一組をなす如くに相互に密接して
連結されるとともに、前記３個の半導体素子が前
記冷却体との間に前記金属板が介在する如くに該
金属板に密着して結合されることを特徴とする三
相一組で使用される半導体素子。 (3) 実用新案登録請求の範囲第２項に記載の半
導体素子において、前記金属板の幅寸法を変更す
ることにより任意に所用の外形寸法に適合させる
如くにしてなることを特徴とする三相一組にして
使用される半導体素子。[Claims for Utility Model Registration] (1) Semiconductor elements equipped with a cooling body and used as a three-phase set in a semiconductor conversion device such as an inverter, which are closely connected to each other by appropriate means to form a set. A semiconductor device used in a three-phase set, characterized in that three semiconductor devices are tightly coupled to a connected standardized cooling body. (2) Utility Model Registration In the semiconductor device according to claim 1, the cooling body is closely connected to each other as a pair by metal plates having excellent thermal conductivity, and 1. A semiconductor device used in a three-phase set, characterized in that the semiconductor devices are closely coupled to the metal plate such that the metal plate is interposed between the cooling body and the cooling body. (3) A three-phase semiconductor device according to claim 2 of the utility model registration claim, characterized in that the width of the metal plate can be changed to suit desired external dimensions. Semiconductor elements used as a set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6529086U JPS62177052U (en) | 1986-04-30 | 1986-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6529086U JPS62177052U (en) | 1986-04-30 | 1986-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62177052U true JPS62177052U (en) | 1987-11-10 |
Family
ID=30902223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6529086U Pending JPS62177052U (en) | 1986-04-30 | 1986-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62177052U (en) |
-
1986
- 1986-04-30 JP JP6529086U patent/JPS62177052U/ja active Pending
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