JPS62166551A - Ic lead bending press - Google Patents

Ic lead bending press

Info

Publication number
JPS62166551A
JPS62166551A JP794986A JP794986A JPS62166551A JP S62166551 A JPS62166551 A JP S62166551A JP 794986 A JP794986 A JP 794986A JP 794986 A JP794986 A JP 794986A JP S62166551 A JPS62166551 A JP S62166551A
Authority
JP
Japan
Prior art keywords
discharge
air
cylinder
pin
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP794986A
Other languages
English (en)
Inventor
Kunio Kato
Yukio Kato
Tatsuo Kimura
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP794986A priority Critical patent/JPS62166551A/ja
Priority claimed from KR1019860009593A external-priority patent/KR910001118B1/ko
Publication of JPS62166551A publication Critical patent/JPS62166551A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0092Treatment of the terminal leads as a separate operation
JP794986A 1986-01-20 1986-01-20 Ic lead bending press Pending JPS62166551A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP794986A JPS62166551A (en) 1986-01-20 1986-01-20 Ic lead bending press

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP794986A JPS62166551A (en) 1986-01-20 1986-01-20 Ic lead bending press
KR1019860009593A KR910001118B1 (ko) 1985-11-13 1986-11-13 Ic 시이트 절단 프레스 및 이를 이용한 ic 시이트 가공장치
US06/929,781 US4972572A (en) 1985-11-13 1986-11-13 IC sheet cutting press and IC sheet processing apparatus using the same
EP19860115753 EP0222401B1 (en) 1985-11-13 1986-11-13 IC sheet cutting press

Publications (1)

Publication Number Publication Date
JPS62166551A true JPS62166551A (en) 1987-07-23

Family

ID=11679745

Family Applications (1)

Application Number Title Priority Date Filing Date
JP794986A Pending JPS62166551A (en) 1986-01-20 1986-01-20 Ic lead bending press

Country Status (1)

Country Link
JP (1) JPS62166551A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04264762A (en) * 1991-02-20 1992-09-21 Nec Yamaguchi Ltd Lead forming mold
US5371694A (en) * 1992-05-01 1994-12-06 Sharp Kabushiki Kaisha Scientific calculator
CN102343407A (zh) * 2011-08-25 2012-02-08 铜陵三佳山田科技有限公司 一种用于集成电路的引脚成型模具

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5674949A (en) * 1979-11-22 1981-06-20 Hitachi Ltd Cutting of lead frame for semiconductor package & its device
JPS58222550A (en) * 1982-06-18 1983-12-24 Toshiba Corp Lead forming apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5674949A (en) * 1979-11-22 1981-06-20 Hitachi Ltd Cutting of lead frame for semiconductor package & its device
JPS58222550A (en) * 1982-06-18 1983-12-24 Toshiba Corp Lead forming apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04264762A (en) * 1991-02-20 1992-09-21 Nec Yamaguchi Ltd Lead forming mold
US5371694A (en) * 1992-05-01 1994-12-06 Sharp Kabushiki Kaisha Scientific calculator
CN102343407A (zh) * 2011-08-25 2012-02-08 铜陵三佳山田科技有限公司 一种用于集成电路的引脚成型模具

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