JPS62165087U - - Google Patents
Info
- Publication number
- JPS62165087U JPS62165087U JP1986049951U JP4995186U JPS62165087U JP S62165087 U JPS62165087 U JP S62165087U JP 1986049951 U JP1986049951 U JP 1986049951U JP 4995186 U JP4995186 U JP 4995186U JP S62165087 U JPS62165087 U JP S62165087U
- Authority
- JP
- Japan
- Prior art keywords
- plate material
- end surface
- laser welding
- welding device
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 9
- 238000003466 welding Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 description 2
Description
第1図および第2図はこの考案の一実施例を示
すもので、第1図はレーザ溶接装置の概略構成を
示す要部の縦断面図、第2図は冷却器を示す横断
面図、第3図は別の実施例を示す要部の縦断面図
、第4図および第5図は従来例を示すもので、第
4図はレーザ溶接装置の概略構成を示す斜視図、
第5図はレーザ溶接時の第1、第2の両金属板の
変形状態を示す側面図である。
14,15……第1、第2の金属板(第1、第
2の板材)、14b,15b……先端面、17,
18……冷却器。
Figures 1 and 2 show an embodiment of this invention, in which Figure 1 is a vertical cross-sectional view of the main parts showing a schematic configuration of a laser welding device, Figure 2 is a cross-sectional view showing a cooler, FIG. 3 is a longitudinal sectional view of the main part showing another embodiment, FIGS. 4 and 5 show a conventional example, and FIG. 4 is a perspective view showing the schematic configuration of the laser welding device.
FIG. 5 is a side view showing the deformed state of both the first and second metal plates during laser welding. 14, 15...first and second metal plates (first and second plate materials), 14b, 15b...tip surface, 17,
18...Cooler.
Claims (1)
させ、この状態で前記第1の板材の端面と第2の
板材の端面との当接部分にレーザ光を照射させて
このレーザ光によつて前記第1の板材の端面と第
2の板材の端面との当接部分を溶接するレーザ溶
接装置において、溶接作業時に前記第1の板材お
よび第2の板材をそれぞれ冷却する冷却器を設け
たことを特徴とするレーザ溶接装置。 The end surface of the first plate material and the end surface of the second plate material are brought into contact with each other, and in this state, a laser beam is irradiated onto the abutting portion of the end surface of the first plate material and the end surface of the second plate material. In a laser welding device that uses light to weld a contact portion between an end surface of the first plate material and an end surface of a second plate material, a cooler that cools the first plate material and the second plate material during welding work, respectively. A laser welding device characterized by being provided with.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986049951U JPS62165087U (en) | 1986-04-03 | 1986-04-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986049951U JPS62165087U (en) | 1986-04-03 | 1986-04-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62165087U true JPS62165087U (en) | 1987-10-20 |
Family
ID=30872873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986049951U Pending JPS62165087U (en) | 1986-04-03 | 1986-04-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62165087U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008044014A (en) * | 2006-08-11 | 2008-02-28 | Korea Atom Energ Res Inst | Laser welding apparatus for I-125 seed titanium tube and welding method thereby |
JP2015085345A (en) * | 2013-10-29 | 2015-05-07 | 株式会社ディスコ | Laser processing device |
JP2020145362A (en) * | 2019-03-08 | 2020-09-10 | 株式会社日本製鋼所 | Laser processing apparatus |
-
1986
- 1986-04-03 JP JP1986049951U patent/JPS62165087U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008044014A (en) * | 2006-08-11 | 2008-02-28 | Korea Atom Energ Res Inst | Laser welding apparatus for I-125 seed titanium tube and welding method thereby |
JP2015085345A (en) * | 2013-10-29 | 2015-05-07 | 株式会社ディスコ | Laser processing device |
JP2020145362A (en) * | 2019-03-08 | 2020-09-10 | 株式会社日本製鋼所 | Laser processing apparatus |