JPS62165071U - - Google Patents

Info

Publication number
JPS62165071U
JPS62165071U JP1986051750U JP5175086U JPS62165071U JP S62165071 U JPS62165071 U JP S62165071U JP 1986051750 U JP1986051750 U JP 1986051750U JP 5175086 U JP5175086 U JP 5175086U JP S62165071 U JPS62165071 U JP S62165071U
Authority
JP
Japan
Prior art keywords
soldering
laser
solder
irradiation angle
adjustment mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986051750U
Other languages
English (en)
Japanese (ja)
Other versions
JPH037072Y2 (forum.php
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986051750U priority Critical patent/JPH037072Y2/ja
Publication of JPS62165071U publication Critical patent/JPS62165071U/ja
Application granted granted Critical
Publication of JPH037072Y2 publication Critical patent/JPH037072Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1986051750U 1986-04-07 1986-04-07 Expired JPH037072Y2 (forum.php)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986051750U JPH037072Y2 (forum.php) 1986-04-07 1986-04-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986051750U JPH037072Y2 (forum.php) 1986-04-07 1986-04-07

Publications (2)

Publication Number Publication Date
JPS62165071U true JPS62165071U (forum.php) 1987-10-20
JPH037072Y2 JPH037072Y2 (forum.php) 1991-02-21

Family

ID=30876298

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986051750U Expired JPH037072Y2 (forum.php) 1986-04-07 1986-04-07

Country Status (1)

Country Link
JP (1) JPH037072Y2 (forum.php)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009128231A1 (ja) * 2008-04-14 2009-10-22 株式会社 東芝 レーザ溶接装置およびレーザ溶接方法
JP2010192570A (ja) * 2009-02-17 2010-09-02 Panasonic Corp レーザはんだ付け装置
JP2021041451A (ja) * 2019-09-13 2021-03-18 株式会社ジャパンユニックス はんだ付けヘッド
JP2023163755A (ja) * 2022-04-28 2023-11-10 パック テック－パッケージング テクノロジーズ ゲーエムベーハー 回路基板に電子部品をはんだ付けするための方法及び装置、コンピュータプログラム製品、並びにコンピュータ可読媒体

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940261A (forum.php) * 1972-08-25 1974-04-15
JPS54117998A (en) * 1978-03-06 1979-09-13 Toshiba Corp Laser working device
JPS56146831A (en) * 1980-04-14 1981-11-14 Hitachi Ltd Temperature controlling method for continuous heat treatment apparatus
JPS5717369A (en) * 1980-07-04 1982-01-29 Toshiba Corp Method for soldering by laser
JPS57111089A (en) * 1980-12-27 1982-07-10 Omron Tateisi Electronics Co Method of sodering chip part
JPS57193277A (en) * 1981-05-25 1982-11-27 Toshiba Corp Soldering device by laser
JPS58122175A (ja) * 1982-01-18 1983-07-20 Nec Corp ハンダ付け装置
JPS58161396A (ja) * 1982-03-19 1983-09-24 株式会社日立製作所 レ−ザビ−ムを用いた半田付け方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940261A (forum.php) * 1972-08-25 1974-04-15
JPS54117998A (en) * 1978-03-06 1979-09-13 Toshiba Corp Laser working device
JPS56146831A (en) * 1980-04-14 1981-11-14 Hitachi Ltd Temperature controlling method for continuous heat treatment apparatus
JPS5717369A (en) * 1980-07-04 1982-01-29 Toshiba Corp Method for soldering by laser
JPS57111089A (en) * 1980-12-27 1982-07-10 Omron Tateisi Electronics Co Method of sodering chip part
JPS57193277A (en) * 1981-05-25 1982-11-27 Toshiba Corp Soldering device by laser
JPS58122175A (ja) * 1982-01-18 1983-07-20 Nec Corp ハンダ付け装置
JPS58161396A (ja) * 1982-03-19 1983-09-24 株式会社日立製作所 レ−ザビ−ムを用いた半田付け方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009128231A1 (ja) * 2008-04-14 2009-10-22 株式会社 東芝 レーザ溶接装置およびレーザ溶接方法
US8445810B2 (en) 2008-04-14 2013-05-21 Kabushiki Kaisha Toshiba Laser welding apparatus
JP5306333B2 (ja) * 2008-04-14 2013-10-02 株式会社東芝 レーザ溶接装置およびレーザ溶接方法
JP2010192570A (ja) * 2009-02-17 2010-09-02 Panasonic Corp レーザはんだ付け装置
US8525072B2 (en) 2009-02-17 2013-09-03 Panasonic Corporation Laser soldering apparatus
JP2021041451A (ja) * 2019-09-13 2021-03-18 株式会社ジャパンユニックス はんだ付けヘッド
JP2023163755A (ja) * 2022-04-28 2023-11-10 パック テック－パッケージング テクノロジーズ ゲーエムベーハー 回路基板に電子部品をはんだ付けするための方法及び装置、コンピュータプログラム製品、並びにコンピュータ可読媒体

Also Published As

Publication number Publication date
JPH037072Y2 (forum.php) 1991-02-21

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