JPS62161511A - Method of dividing semiconductor device - Google Patents

Method of dividing semiconductor device

Info

Publication number
JPS62161511A
JPS62161511A JP459886A JP459886A JPS62161511A JP S62161511 A JPS62161511 A JP S62161511A JP 459886 A JP459886 A JP 459886A JP 459886 A JP459886 A JP 459886A JP S62161511 A JPS62161511 A JP S62161511A
Authority
JP
Japan
Prior art keywords
method
semiconductor device
dividing semiconductor
dividing
device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP459886A
Other versions
JPH0311602B2 (en
Inventor
Yasusuke Imai
Original Assignee
Sanyo Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co filed Critical Sanyo Electric Co
Priority to JP459886A priority Critical patent/JPH0311602B2/ja
Publication of JPS62161511A publication Critical patent/JPS62161511A/en
Publication of JPH0311602B2 publication Critical patent/JPH0311602B2/ja
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

Links

JP459886A 1986-01-13 1986-01-13 Expired - Lifetime JPH0311602B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP459886A JPH0311602B2 (en) 1986-01-13 1986-01-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP459886A JPH0311602B2 (en) 1986-01-13 1986-01-13

Publications (2)

Publication Number Publication Date
JPS62161511A true JPS62161511A (en) 1987-07-17
JPH0311602B2 JPH0311602B2 (en) 1991-02-18

Family

ID=11588482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP459886A Expired - Lifetime JPH0311602B2 (en) 1986-01-13 1986-01-13

Country Status (1)

Country Link
JP (1) JPH0311602B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999004419A1 (en) * 1997-07-17 1999-01-28 Rohm Co., Ltd. Process for manufacturing semiconductor wafer, process for manufacturing semiconductor chip, and ic card

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999004419A1 (en) * 1997-07-17 1999-01-28 Rohm Co., Ltd. Process for manufacturing semiconductor wafer, process for manufacturing semiconductor chip, and ic card
US6207473B1 (en) 1997-07-17 2001-03-27 Rohm Co., Ltd. Process for manufacturing semiconductor wafer, process for manufacturing semiconductor chip, and IC card
AU745483B2 (en) * 1997-07-17 2002-03-21 Rohm Co., Ltd. Process for manufacturing semiconductor wafer, process for manufacturing semic onductor chip, and IC card

Also Published As

Publication number Publication date
JPH0311602B2 (en) 1991-02-18

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