JPS62158867U - - Google Patents

Info

Publication number

JPS62158867U

JPS62158867U JP4700686U JP4700686U JPS62158867U JP S62158867 U JPS62158867 U JP S62158867U JP 4700686 U JP4700686 U JP 4700686U JP 4700686 U JP4700686 U JP 4700686U JP S62158867 U JPS62158867 U JP S62158867U

Authority

JP

Japan

Prior art keywords

layer material

inner layer

wiring board

printed wiring

multilayer printed

Prior art date

1986-03-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000463 material Substances 0.000 claims description 8
• 239000000758 substrate Substances 0.000 claims description 2
• 239000002023 wood Substances 0.000 claims 1
• 239000004020 conductor Substances 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000004809 Teflon Substances 0.000 description 1
• 229920006362 Teflon® Polymers 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1