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JPS62149885A - Chemical copper plating solution - Google Patents

Chemical copper plating solution

Info

Publication number
JPS62149885A
JPS62149885A JP29006985A JP29006985A JPS62149885A JP S62149885 A JPS62149885 A JP S62149885A JP 29006985 A JP29006985 A JP 29006985A JP 29006985 A JP29006985 A JP 29006985A JP S62149885 A JPS62149885 A JP S62149885A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
surfactant
copper
plating
soln
contg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29006985A
Other versions
JPH0639714B2 (en )
Inventor
Hiromichi Kogure
Mutsuo Yoshizawa
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents

Abstract

PURPOSE:To deposit a flexible copper film by plating with a chemical copper plating soln. in a time corresponding to 1/5-1/6 of the conventional time by adding specified amounts of a nonionic surfactant and a surfactant contg. fluorine to the plating soln. CONSTITUTION:An aqueous soln. contg. a copper salt, a complexing agent, a reducing agent, a pH adjusting agent, a stabilizer and a surfactant is prepd. as a chemical copper plating soln. At this time, 1-50mg/l nonionic surfactant and 10-100mg/l surfactant contg. fluorine are added as the surfactant. A polyoxyethylene deriv. is preferably used as the nonionic surfactant and perfluoroalkylsulfonate or perfluoroalkylcarboxylate as the surfactant contg. fluorine.
JP29006985A 1985-12-23 1985-12-23 Chemical copper-plated solution Expired - Lifetime JPH0639714B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29006985A JPH0639714B2 (en) 1985-12-23 1985-12-23 Chemical copper-plated solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29006985A JPH0639714B2 (en) 1985-12-23 1985-12-23 Chemical copper-plated solution

Publications (2)

Publication Number Publication Date
JPS62149885A true true JPS62149885A (en) 1987-07-03
JPH0639714B2 JPH0639714B2 (en) 1994-05-25

Family

ID=17751384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29006985A Expired - Lifetime JPH0639714B2 (en) 1985-12-23 1985-12-23 Chemical copper-plated solution

Country Status (1)

Country Link
JP (1) JPH0639714B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0293076A (en) * 1988-09-29 1990-04-03 Sanko Tokushu Kinzoku Kogyo Kk Production of fine metal body utilized for electroless plating
US7717060B2 (en) 2004-11-22 2010-05-18 Freescale Semiconductor, Inc. Controlled electroless plating

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5933185A (en) * 1982-08-19 1984-02-22 Ricoh Co Ltd Heat-sensitive transfer medium
JPS6033358A (en) * 1983-08-04 1985-02-20 Hitachi Chem Co Ltd Electroless copper plating liquid

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5933185A (en) * 1982-08-19 1984-02-22 Ricoh Co Ltd Heat-sensitive transfer medium
JPS6033358A (en) * 1983-08-04 1985-02-20 Hitachi Chem Co Ltd Electroless copper plating liquid

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0293076A (en) * 1988-09-29 1990-04-03 Sanko Tokushu Kinzoku Kogyo Kk Production of fine metal body utilized for electroless plating
US7717060B2 (en) 2004-11-22 2010-05-18 Freescale Semiconductor, Inc. Controlled electroless plating

Also Published As

Publication number Publication date Type
JPH0639714B2 (en) 1994-05-25 grant
JP1914107C (en) grant

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