JPS62134212U - - Google Patents
Info
- Publication number
- JPS62134212U JPS62134212U JP2173386U JP2173386U JPS62134212U JP S62134212 U JPS62134212 U JP S62134212U JP 2173386 U JP2173386 U JP 2173386U JP 2173386 U JP2173386 U JP 2173386U JP S62134212 U JPS62134212 U JP S62134212U
- Authority
- JP
- Japan
- Prior art keywords
- ground
- coil
- board
- substrate
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Coils Or Transformers For Communication (AREA)
- Filters And Equalizers (AREA)
Description
第１図Ａは本考案の積層コイルの一実施例を示
す斜視図、第１図Ｂはその分解斜視図、第２図は
コイル基板の変形例を示す平面図、第３図Ａは従
来の積層コイルを示す斜視図、第３図Ｂはその分
解斜視図である。
６……コイル基板、７……コイルパターン、８
，１４……コイル用スルーホール、９，１２……
グラウンド用スルーホール、１０……グラウンド
基板、１１……グラウンドパターン、１３……コ
イル接続パターン、１５ａ，１５ｂ……コ字型コ
ア、１６ａ，１６ｂ，１６ｃ……リード線。
Fig. 1A is a perspective view showing an embodiment of the laminated coil of the present invention, Fig. 1B is an exploded perspective view thereof, Fig. 2 is a plan view showing a modification of the coil substrate, and Fig. 3A is a conventional one. FIG. 3B is a perspective view showing the laminated coil, and FIG. 3B is an exploded perspective view thereof. 6...Coil board, 7...Coil pattern, 8
, 14... Coil through hole, 9, 12...
Through hole for ground, 10... Ground board, 11... Ground pattern, 13... Coil connection pattern, 15a, 15b... U-shaped core, 16a, 16b, 16c... Lead wire.
Claims (1)
と、表面のほぼ全域にグラウンドパターンの形成
されたグラウンド基板とを交互に複数枚積層する
とともに、１枚おきに積層されたコイル基板のコ
イルパターンを、コイル基板およびグラウンド基
板を貫いて形成されたスルーホールによつて電気
的に接続し、また１枚おきに積層されたグラウン
ド基板のグラウンドパターンを、コイル基板およ
びグラウンド基板を貫いて形成されたスルホール
によつて電気的に接続し、かつ接地できるように
してなる積層コイル。 A plurality of coil substrates with a coil pattern formed on the surface and a ground substrate with a ground pattern formed on almost the entire surface are laminated alternately, and the coil pattern of every other layered coil substrate is The circuit board and the ground board are electrically connected by through holes formed through them, and the ground patterns of the ground boards stacked on every other board are connected through the through holes formed through the coil board and the ground board. A laminated coil that can be electrically connected and grounded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2173386U JPS62134212U (en) | 1986-02-17 | 1986-02-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2173386U JPS62134212U (en) | 1986-02-17 | 1986-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62134212U true JPS62134212U (en) | 1987-08-24 |
Family
ID=30818445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2173386U Pending JPS62134212U (en) | 1986-02-17 | 1986-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62134212U (en) |
-
1986
- 1986-02-17 JP JP2173386U patent/JPS62134212U/ja active Pending
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