JPS62133382U - - Google Patents

Info

Publication number

JPS62133382U

JPS62133382U JP1986021611U JP2161186U JPS62133382U JP S62133382 U JPS62133382 U JP S62133382U JP 1986021611 U JP1986021611 U JP 1986021611U JP 2161186 U JP2161186 U JP 2161186U JP S62133382 U JPS62133382 U JP S62133382U

Authority

JP

Japan

Prior art keywords

electrical component

mounting board

connection wire

component mounting

connection

Prior art date

1986-02-18

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000853 adhesive Substances 0.000 claims description 2
• 230000001070 adhesive effect Effects 0.000 claims description 2
• 238000005476 soldering Methods 0.000 claims 1
• 229910000679 solder Inorganic materials 0.000 description 1

Cited By (1)