JPS62128636U - - Google Patents

Info

Publication number
JPS62128636U
JPS62128636U JP1588686U JP1588686U JPS62128636U JP S62128636 U JPS62128636 U JP S62128636U JP 1588686 U JP1588686 U JP 1588686U JP 1588686 U JP1588686 U JP 1588686U JP S62128636 U JPS62128636 U JP S62128636U
Authority
JP
Japan
Prior art keywords
semiconductor
heat dissipation
sealed
molded
electrode lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1588686U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1588686U priority Critical patent/JPS62128636U/ja
Publication of JPS62128636U publication Critical patent/JPS62128636U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1588686U 1986-02-04 1986-02-04 Pending JPS62128636U (US07754267-20100713-C00017.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1588686U JPS62128636U (US07754267-20100713-C00017.png) 1986-02-04 1986-02-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1588686U JPS62128636U (US07754267-20100713-C00017.png) 1986-02-04 1986-02-04

Publications (1)

Publication Number Publication Date
JPS62128636U true JPS62128636U (US07754267-20100713-C00017.png) 1987-08-14

Family

ID=30807232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1588686U Pending JPS62128636U (US07754267-20100713-C00017.png) 1986-02-04 1986-02-04

Country Status (1)

Country Link
JP (1) JPS62128636U (US07754267-20100713-C00017.png)

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