JPS62126845U - - Google Patents

Info

Publication number
JPS62126845U
JPS62126845U JP1314986U JP1314986U JPS62126845U JP S62126845 U JPS62126845 U JP S62126845U JP 1314986 U JP1314986 U JP 1314986U JP 1314986 U JP1314986 U JP 1314986U JP S62126845 U JPS62126845 U JP S62126845U
Authority
JP
Japan
Prior art keywords
resin
sealed
semiconductor
lead
base part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1314986U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1314986U priority Critical patent/JPS62126845U/ja
Publication of JPS62126845U publication Critical patent/JPS62126845U/ja
Pending legal-status Critical Current

Links

JP1314986U 1986-01-31 1986-01-31 Pending JPS62126845U (US20020051482A1-20020502-M00020.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1314986U JPS62126845U (US20020051482A1-20020502-M00020.png) 1986-01-31 1986-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1314986U JPS62126845U (US20020051482A1-20020502-M00020.png) 1986-01-31 1986-01-31

Publications (1)

Publication Number Publication Date
JPS62126845U true JPS62126845U (US20020051482A1-20020502-M00020.png) 1987-08-12

Family

ID=30801939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1314986U Pending JPS62126845U (US20020051482A1-20020502-M00020.png) 1986-01-31 1986-01-31

Country Status (1)

Country Link
JP (1) JPS62126845U (US20020051482A1-20020502-M00020.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000075991A1 (en) * 1999-06-03 2000-12-14 Tokyo R & D Co., Ltd. Power feed and heat dissipating device for power semiconductor devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000075991A1 (en) * 1999-06-03 2000-12-14 Tokyo R & D Co., Ltd. Power feed and heat dissipating device for power semiconductor devices

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