JPS62126842U - - Google Patents
Info
- Publication number
- JPS62126842U JPS62126842U JP1986012574U JP1257486U JPS62126842U JP S62126842 U JPS62126842 U JP S62126842U JP 1986012574 U JP1986012574 U JP 1986012574U JP 1257486 U JP1257486 U JP 1257486U JP S62126842 U JPS62126842 U JP S62126842U
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- semiconductor device
- wiring
- board
- supply wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986012574U JPS62126842U (US07534539-20090519-C00280.png) | 1986-01-31 | 1986-01-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986012574U JPS62126842U (US07534539-20090519-C00280.png) | 1986-01-31 | 1986-01-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62126842U true JPS62126842U (US07534539-20090519-C00280.png) | 1987-08-12 |
Family
ID=30800830
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986012574U Pending JPS62126842U (US07534539-20090519-C00280.png) | 1986-01-31 | 1986-01-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62126842U (US07534539-20090519-C00280.png) |
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1986
- 1986-01-31 JP JP1986012574U patent/JPS62126842U/ja active Pending