JPS62118440U - - Google Patents

Info

Publication number
JPS62118440U
JPS62118440U JP532586U JP532586U JPS62118440U JP S62118440 U JPS62118440 U JP S62118440U JP 532586 U JP532586 U JP 532586U JP 532586 U JP532586 U JP 532586U JP S62118440 U JPS62118440 U JP S62118440U
Authority
JP
Japan
Prior art keywords
insulating film
metal substrates
conductive path
integrated circuit
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP532586U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0423323Y2 (US06623731-20030923-C00012.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP532586U priority Critical patent/JPH0423323Y2/ja
Publication of JPS62118440U publication Critical patent/JPS62118440U/ja
Application granted granted Critical
Publication of JPH0423323Y2 publication Critical patent/JPH0423323Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP532586U 1986-01-17 1986-01-17 Expired JPH0423323Y2 (US06623731-20030923-C00012.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP532586U JPH0423323Y2 (US06623731-20030923-C00012.png) 1986-01-17 1986-01-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP532586U JPH0423323Y2 (US06623731-20030923-C00012.png) 1986-01-17 1986-01-17

Publications (2)

Publication Number Publication Date
JPS62118440U true JPS62118440U (US06623731-20030923-C00012.png) 1987-07-28
JPH0423323Y2 JPH0423323Y2 (US06623731-20030923-C00012.png) 1992-05-29

Family

ID=30786803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP532586U Expired JPH0423323Y2 (US06623731-20030923-C00012.png) 1986-01-17 1986-01-17

Country Status (1)

Country Link
JP (1) JPH0423323Y2 (US06623731-20030923-C00012.png)

Also Published As

Publication number Publication date
JPH0423323Y2 (US06623731-20030923-C00012.png) 1992-05-29

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