JPS62116572U - - Google Patents

Info

Publication number

JPS62116572U

JPS62116572U JP389586U JP389586U JPS62116572U JP S62116572 U JPS62116572 U JP S62116572U JP 389586 U JP389586 U JP 389586U JP 389586 U JP389586 U JP 389586U JP S62116572 U JPS62116572 U JP S62116572U

Authority

JP

Japan

Prior art keywords

heat dissipation

copper

wiring board

printed wiring

pattern

Prior art date

1986-01-13

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 230000017525 heat dissipation Effects 0.000 claims description 5
• 239000000758 substrate Substances 0.000 claims description 2
• 239000004020 conductor Substances 0.000 claims 1
• 238000005476 soldering Methods 0.000 claims 1
• 229910000679 solder Inorganic materials 0.000 description 2

Cited By (1)