JPS62104449U - - Google Patents
Info
- Publication number
- JPS62104449U JPS62104449U JP19671285U JP19671285U JPS62104449U JP S62104449 U JPS62104449 U JP S62104449U JP 19671285 U JP19671285 U JP 19671285U JP 19671285 U JP19671285 U JP 19671285U JP S62104449 U JPS62104449 U JP S62104449U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- rivet
- eyelet
- metal plate
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000004519 grease Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19671285U JPS62104449U (https=) | 1985-12-20 | 1985-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19671285U JPS62104449U (https=) | 1985-12-20 | 1985-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62104449U true JPS62104449U (https=) | 1987-07-03 |
Family
ID=31155786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19671285U Pending JPS62104449U (https=) | 1985-12-20 | 1985-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62104449U (https=) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013219244A (ja) * | 2012-04-10 | 2013-10-24 | Mitsubishi Electric Corp | 半導体装置の半導体モジュールの固定方法 |
| JP2013225556A (ja) * | 2012-04-20 | 2013-10-31 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
| JP2014033119A (ja) * | 2012-08-06 | 2014-02-20 | Mitsubishi Electric Corp | 半導体装置 |
| JP2016162992A (ja) * | 2015-03-05 | 2016-09-05 | 三菱電機株式会社 | パワー半導体装置 |
-
1985
- 1985-12-20 JP JP19671285U patent/JPS62104449U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013219244A (ja) * | 2012-04-10 | 2013-10-24 | Mitsubishi Electric Corp | 半導体装置の半導体モジュールの固定方法 |
| JP2013225556A (ja) * | 2012-04-20 | 2013-10-31 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
| JP2014033119A (ja) * | 2012-08-06 | 2014-02-20 | Mitsubishi Electric Corp | 半導体装置 |
| JP2016162992A (ja) * | 2015-03-05 | 2016-09-05 | 三菱電機株式会社 | パワー半導体装置 |
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