JPS6181142U - - Google Patents
Info
- Publication number
- JPS6181142U JPS6181142U JP16704384U JP16704384U JPS6181142U JP S6181142 U JPS6181142 U JP S6181142U JP 16704384 U JP16704384 U JP 16704384U JP 16704384 U JP16704384 U JP 16704384U JP S6181142 U JPS6181142 U JP S6181142U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- solder
- electrode plate
- metal electrode
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16704384U JPS6181142U (US07847105-20101207-C00016.png) | 1984-11-02 | 1984-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16704384U JPS6181142U (US07847105-20101207-C00016.png) | 1984-11-02 | 1984-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6181142U true JPS6181142U (US07847105-20101207-C00016.png) | 1986-05-29 |
Family
ID=30724845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16704384U Pending JPS6181142U (US07847105-20101207-C00016.png) | 1984-11-02 | 1984-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6181142U (US07847105-20101207-C00016.png) |
-
1984
- 1984-11-02 JP JP16704384U patent/JPS6181142U/ja active Pending
