JPS6177498A - Ultrasonic probe and manufacturing method - Google Patents
Ultrasonic probe and manufacturing methodInfo
- Publication number
- JPS6177498A JPS6177498A JP59198546A JP19854684A JPS6177498A JP S6177498 A JPS6177498 A JP S6177498A JP 59198546 A JP59198546 A JP 59198546A JP 19854684 A JP19854684 A JP 19854684A JP S6177498 A JPS6177498 A JP S6177498A
- Authority
- JP
- Japan
- Prior art keywords
- composite piezoelectric
- ultrasonic probe
- sound wave
- wave absorber
- piezoelectric body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 239000002131 composite material Substances 0.000 claims abstract description 22
- 239000000853 adhesive Substances 0.000 claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 claims abstract description 14
- 239000000919 ceramic Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 13
- 239000006096 absorbing agent Substances 0.000 claims description 11
- 238000002604 ultrasonography Methods 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000011368 organic material Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 6
- 229910052845 zircon Inorganic materials 0.000 abstract description 4
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 abstract description 4
- 239000004593 Epoxy Substances 0.000 abstract description 3
- 239000004814 polyurethane Substances 0.000 abstract description 3
- 229920002635 polyurethane Polymers 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 abstract 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
- B06B1/0629—Square array
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は超音波診断装置に係り、特に複合圧電°体を用
いてセンサ一部を構成した超電波探触子とその製造方法
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to an ultrasonic diagnostic device, and more particularly to an ultrasonic probe in which a portion of the sensor is constructed using a composite piezoelectric material, and a method for manufacturing the same.
特開昭５７−３２２００に記載された超電波探触子では
振動子を導電性接着剤で導電性支持体に接着し。In the ultrasound probe described in JP-A-57-32200, a vibrator is bonded to a conductive support using a conductive adhesive.
マトリクス状に振動子を切断し、信号電極側が前面、ア
ース電極側が後面の超電波探触子を構成している。した
がってこの例では、比較的簡単に複合圧電体による超電
波探触子を実現できるが、支持体が導体であることや信
号電極が前面に形成されるという制約のある植成となっ
ていた。The transducer is cut into a matrix, and the signal electrode side is the front side, and the ground electrode side is the back side, forming an ultrasound probe. Therefore, in this example, although it is possible to realize an ultrasound probe using a composite piezoelectric material relatively easily, the implantation is limited in that the support is a conductor and the signal electrode is formed on the front surface.
本発明の目的は、複合圧電体を用いて簡単に構成される
性能のよい超電波探触子を提供することにある。An object of the present invention is to provide a high-performance ultrasound probe that is simply constructed using a composite piezoelectric material.
本発明の特徴は、ジルコン・チタン酸鉛系セラミックス
などの圧電体を導電性接着剤などにより音波吸収体上に
接着し、ダイシングソーなどによリマトリクス状に振動
子を切断し、複合圧電体による撮動子ブロックを作り探
触子を構成する。このとき、振動子ブロック間には音波
吸収体に到達する切断溝が形成され、信号電極側は後面
となり、さらに導電性接着剤と音波吸収体との音響イン
ピーダンスはほぼ等しくされ、導電性接着剤中の超音波
の不要反射が低減された構成となっている。A feature of the present invention is that a piezoelectric material such as zircon/lead titanate-based ceramics is bonded onto a sound wave absorber using a conductive adhesive, etc., and the vibrator is cut into a rematrix shape using a dicing saw or the like. Create an imager block and configure the probe. At this time, cutting grooves that reach the sound wave absorber are formed between the transducer blocks, the signal electrode side becomes the rear surface, and the acoustic impedance of the conductive adhesive and the sound wave absorber are made almost equal, and the conductive adhesive The structure reduces unnecessary reflections of the ultrasonic waves inside.
〔発明の実施例〕
本発明で対象としている複合圧電体１０１の構成を第１
図に示す。１０２はジルコン・チタン酸鉛系セラミック
スなどの柱状圧電体であり、１０３はエポキシ、ポリウ
レタンなどの樹脂である。この形式の複合圧電体は、特
開昭５８−２１８８３などで示される方法で形成するこ
とが可能である。[Embodiment of the Invention] The structure of the composite piezoelectric body 101 targeted by the present invention is described in the first embodiment.
As shown in the figure. 102 is a columnar piezoelectric material such as zircon/lead titanate ceramics, and 103 is a resin such as epoxy or polyurethane. This type of composite piezoelectric body can be formed by the method disclosed in Japanese Patent Laid-Open No. 58-21883.
以下、本発明の一実施例を第２図により説明する。これ
は電子リニア超電波探触子へ適用した例であり、ジルコ
ン・チタン酸鉛系セラミックスなどの振動子２０１を導
電性接着剤２０２により音波吸収体２０３に接着した後
、ダイシングソーなどにより２次元的に切断して、柱状
圧電体２０４を形成し、さらにその切断溝にエポキシ、
ポリウレタンなどの樹脂２０５を充填したものである。An embodiment of the present invention will be described below with reference to FIG. This is an example of application to an electronic linear ultrasound probe, in which a vibrator 201 made of zircon/lead titanate ceramics is bonded to a sound wave absorber 203 with a conductive adhesive 202, and then a two-dimensional The columnar piezoelectric body 204 is formed by cutting the columnar piezoelectric body 204, and the cut groove is filled with epoxy,
It is filled with resin 205 such as polyurethane.
ここでは、３列の柱状圧電体と樹脂により形成される複
合圧電体２０６が短冊状の振動子ブロック２０７．２０
８．・・・を形成する。振動子ブロック内では、切断溝
は２０２内にとどめられ２ｏ９゜各振動子ブロックを分
離する切断溝は２０３に到達する２１０゜
さらに信号線の取り出しは、露出している電極部２１１
などから取り出せばよい。また前面にアース側電極を金
・クロムの蒸着や導電性接着剤をスクリーン印刷するこ
となどにより形成する。このアース電極の形成に際して
は、２１１などに絶縁物を形成するなどして、信号電極
とアース電極が接続しないようすることはいうまでもな
い。以上、電子リニア探触子への適用について述べたが
、他の探触子についても適用可能である。２１０を形成
せず、２０９だけであれば信号電極は１つの共通電極と
なる。このときアース電極の形状を円や楕円または多重
リングなどにすれば２通常の円形、楕円形多重リングの
探触子に対応する複合圧電体による探触子が構成される
。また２１０を２次元的に形成すれば、複合圧電体によ
る２次元探触子と構成できる。Here, a composite piezoelectric body 206 formed of three rows of columnar piezoelectric bodies and resin is connected to a rectangular vibrator block 207.20.
8. ... to form. Inside the transducer block, the cutting grooves are kept within 202 and 2o9 degrees, and the cutting grooves that separate each transducer block reach 203 at 210 degrees.
You can take it out from etc. In addition, a ground-side electrode is formed on the front surface by vapor deposition of gold and chromium or screen printing with conductive adhesive. When forming this ground electrode, it goes without saying that an insulating material is formed on 211, etc., so that the signal electrode and the ground electrode are not connected to each other. Although the application to an electronic linear probe has been described above, it is also applicable to other probes. If 210 is not formed and only 209 is provided, the signal electrode becomes one common electrode. At this time, if the shape of the ground electrode is made into a circle, an ellipse, or a multi-ring, a probe made of a composite piezoelectric material corresponding to two normal circular or elliptical multi-ring probes is constructed. Furthermore, if 210 is formed two-dimensionally, it can be configured as a two-dimensional probe made of a composite piezoelectric material.
また、音波吸収体が凸面や凹面にすることも可能である
が、このときは切断が困難となる。また前面の電極を信
号側、後面の電極をアース側として使うことも可能であ
る。It is also possible for the sound wave absorber to have a convex or concave surface, but in this case it will be difficult to cut. It is also possible to use the front electrode as the signal side and the rear electrode as the ground side.
さらにこの発明では導電性接着剤の厚みがかなり厚くな
るが、このままでは導電性接着剤層での超音波の不要反
射が生じ問題となる。そこで導電性接着剤と音波吸収体
の音響インピーダンスをほぼ同一にすることで不要反射
をなくすことが可能である。Furthermore, in the present invention, the thickness of the conductive adhesive is considerably thickened, but if this continues, unnecessary reflection of ultrasonic waves from the conductive adhesive layer may occur, which poses a problem. Therefore, it is possible to eliminate unnecessary reflection by making the acoustic impedance of the conductive adhesive and the sound wave absorber almost the same.
このように、本発明によれば１種々の構成の複合圧電体
による性能のよい超電波探触子を簡単に実現することが
可能である。As described above, according to the present invention, it is possible to easily realize a high-performance ultrasound probe using a composite piezoelectric material having one of various configurations.
本発明によれば、複合圧電体による性能の良い超電波探
触子を容易に実現することができるので。According to the present invention, it is possible to easily realize a high-performance ultrasound probe using a composite piezoelectric material.
非常に有用性が高い。Very useful.
第１図は複合圧電体の立体図、第２図は本発明による複
合圧電体電子リニア超電波探触子の構成を示す立体図で
ある。
１０１．２０６・・・複合圧電体、１０２，２０４・・
・柱状圧電体、１０３，２０５・・・樹脂、２０１・・
・圧電セラミックス、２０２・・・導電性接着剤、２０
３・・・音波吸収体、２０７，２０８・・・複合圧電体
振動子ブロック、２０９，２１０・・・切断溝、２１１
・・・露出電極部。
第２０
（ｇ）FIG. 1 is a three-dimensional diagram of a composite piezoelectric material, and FIG. 2 is a three-dimensional diagram showing the configuration of a composite piezoelectric electronic linear ultrasound probe according to the present invention. 101.206... Composite piezoelectric material, 102,204...
・Columnar piezoelectric body, 103, 205...resin, 201...
・Piezoelectric ceramics, 202... Conductive adhesive, 20
3... Sound wave absorber, 207, 208... Composite piezoelectric vibrator block, 209, 210... Cutting groove, 211
...Exposed electrode part. 20th (g)
Claims (1)
れた複合圧電体を用いた超音波探触子において、絶縁物
より成る音波吸収体と、導電性を有する接着剤の層を介
して前記音波吸収体上に配列された複数のブロック状の
複合圧電体と、前記複合圧電体の上面に形成されたアー
ス電極とを有し、前記接着剤の層は前記複数の複合圧電
体のブロックごとに分離され、それぞれが信号電極を構
成していることを特徴とする超電波探触子。 ２、前記接続剤の層と前記音波吸収体との音響インピー
ダンスとかほぼ等しいことを特徴とする特許請求の範囲
第１項記載の超音波探触子。 ３、絶縁物より成る音波吸収体に圧電セラミックス板を
導電性を有する接着剤にて接着する第１の工程と、前記
圧電セラミックス板に多数の切断溝を形成する第２の工
程と、前記第２の工程により形成された溝に有機物をう
め込む第３の工程を含み、前記第２の工程では前記接着
剤の層を切断しない第１の深さの溝と、前記接着剤の層
を切断する第２の深さの溝の２種類の溝を形成し、前記
第２の深さの溝により分離された複数のブロックの複合
圧電体を得ることを特徴とする超音波探触子の製造方法
。[Claims] 1. An ultrasonic probe using a composite piezoelectric material in which a large number of columnar piezoelectric ceramics are embedded in an organic material, which includes a sound wave absorber made of an insulating material and a conductive adhesive. It has a plurality of block-shaped composite piezoelectric bodies arranged on the sound wave absorber through layers, and a ground electrode formed on the upper surface of the composite piezoelectric body, and the adhesive layer is arranged on the plurality of composite piezoelectric bodies. An ultrasound probe characterized by being separated into piezoelectric blocks, each of which constitutes a signal electrode. 2. The ultrasonic probe according to claim 1, wherein the connecting agent layer and the sound wave absorber have approximately the same acoustic impedance. 3. A first step of bonding a piezoelectric ceramic plate to a sound wave absorber made of an insulating material with a conductive adhesive; a second step of forming a large number of cutting grooves on the piezoelectric ceramic plate; a third step of filling an organic substance into the groove formed in step 2, the groove having a first depth in which the adhesive layer is not cut in the second step; and the adhesive layer is cut. manufacturing an ultrasonic probe characterized by forming two types of grooves of a second depth, and obtaining a plurality of blocks of composite piezoelectric material separated by the grooves of the second depth. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59198546A JPH0640679B2 (en) | 1984-09-25 | 1984-09-25 | Ultrasonic probe manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59198546A JPH0640679B2 (en) | 1984-09-25 | 1984-09-25 | Ultrasonic probe manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6177498A true JPS6177498A (en) | 1986-04-21 |
| JPH0640679B2 JPH0640679B2 (en) | 1994-05-25 |
Family
ID=16392960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59198546A Expired - Fee Related JPH0640679B2 (en) | 1984-09-25 | 1984-09-25 | Ultrasonic probe manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0640679B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02246957A (en) * | 1989-03-20 | 1990-10-02 | Hitachi Medical Corp | Ultrasonic diagnostic device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5822046A (en) * | 1981-08-03 | 1983-02-09 | 株式会社日立メディコ | Ultrasonic probe |
-
1984
- 1984-09-25 JP JP59198546A patent/JPH0640679B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5822046A (en) * | 1981-08-03 | 1983-02-09 | 株式会社日立メディコ | Ultrasonic probe |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02246957A (en) * | 1989-03-20 | 1990-10-02 | Hitachi Medical Corp | Ultrasonic diagnostic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0640679B2 (en) | 1994-05-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |