JPS617746B2 - - Google Patents
Info
- Publication number
- JPS617746B2 JPS617746B2 JP13833576A JP13833576A JPS617746B2 JP S617746 B2 JPS617746 B2 JP S617746B2 JP 13833576 A JP13833576 A JP 13833576A JP 13833576 A JP13833576 A JP 13833576A JP S617746 B2 JPS617746 B2 JP S617746B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13833576A JPS5363979A (en) | 1976-11-19 | 1976-11-19 | Sealing method of semiconductor element and lead frame used for the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13833576A JPS5363979A (en) | 1976-11-19 | 1976-11-19 | Sealing method of semiconductor element and lead frame used for the same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58216183A Division JPS59130451A (ja) | 1983-11-18 | 1983-11-18 | リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5363979A JPS5363979A (en) | 1978-06-07 |
| JPS617746B2 true JPS617746B2 (de) | 1986-03-08 |
Family
ID=15219493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13833576A Granted JPS5363979A (en) | 1976-11-19 | 1976-11-19 | Sealing method of semiconductor element and lead frame used for the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5363979A (de) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5559749A (en) * | 1978-10-27 | 1980-05-06 | Hitachi Ltd | Lead frame |
| JPS57164554A (en) * | 1981-04-01 | 1982-10-09 | Matsushita Electronics Corp | Lead-frame for semiconductor device |
| JPS60141146U (ja) * | 1984-02-27 | 1985-09-18 | 三洋電機株式会社 | リ−ドフレ−ム |
| JPS60121751A (ja) * | 1984-07-25 | 1985-06-29 | Hitachi Ltd | 半導体装置の製法 |
| JPS61258462A (ja) * | 1986-05-23 | 1986-11-15 | Hitachi Ltd | 電子部品の組立方法 |
| JPS61258461A (ja) * | 1986-05-23 | 1986-11-15 | Hitachi Ltd | 電子部品 |
| JPS61258460A (ja) * | 1986-05-23 | 1986-11-15 | Hitachi Ltd | 電子部品用リードフレーム |
| JPS62252959A (ja) * | 1987-03-20 | 1987-11-04 | Hitachi Ltd | リ−ドフレ−ム |
| US4937656A (en) * | 1988-04-22 | 1990-06-26 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
-
1976
- 1976-11-19 JP JP13833576A patent/JPS5363979A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5363979A (en) | 1978-06-07 |