JPS6175724A - Directional change device for integrated circuit - Google Patents

Directional change device for integrated circuit

Info

Publication number
JPS6175724A
JPS6175724A JP59194983A JP19498384A JPS6175724A JP S6175724 A JPS6175724 A JP S6175724A JP 59194983 A JP59194983 A JP 59194983A JP 19498384 A JP19498384 A JP 19498384A JP S6175724 A JPS6175724 A JP S6175724A
Authority
JP
Japan
Prior art keywords
integrated circuit
cylindrical frame
electromagnet
air
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59194983A
Other languages
Japanese (ja)
Inventor
Hiroaki Takahashi
高橋　廣秋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP59194983A priority Critical patent/JPS6175724A/en
Publication of JPS6175724A publication Critical patent/JPS6175724A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
    • B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Attitude Control For Articles On Conveyors (AREA)

Abstract

PURPOSE:To automatically change the direction of an integrated circuit by previously magnetizing an integrated circuit in a fixed direction, and working air force and magnetic force upon the integrated circuit, with the circuit accommodated in a cylindrical frame to uniformly arrange the direction of the integrated circuit. CONSTITUTION:An integrated circuit is previously magnetized in direction of an arrow (d) and fed into a transport path 2. When the integrated circuit 1 reaches a directional change portion of the transport path 2, a cylindrical frame 3 formed by a non-magnetic body is lowered to accommodate the integrat ed circuit 1 in the frame. After the cylindrical frame 3 contacts the transport path 2, high-pressure air is jetted out from an air supply opening 4, whereby air pressure works in the cylindrical frame 3 to float the integrated circuit 1. Subsequently, a switch 6 is turned on to excite an electromagnet 5, so that the integrated circuit 1 is turned to the magnet of the electromagnet 5 to arrange the direction of the integrated circuit 1. After that, jetting of air is stopped, the electromagnet 5 is de-energized, and the cylindrical frame 3 is raised to feed out the arranged integrated circuit 1.

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は集積回路製造、集積回路試験装置などで移送中
における集積回路の方向を変換する装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an apparatus for changing the orientation of an integrated circuit during transportation in integrated circuit manufacturing, integrated circuit testing equipment, and the like.

（従来の技術） 従来集積回路製造装置などで集積回路の方向、位置合せ
を行う必要が生じたときには集積回路に刻まれた溝又は
、一番ピンマークを目印として専ら人手によってその方
向の転換を行っていた。(Prior art) When it becomes necessary to orient and align an integrated circuit in conventional integrated circuit manufacturing equipment, the direction is changed manually using a groove carved in the integrated circuit or the first pin mark as a guide. I was going.

（発明が解決しようとする問題点） しかし、１個ずつの集積回路について処理を行うため、
多大の時間と労力を必要とするうえ、人間の判断による
ため、誤操作による処理ミスや処理の見のがしなどはさ
けられなかった。(Problem to be solved by the invention) However, since processing is performed on each integrated circuit,
In addition to requiring a great deal of time and effort, since it relies on human judgment, processing errors due to operational errors or oversights cannot be avoided.

又光学的に溝等を検出し、自動的に方向をそろえる装置
も一部用いられているが、構造が非常に複雑であり高価
であった。Also, some devices are used that optically detect grooves and the like and automatically align the directions, but the structure is very complicated and expensive.

本発明の目的は、人手を要することなく自動的に集積回
路の方向をそろえることができる装置を提供することに
ある。SUMMARY OF THE INVENTION An object of the present invention is to provide a device that can automatically align the orientation of integrated circuits without requiring human intervention.

（問題点を解決するための手段） 本発明は集積回路搬送路上の方向変換部において、水平
単一方向に磁化された集積回路を収容する非磁性体の円
筒枠を上下動可能に配設し、該円筒枠の直下に、前記円
筒枠内に保持させた集積回路に高圧空気を噴付けてこれ
を浮上させる空気吹出口を設け、さらに円筒枠内の集積
回路に磁力を作用させ、円筒枠内で浮上した集積回路の
姿勢を磁力の方向に変換させる電磁石を装備したことを
特徴とする集積回路方向変換装置である。(Means for Solving the Problems) The present invention provides a cylindrical frame made of a non-magnetic material that accommodates an integrated circuit magnetized in a single horizontal direction and is movably arranged in a direction changing section on an integrated circuit transport path. , an air outlet is provided directly below the cylindrical frame to blow high-pressure air onto the integrated circuit held within the cylindrical frame to make it levitate; This is an integrated circuit direction changing device characterized by being equipped with an electromagnet that changes the attitude of an integrated circuit levitated within the device into the direction of magnetic force.

（実施例） 以下に、本発明の実施例を図によって説明する。(Example) Embodiments of the present invention will be described below with reference to the drawings.

第１図において、集積回路１を搬送する搬送路２に設定
された方向変換部の上方に、非磁性体からなる円筒枠３
を上下動可能に設置する。一方、円筒枠３の直下の搬送
路２上には、高圧空気を噴出する空気吹出口４を開口し
、さらに空気吹出口４をはさんで電磁石５を配設する。In FIG. 1, a cylindrical frame 3 made of a non-magnetic material is placed above a direction changing section set on a conveyance path 2 for conveying an integrated circuit 1.
be installed so that it can be moved up and down. On the other hand, an air outlet 4 for blowing out high-pressure air is opened on the conveyance path 2 directly below the cylindrical frame 3, and an electromagnet 5 is further disposed across the air outlet 4.

この電磁石５は、変換すべき集積回路１の姿勢変換方向
に磁力を作用させるもので、その設置方向は必要に応じ
て設定すればよいが、図面では搬送路をはさんで設置し
である。図中６は電磁石５の電源スィッチである。This electromagnet 5 applies a magnetic force in the direction of changing the attitude of the integrated circuit 1 to be converted, and its installation direction may be set as required, but in the drawing, it is installed across the conveyance path. In the figure, 6 is a power switch for the electromagnet 5.

実施例において、集積回路１を予じめ図示の矢印ｄの方
向に磁化して、搬送路２上に送り込む。In the embodiment, the integrated circuit 1 is magnetized in advance in the direction of the arrow d shown in the figure, and then sent onto the conveyance path 2.

方向変換部に集積回路１が達したとき、まず、円筒枠３
を下降させてその内部に集積回路１を収容する。円筒枠
３が搬送路１に接触したのち、空気吹出口４よシ高圧空
気を噴出し、円筒枠３内で空気圧を作用させて集積回路
１を浮上させる。次にスイッチ６を投入して電磁石５を
励磁し、電磁石と集積回路との磁力相互の吸引、反撥作
用を利用して該電磁石５の磁力の方向に集積回路１を（
その磁力の方向（矢印ｄの方向）に姿勢を）変換させて
集積回路ｌの方向を整える。その後、空気の噴出を停止
すると共に電磁石５を消磁し、円筒枠３を上昇させて方
向を整えた集積回路１を送出する。When the integrated circuit 1 reaches the direction changing section, first the cylindrical frame 3
is lowered and the integrated circuit 1 is housed therein. After the cylindrical frame 3 comes into contact with the conveyance path 1, high-pressure air is blown out from the air outlet 4, and air pressure is applied within the cylindrical frame 3 to levitate the integrated circuit 1. Next, the switch 6 is turned on to excite the electromagnet 5, and the integrated circuit 1 is moved in the direction of the magnetic force of the electromagnet 5 by utilizing mutual attraction and repulsion between the electromagnet and the integrated circuit.
The orientation of the integrated circuit l is adjusted by changing its posture in the direction of the magnetic force (in the direction of arrow d). Thereafter, the blowout of air is stopped, the electromagnet 5 is demagnetized, the cylindrical frame 3 is raised, and the integrated circuit 1 with its orientation adjusted is sent out.

（発明の効果） 以上の様忙本発明によれば、予じめ集積回路を磁化して
おくことによシ、空気力と磁石の発する磁力とを利用し
て自動的に集積回路の方向を一定にそろえることが出来
る効果を有するものである。(Effects of the Invention) According to the present invention, by magnetizing the integrated circuit in advance, the direction of the integrated circuit is automatically determined by using air force and the magnetic force generated by the magnet. This has the effect of being able to be uniformly aligned.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例を示す要部斜視図である。 １・・・集積回路、２・・・搬送路、３・・・円筒枠、
４・・・空気吹出口、５・・・電磁石。 第１図FIG. 1 is a perspective view of essential parts showing an embodiment of the present invention. 1... Integrated circuit, 2... Conveyance path, 3... Cylindrical frame,
4...Air outlet, 5...Electromagnet. Figure 1

Claims (1)

【特許請求の範囲】[Claims] （１）集積回路搬送路上の方向変換部において、水平単
一方向に磁化された集積回路を収容する非磁性体の円筒
枠を上下動可能に配設し、該円筒枠の直下に、前記円筒
枠内に保持させた集積回路に高圧空気を噴付けてこれを
浮上させる空気吹出口を設け、さらに円筒枠内の集積回
路に磁力を作用させ、円筒枠内で浮上した集積回路の姿
勢を磁力の方向に変換させる電磁石を装備したことを特
徴とする集積回路方向変換装置。(1) In the direction changing section on the integrated circuit conveyance path, a cylindrical frame made of a non-magnetic material that accommodates an integrated circuit magnetized in a single horizontal direction is arranged to be movable up and down, and directly below the cylindrical frame, the cylindrical frame is An air outlet is provided to blow high-pressure air onto the integrated circuit held within the frame to levitate it, and a magnetic force is applied to the integrated circuit within the cylindrical frame to change the attitude of the integrated circuit levitated within the cylindrical frame. An integrated circuit direction changing device characterized by being equipped with an electromagnet that changes the direction of an integrated circuit.
JP59194983A 1984-09-18 1984-09-18 Directional change device for integrated circuit Pending JPS6175724A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59194983A JPS6175724A (en) 1984-09-18 1984-09-18 Directional change device for integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59194983A JPS6175724A (en) 1984-09-18 1984-09-18 Directional change device for integrated circuit

Publications (1)

Publication Number Publication Date
JPS6175724A true JPS6175724A (en) 1986-04-18

Family

ID=16333586

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59194983A Pending JPS6175724A (en) 1984-09-18 1984-09-18 Directional change device for integrated circuit

Country Status (1)

Country Link
JP (1) JPS6175724A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62271719A (en) * 1986-05-21 1987-11-26 Nissei Plastics Ind Co Mold
JP2017010954A (en) * 2015-06-16 2017-01-12 株式会社村田製作所 Electronic-component conveyance device and manufacturing method for taping electronic component series
JP2017010955A (en) * 2015-06-16 2017-01-12 株式会社村田製作所 Electronic component conveyance device and manufacturing method for taping electronic component series

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62271719A (en) * 1986-05-21 1987-11-26 Nissei Plastics Ind Co Mold
JPH0443488B2 (en) * 1986-05-21 1992-07-16 Nissei Plastics Ind Co
JP2017010954A (en) * 2015-06-16 2017-01-12 株式会社村田製作所 Electronic-component conveyance device and manufacturing method for taping electronic component series
JP2017010955A (en) * 2015-06-16 2017-01-12 株式会社村田製作所 Electronic component conveyance device and manufacturing method for taping electronic component series

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