JPS6172865U - - Google Patents
Info
- Publication number
- JPS6172865U JPS6172865U JP1984157881U JP15788184U JPS6172865U JP S6172865 U JPS6172865 U JP S6172865U JP 1984157881 U JP1984157881 U JP 1984157881U JP 15788184 U JP15788184 U JP 15788184U JP S6172865 U JPS6172865 U JP S6172865U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- plane
- electrical connection
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 241001071864 Lethrinus laticaudis Species 0.000 description 3
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984157881U JPS6172865U (US08158827-20120417-C00028.png) | 1984-10-19 | 1984-10-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984157881U JPS6172865U (US08158827-20120417-C00028.png) | 1984-10-19 | 1984-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6172865U true JPS6172865U (US08158827-20120417-C00028.png) | 1986-05-17 |
Family
ID=30715871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984157881U Pending JPS6172865U (US08158827-20120417-C00028.png) | 1984-10-19 | 1984-10-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6172865U (US08158827-20120417-C00028.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63249362A (ja) * | 1987-04-04 | 1988-10-17 | Ibiden Co Ltd | 表面実装部品用パツケ−ジ |
-
1984
- 1984-10-19 JP JP1984157881U patent/JPS6172865U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63249362A (ja) * | 1987-04-04 | 1988-10-17 | Ibiden Co Ltd | 表面実装部品用パツケ−ジ |
