JPS6169151A - Soldering device of cap for hermetic seal - Google Patents

Soldering device of cap for hermetic seal

Info

Publication number
JPS6169151A
JPS6169151A JP10027184A JP10027184A JPS6169151A JP S6169151 A JPS6169151 A JP S6169151A JP 10027184 A JP10027184 A JP 10027184A JP 10027184 A JP10027184 A JP 10027184A JP S6169151 A JPS6169151 A JP S6169151A
Authority
JP
Japan
Prior art keywords
cap
soldering
solder
ceramic substrate
heater
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10027184A
Inventor
Akira Ogawa
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP10027184A priority Critical patent/JPS6169151A/en
Publication of JPS6169151A publication Critical patent/JPS6169151A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Abstract

PURPOSE:To shorten the time required for soldering, and to reduce production cost by holding and fixing a laminate, in which a thermal conductive adapter, a ceramic substrate and a cap made of a metal are superposed through solder, while exposing the greater part of the lower surface of the ceramic substrate. CONSTITUTION:A ceramic substrate 26 to be soldered is placed on a heat transfer surface in a heater 18, and fastened by a guide 19, and heated up to a temperature required for soldering through the conduction of a heating wire in the heater 18. A cap 25 made of a metal is superposed at the predetermined position of the ceramic substrate 26 while holding solder 27, and two cap temporary fixing jigs 21 are attached pinchingly at the facing positions of a unit. When the temperature of a thermal conductive adapter 20 reaches the temperature necessary for soldering, the unit to which the cap temporary fixing jigs 21 are set is placed at a prescribed position, and solder 27 is melted to fasten the cap 25 made of the metal. Accordingly, heat from the heater 18 is transmitted rapidly over solder 27, thus shortening the time required for soldering.
JP10027184A 1984-05-18 1984-05-18 Soldering device of cap for hermetic seal Pending JPS6169151A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10027184A JPS6169151A (en) 1984-05-18 1984-05-18 Soldering device of cap for hermetic seal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10027184A JPS6169151A (en) 1984-05-18 1984-05-18 Soldering device of cap for hermetic seal

Publications (1)

Publication Number Publication Date
JPS6169151A true JPS6169151A (en) 1986-04-09

Family

ID=14269539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10027184A Pending JPS6169151A (en) 1984-05-18 1984-05-18 Soldering device of cap for hermetic seal

Country Status (1)

Country Link
JP (1) JPS6169151A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0454190A2 (en) * 1986-09-22 1991-10-30 Nippondenso Co., Ltd. Semiconductor accelerometer
JP2011077182A (en) * 2009-09-29 2011-04-14 Citizen Electronics Co Ltd Method for manufacturing light-emitting device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0454190A2 (en) * 1986-09-22 1991-10-30 Nippondenso Co., Ltd. Semiconductor accelerometer
EP0454190A3 (en) * 1986-09-22 1992-01-08 Nippondenso Co., Ltd. Semiconductor accelerometer
JP2011077182A (en) * 2009-09-29 2011-04-14 Citizen Electronics Co Ltd Method for manufacturing light-emitting device

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