JPS6161442U - - Google Patents

Info

Publication number
JPS6161442U
JPS6161442U JP14576284U JP14576284U JPS6161442U JP S6161442 U JPS6161442 U JP S6161442U JP 14576284 U JP14576284 U JP 14576284U JP 14576284 U JP14576284 U JP 14576284U JP S6161442 U JPS6161442 U JP S6161442U
Authority
JP
Japan
Prior art keywords
pressure sensor
stem
semiconductor
semiconductor pressure
outer periphery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14576284U
Other languages
Japanese (ja)
Other versions
JPH0345161Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14576284U priority Critical patent/JPH0345161Y2/ja
Publication of JPS6161442U publication Critical patent/JPS6161442U/ja
Application granted granted Critical
Publication of JPH0345161Y2 publication Critical patent/JPH0345161Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の半導体圧力センサーの概略縦
断面図、第2図は本考案の半導体圧力センサーの
他の実施例を示す概略縦断面図、第3図は本考案
の半導体圧力センサーの実施態様の一例を示す説
明図、第4図は本考案の半導体圧力センサーの実
施態様の他の一例を示す説明図、第5図は従来の
半導体圧力センサーの概略縦断面図である。 1…半導体ダイヤフラムチツプ、2…ステム、
3…リード端子、7…金属ステム、7a…鍔部、
8…台座、9…継手、10…カバー、11…電子
回路、13…継手。
FIG. 1 is a schematic vertical cross-sectional view of the semiconductor pressure sensor of the present invention, FIG. 2 is a schematic vertical cross-sectional view showing another embodiment of the semiconductor pressure sensor of the present invention, and FIG. 3 is an implementation of the semiconductor pressure sensor of the present invention. FIG. 4 is an explanatory diagram showing another example of the embodiment of the semiconductor pressure sensor of the present invention, and FIG. 5 is a schematic vertical sectional view of a conventional semiconductor pressure sensor. 1... Semiconductor diaphragm chip, 2... Stem,
3... Lead terminal, 7... Metal stem, 7a... Flange part,
8...Pedestal, 9...Joint, 10...Cover, 11...Electronic circuit, 13...Joint.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ダイヤフラムの表面にピエゾ抵抗層を形
成してなる半導体圧力センサーチツプを耐電圧材
料からなるステムに取付けてなる圧力センサーに
おいて、該ステムの外周に鍔部を環設した両端開
放の筒体からなる金属ステムを固着したことを特
徴とする半導体圧力センサー。
A pressure sensor in which a semiconductor pressure sensor chip formed by forming a piezoresistive layer on the surface of a semiconductor diaphragm is attached to a stem made of a voltage-resistant material, which consists of a cylindrical body with both ends open and a flange provided around the outer periphery of the stem. A semiconductor pressure sensor characterized by a fixed metal stem.
JP14576284U 1984-09-28 1984-09-28 Expired JPH0345161Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14576284U JPH0345161Y2 (en) 1984-09-28 1984-09-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14576284U JPH0345161Y2 (en) 1984-09-28 1984-09-28

Publications (2)

Publication Number Publication Date
JPS6161442U true JPS6161442U (en) 1986-04-25
JPH0345161Y2 JPH0345161Y2 (en) 1991-09-24

Family

ID=30704018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14576284U Expired JPH0345161Y2 (en) 1984-09-28 1984-09-28

Country Status (1)

Country Link
JP (1) JPH0345161Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005049240A (en) * 2003-07-29 2005-02-24 Nec Schott Components Corp Pressure sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005049240A (en) * 2003-07-29 2005-02-24 Nec Schott Components Corp Pressure sensor

Also Published As

Publication number Publication date
JPH0345161Y2 (en) 1991-09-24

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