JPS6159241A - Method for testing wire material - Google Patents

Method for testing wire material

Info

Publication number
JPS6159241A
JPS6159241A JP18123784A JP18123784A JPS6159241A JP S6159241 A JPS6159241 A JP S6159241A JP 18123784 A JP18123784 A JP 18123784A JP 18123784 A JP18123784 A JP 18123784A JP S6159241 A JPS6159241 A JP S6159241A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
wire
pipe
solder plated
wire material
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18123784A
Inventor
Satoshi Chinda
Yuji Yaguchi
Osamu Yoshioka
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00Investigating materials by mechanical methods
    • G01N19/02Measuring coefficient of friction between materials

Abstract

PURPOSE:To facilitate the evaluation of the slip property on the surface of a wire material, by contacting the wire material and a pipe under definite pressure and relatively moving both of them at a low speed while a definite angle is held and measuring the change in tension due to the friction of the pipe and the wire material. CONSTITUTION:For example, solder plating is applied to a soft copper wire with a diameter of 0.6mm in a thickness of 6mu and, thereafter, for example, stearic acid is thinly applied to said wire to form a solder plated wire. A stainless steel pipe 2 with an outer diameter of 20mm is contacted with said solder plated wire at a contact angle of 90 deg. and the wire is downwardly pulled by a counterweight 5 of 100g through a pulley 3 to allow the pipe 2 and the part of the pulley 3 to downwardly move at a speed of 10cm/min while the change in tension due to friction of the pipe 2 and the solder plated wire is measured by a load cell 1 and the slip property of the solder plated wire can be evaluated easily and rapidly.
JP18123784A 1984-08-30 1984-08-30 Method for testing wire material Pending JPS6159241A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18123784A JPS6159241A (en) 1984-08-30 1984-08-30 Method for testing wire material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18123784A JPS6159241A (en) 1984-08-30 1984-08-30 Method for testing wire material

Publications (1)

Publication Number Publication Date
JPS6159241A true true JPS6159241A (en) 1986-03-26

Family

ID=16097192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18123784A Pending JPS6159241A (en) 1984-08-30 1984-08-30 Method for testing wire material

Country Status (1)

Country Link
JP (1) JPS6159241A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0260855U (en) * 1988-10-28 1990-05-07
US7695833B2 (en) 2004-02-06 2010-04-13 Hoya Corporation Solid body surface evaluation method, magnetic disk evaluation method, magnetic disk, and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0260855U (en) * 1988-10-28 1990-05-07
US7695833B2 (en) 2004-02-06 2010-04-13 Hoya Corporation Solid body surface evaluation method, magnetic disk evaluation method, magnetic disk, and manufacturing method thereof

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