JPS6154326B2 - - Google Patents
Info
- Publication number
- JPS6154326B2 JPS6154326B2 JP55176107A JP17610780A JPS6154326B2 JP S6154326 B2 JPS6154326 B2 JP S6154326B2 JP 55176107 A JP55176107 A JP 55176107A JP 17610780 A JP17610780 A JP 17610780A JP S6154326 B2 JPS6154326 B2 JP S6154326B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- parts
- curing
- resin composition
- methylimidazole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003822 epoxy resin Substances 0.000 claims description 27
- 229920000647 polyepoxide Polymers 0.000 claims description 27
- 239000000203 mixture Substances 0.000 claims description 13
- 229920003986 novolac Polymers 0.000 claims description 11
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 7
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 claims description 5
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 claims 1
- 239000012778 molding material Substances 0.000 description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Description
この発明は、成形性(低圧充填性)の優れたエ
ポキシ樹脂組成物、特にIC,LSI封止用として最
適なエポキシ樹脂組成物に関するものである。
トランジスター,IC,LSI等の半導体装置は、
一般に、大量生産可能なトランスフアー成形で樹
脂封止されているが、トランスフアー成形を行う
場合、低圧で充分流動性のある封止材料を用いな
いと、IC,LSI等の素子の断線が起こり、高価な
半導体装置が不良品になつてしまう。しかし、従
来の市販品を含む材料には、低圧流動性を満足さ
せるものはほとんどないのが現状である。
この発明者らは、このような情況に鑑み、低圧
流動性に優れ、しかも速硬化かつ貯蔵安定性に優
れた半導体装置封止用エポキシ樹脂組成物を得る
ために鋭意研究した結果、多官能エポキシ樹脂
に、硬化剤としてノボラツク系化合物を配合する
とともに、硬化助剤として2―メチルイミダゾー
ル・無水ピロメツト酸塩を配合すると、所期の目
的を達成しうることを見いだしこの発明を完成す
るに到つた。
すなわち、この発明は、多官能エポキシ樹脂、
硬化剤としてのノボラツク系化合物および硬化助
剤としての2―メチルイミダゾール・無水ピロメ
リツト酸塩が配合されているエポキシ樹脂組成物
をその要旨とするものである。
この発明で用いるエポキシ樹脂は、分子内に少
なくとも2個のエポキシ基を有する化合物であれ
ば特に限定しない。しかし一般的には、エポキシ
当量100〜4000の通常のエポキシ樹脂が用いられ
る。例えば、ビスフエノール系エポキシ樹脂、脂
環式エポキシ樹脂、ノボラツク系エポキシ樹脂、
含窒素エポキシ樹脂ならびにブロム化エポキシ樹
脂のようなハロゲン化エポキシ樹脂があげられ
る。
また硬化剤として用いるノボラツク系化合物と
しては、フエノール、クレゾール、キシレノー
ル、レゾルシン等のフエノール類とホルムアルデ
ヒドのようなアルデヒド類とを酸性触媒下で反応
させて得られるものがあげられる。このようなノ
ボラツク系化合物の配合量は、エポキシ樹脂100
重量部(以下「部」と略す)に対して、10〜100
部が好ましい。この範囲をはずれると、いずれの
場合も硬化不足となり、硬化物の耐熱性、耐薬品
性が劣るようになるからである。
この発明では、硬化促進剤として、2―メチル
イミダゾール・無水ピロメリツト酸塩を用いる。
このように、硬化促進剤として2―メチルイミダ
ゾール・無水ピロメリツト酸塩を用いることがこ
の発明の特徴である。他のイミダゾール誘導体お
よび有機酸の錯塩を用いても、この発明のような
低圧流動性に優れたエポキシ樹脂組成物は得られ
ないのである。硬化促進剤の量は、エポキシ樹脂
100部に対して1〜10部が好ましい。1部未満で
は硬化が遅く、また10部を超えると貯蔵安定性が
悪くなる欠点が生じてくるからである。
なお、本発明のエポキシ樹脂組成物には、半導
体装置封止剤として各種の充填剤を配合すること
が好ましい。例えば、シリカ、溶融シリカ、石英
ガラス粉、炭酸カルシウム、クレー、タルク、け
いそう土、マイカ、ケイ酸ジルコニウムなどがあ
げられ、全材料に対して30〜80重量%(以下
「%」と略す)用いることができる。
離型剤としては、モンタナワツクス、カルナウ
バワツクス、ステアリン酸、ステアリン酸金属塩
などが用いられる。さらに必要に応じて難燃化
剤、表面処理剤、染顔料などを用いることもでき
るのである。
この発明のエポキシ樹脂組成物を用いて成形材
料をつくる場合は、つぎのようにして行われる。
すなわち、この発明のエポキシ樹脂組成物および
その他の充填材等を混合する。混合は、ミキシン
グロールや加圧ニーダー等の汎用の混合機械を使
用して行えばよい。ついで混合物を微粉砕し必要
に応じてタブレツト化してトランスフアー成形材
料とする。
この発明の樹脂組成物からつくられた成形材料
は、低圧流動性に優れ、速硬化性、かつ材料の保
存安定性が良好であるため、IC、LSIの封止用と
して最適であり、封止される半導体装置の成形時
の不良率の低減を実現しうるようになるのであ
る。
つぎに実施例について比較例と併せて説明す
る。
まず、つぎのようにして硬化助剤および硬化剤
を合成した。
(硬化助剤の合成)
無水ピロメリツト酸109部をTHF109部に溶解
させた液をフラスコに入れた。他方、滴下ロート
中に、2―メチルイミダゾール82部をTHF82部
に溶解させた液を入れた。常温で2―メチルイミ
ダゾール液をフラスコ中に滴下していくと、すぐ
に淡黄色の沈澱が生じ、この沈澱を過し、乾燥
させて2―メチルイミダゾール・無水ピロメリツ
ト酸塩を得た。実施例はもとより、比較例に用い
る硬化助剤もこの方法と同様にして得られたもの
である。
(硬化剤の合成)
フエノール94部、37%ホルマリン64.9部、蓚酸
0.27部を撹拌器、冷却器、温度計を備えたフラス
コに入れ、100℃で100分間反応させた。その後、
薄膜乾燥脱水で水を取り除き、最終160℃で60分
間反応させ脱蓚酸を行なつてフエノールノボラツ
クを得た。このノボラツクは、遊離フエノール
0.2%で数平均分子量700であつた。またOH当量
は104.2であつた。
つぎに、上記の硬化助剤および硬化剤を用いて
つぎのようにして成形材料を得た。
〔実施例1〜3、比較例1〜5〕
各原料を下記のように配合した。
クレゾールノボラツク型エポキシ樹脂(エポキ
シ当量207.9,YDCN 220L,東都化成社製)
:100部
フエノールノボラツク(OH当量104.2)
:50.1部
硬化促進剤:次表に示すものを同表に示す量用
いた。
溶融シリカ(S―1,電気化学工業社製)
:360部
ステアリン酸亜鉛 : 3部
カーボンブラツク : 1部
エポキシシラン(KBM403,信越化学社製)
: 1部
上記配合物を100〜12℃においてミキシングロ
ールで20〜30分間混練し、円板延び(測定条件は
次表の*3の保存安定性の場合と同じ)で150〜
170mmになつた時、混練をやめ、シート状材料を
とり出し、冷却粉砕してエポキシ樹脂成形材料を
得た。
〔実施例4,5〕
エポキシ樹脂として、エポキシ当量190のもの
(N―740、大日本インキ社製)を100部用い、フ
エノールノボラツク(OH当量104.2)の量を54.8
部にした。それ以外は上記と同様にしてエポキシ
樹脂成形材料を得た。
以上の実施例および比較例で得られたエポキシ
樹脂成形材料の特性およびそれを用いて製造した
成形品の不良数を求めて次表に示した。実施例の
ものは、ふくれおよび断線がなく極めて優れてい
ることがわかる。
The present invention relates to an epoxy resin composition with excellent moldability (low-pressure filling properties), and particularly to an epoxy resin composition optimal for encapsulating ICs and LSIs. Semiconductor devices such as transistors, ICs, and LSIs are
Generally, resin sealing is performed using transfer molding, which can be mass-produced, but when performing transfer molding, unless a sealing material with sufficient fluidity is used at low pressure, disconnection of IC, LSI, etc. elements may occur. , expensive semiconductor devices end up being defective. However, at present, there are almost no materials, including conventional commercial products, that satisfy low-pressure fluidity. In view of these circumstances, the inventors conducted intensive research to obtain an epoxy resin composition for encapsulating semiconductor devices that has excellent low-pressure fluidity, fast curing, and excellent storage stability. The inventors discovered that the desired objective could be achieved by blending a novolak-based compound as a curing agent with the resin and 2-methylimidazole/pyrometh anhydride as a curing aid, leading to the completion of this invention. . That is, this invention provides a polyfunctional epoxy resin,
The gist thereof is an epoxy resin composition containing a novolac type compound as a curing agent and 2-methylimidazole/pyromellitic anhydride as a curing aid. The epoxy resin used in this invention is not particularly limited as long as it is a compound having at least two epoxy groups in the molecule. However, in general, ordinary epoxy resins having an epoxy equivalent weight of 100 to 4000 are used. For example, bisphenol epoxy resin, alicyclic epoxy resin, novolak epoxy resin,
Mention may be made of nitrogen-containing epoxy resins and halogenated epoxy resins such as brominated epoxy resins. Examples of novolac compounds used as curing agents include those obtained by reacting phenols such as phenol, cresol, xylenol, and resorcin with aldehydes such as formaldehyde under an acidic catalyst. The blending amount of such novolak-based compounds is 100% of the epoxy resin.
10 to 100 parts by weight (hereinafter referred to as "parts")
part is preferred. If it is outside this range, curing will be insufficient in any case, and the cured product will have poor heat resistance and chemical resistance. In this invention, 2-methylimidazole anhydrous pyromellistate is used as a curing accelerator.
As described above, it is a feature of the present invention that 2-methylimidazole/pyromellitic anhydride is used as a curing accelerator. Even if other imidazole derivatives and organic acid complex salts are used, an epoxy resin composition with excellent low-pressure fluidity as in the present invention cannot be obtained. The amount of curing accelerator depends on the epoxy resin
1 to 10 parts per 100 parts is preferred. If it is less than 1 part, curing will be slow, and if it exceeds 10 parts, storage stability will be poor. In addition, it is preferable that various fillers are blended into the epoxy resin composition of the present invention as a semiconductor device encapsulant. Examples include silica, fused silica, quartz glass powder, calcium carbonate, clay, talc, diatomaceous earth, mica, zirconium silicate, etc., and 30 to 80% by weight of the total material (hereinafter abbreviated as "%") Can be used. As the mold release agent, montana wax, carnauba wax, stearic acid, stearic acid metal salt, etc. are used. Furthermore, flame retardants, surface treatment agents, dyes and pigments, etc. can also be used as necessary. When producing a molding material using the epoxy resin composition of the present invention, it is carried out as follows.
That is, the epoxy resin composition of the present invention and other fillers are mixed. Mixing may be performed using a general-purpose mixing machine such as a mixing roll or a pressure kneader. The mixture is then finely ground and, if necessary, made into tablets to provide a transfer molding material. The molding material made from the resin composition of this invention has excellent low-pressure fluidity, fast curing properties, and good storage stability, making it ideal for encapsulating ICs and LSIs. This makes it possible to reduce the defect rate during molding of semiconductor devices. Next, examples will be described together with comparative examples. First, a curing aid and a curing agent were synthesized as follows. (Synthesis of hardening aid) A solution prepared by dissolving 109 parts of pyromellitic anhydride in 109 parts of THF was placed in a flask. On the other hand, a solution of 82 parts of 2-methylimidazole dissolved in 82 parts of THF was placed in the dropping funnel. When the 2-methylimidazole solution was dropped into the flask at room temperature, a pale yellow precipitate was immediately formed, and this precipitate was filtered and dried to obtain 2-methylimidazole anhydrous pyromellistate. The curing aids used not only in the Examples but also in the Comparative Examples were obtained in the same manner as this method. (Synthesis of hardening agent) 94 parts of phenol, 64.9 parts of 37% formalin, oxalic acid
0.27 part was placed in a flask equipped with a stirrer, a condenser, and a thermometer, and the mixture was reacted at 100°C for 100 minutes. after that,
Water was removed by thin film drying and dehydration, and a final reaction was carried out at 160°C for 60 minutes to remove oxalate and obtain a phenol novolak. This novolac is free phenol
At 0.2%, the number average molecular weight was 700. Moreover, the OH equivalent was 104.2. Next, a molding material was obtained in the following manner using the above curing aid and curing agent. [Examples 1 to 3, Comparative Examples 1 to 5] Each raw material was blended as follows. Cresol novolak type epoxy resin (epoxy equivalent 207.9, YDCN 220L, manufactured by Toto Kasei Co., Ltd.)
: 100 parts phenol novolac (OH equivalent 104.2)
: 50.1 parts Curing accelerator: The materials shown in the following table were used in the amounts shown in the same table. Fused silica (S-1, manufactured by Denki Kagaku Kogyo Co., Ltd.)
: 360 parts Zinc stearate : 3 parts Carbon black : 1 part Epoxy silane (KBM403, manufactured by Shin-Etsu Chemical)
: 1 part The above compound was kneaded for 20 to 30 minutes with a mixing roll at 100 to 12°C, and the disc elongation (measurement conditions are the same as for storage stability in *3 in the following table) was 150 to 100.
When it reached 170 mm, kneading was stopped, the sheet material was taken out, cooled and ground to obtain an epoxy resin molding material. [Examples 4 and 5] As the epoxy resin, 100 parts of an epoxy equivalent of 190 (N-740, manufactured by Dainippon Ink Co., Ltd.) was used, and the amount of phenol novolak (OH equivalent: 104.2) was 54.8 parts.
I made it into a department. An epoxy resin molding material was obtained in the same manner as above except that. The characteristics of the epoxy resin molding materials obtained in the above Examples and Comparative Examples and the number of defective molded products manufactured using the same were determined and are shown in the following table. It can be seen that the samples of Examples are extremely excellent with no blisters or disconnections.
【表】【table】
図面は流動性試験の説明図である。 The drawing is an explanatory diagram of the fluidity test.
Claims (1)
ツク系化合物および硬化助剤としての2―メチル
イミダゾール・無水ピロメリツト酸塩が配合され
ているエポキシ樹脂組成物。 2 多官能エポキシ樹脂100重量部に対して2―
メチルイミダゾール・無水ピロメリツト酸塩が1
〜10重量部配合されている特許請求の範囲第1項
記載のエポキシ樹脂組成物。[Scope of Claims] 1. An epoxy resin composition containing a polyfunctional epoxy resin, a novolac compound as a curing agent, and 2-methylimidazole/pyromellitic anhydride as a curing aid. 2 2- for 100 parts by weight of polyfunctional epoxy resin
Methylimidazole/pyromellitic anhydride is 1
The epoxy resin composition according to claim 1, wherein the epoxy resin composition is blended in an amount of 10 parts by weight.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17610780A JPS57100128A (en) | 1980-12-13 | 1980-12-13 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17610780A JPS57100128A (en) | 1980-12-13 | 1980-12-13 | Epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57100128A JPS57100128A (en) | 1982-06-22 |
JPS6154326B2 true JPS6154326B2 (en) | 1986-11-21 |
Family
ID=16007808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17610780A Granted JPS57100128A (en) | 1980-12-13 | 1980-12-13 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57100128A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4594291A (en) * | 1984-07-17 | 1986-06-10 | The Dow Chemical Company | Curable, partially advanced epoxy resins |
JPH0618853B2 (en) * | 1987-04-03 | 1994-03-16 | 信越化学工業株式会社 | Epoxy resin composition |
JPH10176036A (en) * | 1996-12-19 | 1998-06-30 | Shin Etsu Chem Co Ltd | Epoxy resin composition and semiconductor device |
JP6836740B2 (en) * | 2016-10-13 | 2021-03-03 | 三菱瓦斯化学株式会社 | Resin composition, resin sheet, printed wiring board and semiconductor device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3493630A (en) * | 1964-09-22 | 1970-02-03 | Union Carbide Corp | Epoxy resins cured with phenolic novolacs and imidazoles |
US3746686A (en) * | 1971-07-12 | 1973-07-17 | Shell Oil Co | Process for curing polyepoxides with polycarboxylic acid salts of an imidazole compound and compositions thereof |
-
1980
- 1980-12-13 JP JP17610780A patent/JPS57100128A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3493630A (en) * | 1964-09-22 | 1970-02-03 | Union Carbide Corp | Epoxy resins cured with phenolic novolacs and imidazoles |
US3746686A (en) * | 1971-07-12 | 1973-07-17 | Shell Oil Co | Process for curing polyepoxides with polycarboxylic acid salts of an imidazole compound and compositions thereof |
Also Published As
Publication number | Publication date |
---|---|
JPS57100128A (en) | 1982-06-22 |
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