JPS6151750U - - Google Patents

Info

Publication number
JPS6151750U
JPS6151750U JP13527184U JP13527184U JPS6151750U JP S6151750 U JPS6151750 U JP S6151750U JP 13527184 U JP13527184 U JP 13527184U JP 13527184 U JP13527184 U JP 13527184U JP S6151750 U JPS6151750 U JP S6151750U
Authority
JP
Japan
Prior art keywords
lead frame
integrated circuit
semiconductor element
circuit device
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13527184U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13527184U priority Critical patent/JPS6151750U/ja
Publication of JPS6151750U publication Critical patent/JPS6151750U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP13527184U 1984-09-06 1984-09-06 Pending JPS6151750U (US07413550-20080819-C00001.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13527184U JPS6151750U (US07413550-20080819-C00001.png) 1984-09-06 1984-09-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13527184U JPS6151750U (US07413550-20080819-C00001.png) 1984-09-06 1984-09-06

Publications (1)

Publication Number Publication Date
JPS6151750U true JPS6151750U (US07413550-20080819-C00001.png) 1986-04-07

Family

ID=30693764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13527184U Pending JPS6151750U (US07413550-20080819-C00001.png) 1984-09-06 1984-09-06

Country Status (1)

Country Link
JP (1) JPS6151750U (US07413550-20080819-C00001.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04144159A (ja) * 1990-10-04 1992-05-18 Nec Corp リードフレーム
US12028987B2 (en) 2022-04-30 2024-07-02 PAC Tech—Packaging Technologies GmbH Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04144159A (ja) * 1990-10-04 1992-05-18 Nec Corp リードフレーム
US12028987B2 (en) 2022-04-30 2024-07-02 PAC Tech—Packaging Technologies GmbH Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole

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