JPS6144638B2 - - Google Patents

Info

Publication number
JPS6144638B2
JPS6144638B2 JP57170684A JP17068482A JPS6144638B2 JP S6144638 B2 JPS6144638 B2 JP S6144638B2 JP 57170684 A JP57170684 A JP 57170684A JP 17068482 A JP17068482 A JP 17068482A JP S6144638 B2 JPS6144638 B2 JP S6144638B2
Authority
JP
Japan
Prior art keywords
release
pellet
frame
fingers
robot hand
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57170684A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5959380A (ja
Inventor
Mitsuru Shiraishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP17068482A priority Critical patent/JPS5959380A/ja
Publication of JPS5959380A publication Critical patent/JPS5959380A/ja
Publication of JPS6144638B2 publication Critical patent/JPS6144638B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manipulator (AREA)
JP17068482A 1982-09-29 1982-09-29 ロボツトハンド Granted JPS5959380A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17068482A JPS5959380A (ja) 1982-09-29 1982-09-29 ロボツトハンド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17068482A JPS5959380A (ja) 1982-09-29 1982-09-29 ロボツトハンド

Publications (2)

Publication Number Publication Date
JPS5959380A JPS5959380A (ja) 1984-04-05
JPS6144638B2 true JPS6144638B2 (https=) 1986-10-03

Family

ID=15909471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17068482A Granted JPS5959380A (ja) 1982-09-29 1982-09-29 ロボツトハンド

Country Status (1)

Country Link
JP (1) JPS5959380A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023139816A1 (https=) * 2022-01-20 2023-07-27

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4937864B2 (ja) * 2007-09-07 2012-05-23 シチズンホールディングス株式会社 硬さ計
JP6425408B2 (ja) * 2014-04-21 2018-11-21 キヤノン株式会社 ロボットハンドの制御方法、ロボットハンド、プログラム及び記録媒体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4931334U (https=) * 1972-06-19 1974-03-18
JPS5211989B2 (https=) * 1973-05-30 1977-04-04
JPS5638005Y2 (https=) * 1976-08-18 1981-09-05

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023139816A1 (https=) * 2022-01-20 2023-07-27

Also Published As

Publication number Publication date
JPS5959380A (ja) 1984-04-05

Similar Documents

Publication Publication Date Title
EP2728335B1 (en) Tensile test device for testing deposits on electronic substrates
EP0011979A1 (en) Processor-controlled drive apparatus for a semiconductor-wire bonder and method of operating same
US4444349A (en) Wire bonding apparatus
US20050207068A1 (en) Method and apparatus for connecting a micro-actuator to driver arm suspension
CN115781749B (zh) 一种数控机床用的智能机械手
CN108511355A (zh) 封装铝线键合压爪机构及封装铝线键合设备
JPS6144638B2 (https=)
KR100709614B1 (ko) 칩 본딩장치
JP3022613B2 (ja) ワイヤボンディング装置
JP2004047665A5 (https=)
JP2665952B2 (ja) 自動プルテスト装置
JP3000817B2 (ja) ワイヤボンディング方法
JPH0325403Y2 (https=)
KR100605080B1 (ko) 고 가속 스핀들 구동 및 이를 사용하는 방법
US5014900A (en) Deep access bond head
JPH073638Y2 (ja) ワイヤボンダーにおけるワイヤカット用クランプ装置
JPH06349884A (ja) ワイヤボンディング装置のリードフレーム押え機構
JP3850890B2 (ja) ワイヤボンディング装置
JPS5877484A (ja) ロボツトハンド
KR0138299Y1 (ko) 다이본딩 장치
JPH029555Y2 (https=)
JPH0262059A (ja) 半導体装置の製造方法及び装置
JP2762526B2 (ja) ワイヤボンディング方法
JP2897396B2 (ja) 樹脂封止型半導体装置の外部リード成形方法
JPH04267353A (ja) ワイヤボンディング装置