JPS6142858U - 厚膜回路装置 - Google Patents
厚膜回路装置Info
- Publication number
- JPS6142858U JPS6142858U JP1984128395U JP12839584U JPS6142858U JP S6142858 U JPS6142858 U JP S6142858U JP 1984128395 U JP1984128395 U JP 1984128395U JP 12839584 U JP12839584 U JP 12839584U JP S6142858 U JPS6142858 U JP S6142858U
- Authority
- JP
- Japan
- Prior art keywords
- circuit device
- thick film
- film circuit
- alumina substrate
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
【図面の簡単な説明】
第1・図は本考案の一実施例を示す部分平面図、第2図
及び第3図は本考案の説明に用いる部分断面図である。 1・・・アルミナ基板、2A〜2E・・・導体、3A〜
3G・・・電極、4・・・絶縁被膜、4A〜4C・・・
延長被,膜、4d:・・中間被膜。
及び第3図は本考案の説明に用いる部分断面図である。 1・・・アルミナ基板、2A〜2E・・・導体、3A〜
3G・・・電極、4・・・絶縁被膜、4A〜4C・・・
延長被,膜、4d:・・中間被膜。
Claims (1)
- アルミナ基板上に複数の電極が形成され、これらの電極
のうちで近接した異なる電極間のアルミナ基板上に所定
形状のガラス膜が被着された厚膜回路装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984128395U JPS6142858U (ja) | 1984-08-23 | 1984-08-23 | 厚膜回路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984128395U JPS6142858U (ja) | 1984-08-23 | 1984-08-23 | 厚膜回路装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6142858U true JPS6142858U (ja) | 1986-03-19 |
Family
ID=30687023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984128395U Pending JPS6142858U (ja) | 1984-08-23 | 1984-08-23 | 厚膜回路装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6142858U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0425143A (ja) * | 1990-05-21 | 1992-01-28 | Matsushita Electric Ind Co Ltd | 回路基板及び半導体装置 |
KR101143530B1 (ko) | 2010-08-09 | 2012-05-09 | 삼성전기주식회사 | 인쇄회로기판 및 인쇄회로기판 제조방법 |
-
1984
- 1984-08-23 JP JP1984128395U patent/JPS6142858U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0425143A (ja) * | 1990-05-21 | 1992-01-28 | Matsushita Electric Ind Co Ltd | 回路基板及び半導体装置 |
KR101143530B1 (ko) | 2010-08-09 | 2012-05-09 | 삼성전기주식회사 | 인쇄회로기판 및 인쇄회로기판 제조방법 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6142858U (ja) | 厚膜回路装置 | |
JPS5889926U (ja) | 貫通コンデンサ | |
JPS5839030U (ja) | コンデンサ素子 | |
JPS6037236U (ja) | 厚膜コンデンサ | |
JPS5956704U (ja) | チツプ抵抗 | |
JPS58148903U (ja) | チツプ抵抗体 | |
JPS5921740U (ja) | 温度検出器 | |
JPS59187048U (ja) | 温度ヒユ−ズ | |
JPS6133081U (ja) | 電極基板 | |
JPS60192401U (ja) | チツプ抵抗器 | |
JPS58160431U (ja) | スイツチの電極パタ−ン | |
JPS58109201U (ja) | チツプ抵抗器 | |
JPS60137404U (ja) | 集合抵抗器 | |
JPS6049670U (ja) | 湿式多層基板 | |
JPS58150829U (ja) | 貫通形コンデンサ | |
JPS59101427U (ja) | 厚膜コンデンサ | |
JPS59127203U (ja) | チツプ固定抵抗器 | |
JPS59173301U (ja) | チツプ型抵抗器 | |
JPS6115754U (ja) | 集積回路容器 | |
JPS6339998U (ja) | ||
JPS59169031U (ja) | 厚膜コンデンサ | |
JPS619802U (ja) | 小型抵抗器 | |
JPS5854127U (ja) | 表面波装置 | |
JPS61199043U (ja) | ||
JPS60156747U (ja) | 半導体装置 |