JPS6137788B2 - - Google Patents

Info

Publication number
JPS6137788B2
JPS6137788B2 JP3783081A JP3783081A JPS6137788B2 JP S6137788 B2 JPS6137788 B2 JP S6137788B2 JP 3783081 A JP3783081 A JP 3783081A JP 3783081 A JP3783081 A JP 3783081A JP S6137788 B2 JPS6137788 B2 JP S6137788B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3783081A
Other languages
Japanese (ja)
Other versions
JPS57153022A (en
Inventor
Hirotoshi Iketani
Akiko Hatanaka
Shuichi Suzuki
Moryasu Wada
Original Assignee
Tokyo Shibaura Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co filed Critical Tokyo Shibaura Electric Co
Priority to JP3783081A priority Critical patent/JPS6137788B2/ja
Priority claimed from EP19810104126 external-priority patent/EP0041662B1/en
Publication of JPS57153022A publication Critical patent/JPS57153022A/en
Publication of JPS6137788B2 publication Critical patent/JPS6137788B2/ja
Expired legal-status Critical Current

Links

JP3783081A 1981-03-18 1981-03-18 Expired JPS6137788B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3783081A JPS6137788B2 (en) 1981-03-18 1981-03-18

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP3783081A JPS6137788B2 (en) 1981-03-18 1981-03-18
EP19810104126 EP0041662B1 (en) 1980-06-05 1981-05-29 Resin encapsulation type semiconductor device
DE8181104126T DE3163054D1 (en) 1980-06-05 1981-05-29 Resin encapsulation type semiconductor device

Publications (2)

Publication Number Publication Date
JPS57153022A JPS57153022A (en) 1982-09-21
JPS6137788B2 true JPS6137788B2 (en) 1986-08-26

Family

ID=12508439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3783081A Expired JPS6137788B2 (en) 1981-03-18 1981-03-18

Country Status (1)

Country Link
JP (1) JPS6137788B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6150591U (en) * 1984-09-08 1986-04-04
JPS61203366A (en) * 1984-08-28 1986-09-09 Seven Irebun Japan Kk Rice-ball packaging material
JPH0263381U (en) * 1988-11-01 1990-05-11
JPH0340155Y2 (en) * 1985-06-25 1991-08-23

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0379370B2 (en) * 1982-10-12 1991-12-18 Tokyo Shibaura Electric Co
JPH0725994B2 (en) * 1986-11-21 1995-03-22 株式会社東芝 Epoxy resin composition for semiconductor device encapsulation
JP2001288338A (en) * 2000-04-10 2001-10-16 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP3951639B2 (en) * 2001-06-26 2007-08-01 松下電工株式会社 Semiconductor sealing resin composition and semiconductor device
JP2014129475A (en) * 2012-12-28 2014-07-10 Kyoritsu Kagaku Sangyo Kk Thermal cationic polymerizable composition

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61203366A (en) * 1984-08-28 1986-09-09 Seven Irebun Japan Kk Rice-ball packaging material
JPS6150591U (en) * 1984-09-08 1986-04-04
JPH0340155Y2 (en) * 1985-06-25 1991-08-23
JPH0263381U (en) * 1988-11-01 1990-05-11

Also Published As

Publication number Publication date
JPS57153022A (en) 1982-09-21

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