JPS6135547A - Three-dimensional mounting circuit module - Google Patents

Three-dimensional mounting circuit module

Info

Publication number
JPS6135547A
JPS6135547A JP15682384A JP15682384A JPS6135547A JP S6135547 A JPS6135547 A JP S6135547A JP 15682384 A JP15682384 A JP 15682384A JP 15682384 A JP15682384 A JP 15682384A JP S6135547 A JPS6135547 A JP S6135547A
Authority
JP
Japan
Prior art keywords
cubic
chip
devices
terminals
connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15682384A
Inventor
Akira Koyama
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to JP15682384A priority Critical patent/JPS6135547A/en
Publication of JPS6135547A publication Critical patent/JPS6135547A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385Assembly of a plurality of insulating substrates
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/13Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0652Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements

Abstract

PURPOSE:To provide a circuit module which can be made in miniature and has a distance between devices being possible to be shortened, by uniting active and passive devices each being a three-dimentional cube with wiring members each being three-dimensional cube, which connect among terminal being provided on respective faces of these cubes. CONSTITUTION:A semiconductor integrated circuit chip 1 is buried in a cubic insulator 12. Terminals 2 on the chip 2 are connectef to chip-side terminals 13 on the cube by thick-film or thin-film wirings 14 on the faces of the chip 1, and moreover are connected to external connecting terminals by multi-layer wiring 15. The multi-layer wirings 15 directly connecting among the external connecting terminals are employed to form wiring buses by combining them with the other cubic devices or cubic wiring members. The three-dimentional cubic active devices 17 and the wiring members 18 are stacked, considering the connections among them, and are connected by planar connectors 20 and are connected to the outside by external connecting modules 21.
JP15682384A 1984-07-27 1984-07-27 Three-dimensional mounting circuit module Pending JPS6135547A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15682384A JPS6135547A (en) 1984-07-27 1984-07-27 Three-dimensional mounting circuit module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15682384A JPS6135547A (en) 1984-07-27 1984-07-27 Three-dimensional mounting circuit module

Publications (1)

Publication Number Publication Date
JPS6135547A true JPS6135547A (en) 1986-02-20

Family

ID=15636123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15682384A Pending JPS6135547A (en) 1984-07-27 1984-07-27 Three-dimensional mounting circuit module

Country Status (1)

Country Link
JP (1) JPS6135547A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0584503U (en) * 1991-05-17 1993-11-16 マルエヌ株式会社 Bad road escape equipment such as wheels
US5426566A (en) * 1991-09-30 1995-06-20 International Business Machines Corporation Multichip integrated circuit packages and systems
US5502667A (en) * 1993-09-13 1996-03-26 International Business Machines Corporation Integrated multichip memory module structure
US5517754A (en) * 1994-06-02 1996-05-21 International Business Machines Corporation Fabrication processes for monolithic electronic modules
US5561622A (en) * 1993-09-13 1996-10-01 International Business Machines Corporation Integrated memory cube structure
US5648684A (en) * 1995-07-26 1997-07-15 International Business Machines Corporation Endcap chip with conductive, monolithic L-connect for multichip stack
WO2005029591A1 (en) * 2003-09-23 2005-03-31 The Furukawa Electric Co., Ltd. Linear semiconductor substrate, device using the linear semiconductor substrate, device array, and module

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0584503U (en) * 1991-05-17 1993-11-16 マルエヌ株式会社 Bad road escape equipment such as wheels
US5426566A (en) * 1991-09-30 1995-06-20 International Business Machines Corporation Multichip integrated circuit packages and systems
US5502667A (en) * 1993-09-13 1996-03-26 International Business Machines Corporation Integrated multichip memory module structure
US5561622A (en) * 1993-09-13 1996-10-01 International Business Machines Corporation Integrated memory cube structure
US5517754A (en) * 1994-06-02 1996-05-21 International Business Machines Corporation Fabrication processes for monolithic electronic modules
US5648684A (en) * 1995-07-26 1997-07-15 International Business Machines Corporation Endcap chip with conductive, monolithic L-connect for multichip stack
WO2005029591A1 (en) * 2003-09-23 2005-03-31 The Furukawa Electric Co., Ltd. Linear semiconductor substrate, device using the linear semiconductor substrate, device array, and module
US8039927B2 (en) 2003-09-23 2011-10-18 The Furukawa Electric Co., Ltd. Linear semiconductor substrate, and device, device array and module, using the same
JP5260830B2 (en) * 2003-09-23 2013-08-14 古河電気工業株式会社 Method for producing a one-dimensional semiconductor substrate
US8778719B2 (en) 2003-09-23 2014-07-15 Furukawa Electric Co., Ltd. Linear semiconductor substrate, and device, device array and module, using the same

Similar Documents

Publication Publication Date Title
US3627901A (en) Composite electronic device package-connector unit
US4972253A (en) Programmable ceramic high performance custom package
EP0067677B1 (en) Chip-array-constructed semiconductor device
EP0430458B1 (en) Semiconductor chip packages and modules formed of stacks of such packages
US5724728A (en) Method of mounting an integrated circuit to a mounting surface
US5426566A (en) Multichip integrated circuit packages and systems
US20040159955A1 (en) Semiconductor chip module
US4953060A (en) Stackable integrated circuit chip package with improved heat removal
US5943213A (en) Three-dimensional electronic module
US6620648B2 (en) Multi-chip module with extension
US6893899B2 (en) Contact member stacking system and method
EP0638931A2 (en) Multi-chip module
US4266282A (en) Vertical semiconductor integrated circuit chip packaging
US6900529B2 (en) Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
US6043559A (en) Integrated circuit package which contains two in plane voltage busses and a wrap around conductive strip that connects a bond finger to one of the busses
US4426689A (en) Vertical semiconductor integrated circuit chip packaging
US5434745A (en) Stacked silicon die carrier assembly
TW462098B (en) A packaging structure for integrated circuits
US4783697A (en) Leadless chip carrier for RF power transistors or the like
US3555364A (en) Microelectronic modules and assemblies
US5744862A (en) Reduced thickness semiconductor device with IC packages mounted in openings on substrate
US6440775B2 (en) Method and apparatus for edge connection between elements of an integrated circuit
TWI229890B (en) Semiconductor device and method of manufacturing same
JP2603636B2 (en) Semiconductor device
US6369445B1 (en) Method and apparatus for edge connection between elements of an integrated circuit