JPS6131482A - Bonding method - Google Patents

Bonding method

Info

Publication number
JPS6131482A
JPS6131482A JP15117384A JP15117384A JPS6131482A JP S6131482 A JPS6131482 A JP S6131482A JP 15117384 A JP15117384 A JP 15117384A JP 15117384 A JP15117384 A JP 15117384A JP S6131482 A JPS6131482 A JP S6131482A
Authority
JP
Japan
Prior art keywords
adhesive
pressure
preferably
bonding
adherend
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15117384A
Inventor
Makoto Tanaka
Original Assignee
Dainippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Printing Co Ltd filed Critical Dainippon Printing Co Ltd
Priority to JP15117384A priority Critical patent/JPS6131482A/en
Publication of JPS6131482A publication Critical patent/JPS6131482A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE: To provide an adhesive containing microcapsules having specific relationship between the particle diameter of the capsule and the properties of the adhesive, having long pot life and high adhesion stability, suitable for dry lamination process, and capable of firmly bonding almost all kinds of materials.
CONSTITUTION: An adhesive (preferably a urethane-based adhesive) containing microcapsules (having a maximum particle dimension of γmax, average diameter of (m) and standard deviation of σ) having a crosslinking and curing catalyst (preferably dibutyltin laurate) as a core, is applied to the surface of an adherend at a specific application pressure (A), and dried to form a dried coating film having an average thickness of (t). The other adherend is pressed to the adhesive film under a pressure (B) to effect the bonding of the adherends. The bonding process is carried out under the following conditions: t≤γmax; 1/10m≤ t≤m+3σ, and 2/5m≤t≤m. Preferably, m is about 1W20μm, the application pressure (A) is lower than the critical pressure to break the microcapsule, and the pressure (B) is higher than the critical pressure.
COPYRIGHT: (C)1986,JPO&Japio
JP15117384A 1984-07-23 1984-07-23 Bonding method Pending JPS6131482A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15117384A JPS6131482A (en) 1984-07-23 1984-07-23 Bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15117384A JPS6131482A (en) 1984-07-23 1984-07-23 Bonding method

Publications (1)

Publication Number Publication Date
JPS6131482A true JPS6131482A (en) 1986-02-13

Family

ID=15512903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15117384A Pending JPS6131482A (en) 1984-07-23 1984-07-23 Bonding method

Country Status (1)

Country Link
JP (1) JPS6131482A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0785243A3 (en) * 1996-01-18 1998-06-03 Loctite (Ireland) Limited A method of sealing two abutting surfaces in face-to-face contact
EP1647587A1 (en) * 2004-10-12 2006-04-19 Henkel Kommanditgesellschaft auf Aktien Laminating adhesives containing microencapsulated catalysts
DE102005042035A1 (en) * 2005-09-02 2007-03-08 Infineon Technologies Ag Plastic housing material for embedding semiconductor devices in a plastic housing and using the plastic housing material
EP3156434A1 (en) * 2015-10-12 2017-04-19 Henkel AG & Co. KGaA Nanocapsules as thermolatent polymerization catalysts or initiators

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0785243A3 (en) * 1996-01-18 1998-06-03 Loctite (Ireland) Limited A method of sealing two abutting surfaces in face-to-face contact
EP1647587A1 (en) * 2004-10-12 2006-04-19 Henkel Kommanditgesellschaft auf Aktien Laminating adhesives containing microencapsulated catalysts
DE102005042035A1 (en) * 2005-09-02 2007-03-08 Infineon Technologies Ag Plastic housing material for embedding semiconductor devices in a plastic housing and using the plastic housing material
US7728053B2 (en) 2005-09-02 2010-06-01 Infineon Technologies, Ag Plastic housing composition for embedding semiconductor devices in a plastic housing and use of the plastic housing composition
EP3156434A1 (en) * 2015-10-12 2017-04-19 Henkel AG & Co. KGaA Nanocapsules as thermolatent polymerization catalysts or initiators
WO2017063900A1 (en) * 2015-10-12 2017-04-20 Henkel Ag & Co. Kgaa Nanocapsules as thermolatent polymerisation catalysts or initiators

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