JPS61295617A - Formation of inductor core pattern - Google Patents

Abstract

PURPOSE:To form thicker the thickness of the conductor leaving the thickness of the resist intact the conventional thickness by a method wherein the conductor having the ratio of the width to the depth is 1:2, is formed in the substrate. CONSTITUTION:The resist to be formed in the process C conforming to the groove to be formed in the processes D and A is exposed and developed and a the resist is photoetched. In this case, the liquid resist to fill the groove to be formed in the process A is etched according to the configuration of a glass parent material 1. Accordingly a rectangle-shaped deep groove 13, wherein the ratio of the width to the depth is nearly 1:2, can be formed in the surface of the glass parent material 1. A rectangle-shaped conductor 14 (for example, Cu conductor) is formed in the deep groove 13 to be formed in the processes E and D by performing an electroforming. The glass parent material 1 is removed in the process H and the conductor 14 to be formed by performing an electroforming is formed in a substrate 15 to be arranged in the process G. As a result, the conductor is formed in the shape of being embedded the half thereof in a resin 16 on the substrate 15.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method for forming a conductor pattern that aims to increase the reproduction output of inductosin for detecting minute displacements.

<Conventional technology> Inductosyn uses two conductors, which are separated by a slider and a scale, arranged in parallel with a small distance apart, and when an alternating current voltage is applied to one, a voltage is induced in the other by electromagnetic 1339. It is designed to measure relative positions.

Conventionally, such inductosin patterns have been formed by electroforming when a high M degree is required.

FIG. 3 is a process diagram showing a conventional pattern forming method. This will be explained according to the diagram.

B. Apply resist 2 to glass base material 1.

Opening: The coated resist is exposed and photoetched to form grooves 3.

8. A conductor (for example, Cu) 4 is formed by electroforming in the groove formed by the groove.

D Peel off the resist 2 l11! do.

(e) A substrate 5 is placed at a predetermined distance from the conductor 4, and resin is injected.

F. Peel off the glass and form a conductor embedded in resin on the substrate 5.

A conductor was formed on the substrate through the above steps.

<Problems to be Solved by the Invention> However, in the above-mentioned conventional technology for forming an inductosin conductor, if the width of the groove is 20 μm and the pitch of each groove is approximately 50 μm, the cross-sectional area of the groove becomes small and the conductor resistance increases. increases and the output becomes weaker. Therefore, it is conceivable to make the resist film thicker and to make the conductor formed on the glass base material thicker, but there is a limit to the thickness of the resist film when, for example, a liquid resist is used as the resist. It is conceivable to further apply a liquid resist on top of the liquid resist 1~ or to use a dry resist as a resist to make it thicker, but if it is too thick (then there is a problem that it will be difficult to form the etching groove to a predetermined size). .

・Means for solving the problems> The present invention was made in view of the above problems, and aims to form a conductor thicker while keeping the resist thickness the same as before. The two features are slider and scale.
By placing two conductors in parallel with a small distance between them, and applying an AC voltage to one, the other conductor can be energized! In an inductosyn pattern forming method in which a voltage is induced by induction and the position is read based on the induced voltage, the pattern is formed by etching a groove with a width and depth of approximately 1:1 on the surface of a glass base material. Then, a liquid resist is embedded in this groove, a dry or liquid resist is applied to the surface of the base material in which the liquid resist is embedded, and the thickness is approximately the same as the depth of the groove, and the resist and the liquid resist embedded in the groove are is removed by etching to form a deep groove with a width and depth of approximately 1:2, and a conductor (for example, Cu) 4 is placed in the deep groove. formed by casting, removing the dry or liquid resist while leaving the conductor, and arranging a substrate at a predetermined distance from the conductor;
A resin is injected between the glass base material and the substrate, the glass base material is removed, and a conductor with a width to depth ratio of 1:2 is formed on the substrate. Figures (A) to (H) are manufacturing process explanatory diagrams showing one embodiment of the present invention.

Step A: Groove 10 with width a and depth h is formed in the glass base material 1 at a ratio of 1:1.
to form. This 10th grade is created by applying a resist to the glass surface, exposing it to light, and photo-etching it. In addition,
As the glass base material 1, a material with good etching properties, such as crystallized glass, is used, but if the width to depth ratio is approximately 1=2, it is difficult to form a rectangular groove.

Liquid resist 11 is embedded in the grooves formed in steps B and A.

Step 1: Dry resist or liquid resist 12 is formed on the surface of glass base material 1. The thickness of this resist is set to a thickness h that is approximately the same as the depth of the groove.

In the process, the resist formed in step C is exposed and developed to match the grooves formed in step A, and photoetching is performed. In this case, the liquid resist embedded in the groove formed in A is etched according to the shape of the glass base material 1, so the glass base material 1
There is a rectangular deep groove 1 with a depth to width of approximately 1:2 on the surface of the
3 can be formed.

A rectangular conductor 14 (for example, Cu) is formed in the deep groove 13 formed in steps E and D by 'i4 casting.

The dry or liquid resist 12 formed in steps F and C is peeled off. As a result, the conductor 14 is half-embedded in the glass base material 1.

Step G1 A substrate 15 (for example, an Al plate) is placed at a predetermined distance from the conductor, and a resin 16 (for example, epoxy resin) is injected between the glass base material 1 and the substrate.

Step H1 The glass base material 1 is removed and the substrate 15 is placed in G.
A conductor 14 is formed by R casting. As a result, the conductor is half-embedded in the resin 16 on the substrate 15.

According to the above process, the width and height ratio is 1=2 on the substrate 15.
A conductor with a width and height of 1:1 can be formed, and the conductor resistance can be reduced compared to a conductor with a width and height of 1:1. In addition,
As shown in FIG. 2, the conductor 14 can be protected by coating the surface of the substrate with a resin 17 (eg, epoxy resin, etc.) and embedding the conductor 14 therein.

<Effects of the Invention> As described above in detail with the embodiments, according to the present invention, it is possible to form a pattern that increases the reproduction output in an inductosin that detects displacement over a minute distance.

[Brief explanation of drawings]

Fig. 1 is an explanatory diagram of the process of forming an inductosin pattern of the present invention, Fig. 2 is a diagram showing an embodiment that protects the conductor, and Fig. 3 is an explanatory diagram of the process of forming a conventional inductosin pattern. It is. FIG. 3 is a perspective view showing the state of bamboo on which substrates are stacked. 1...Glass base material, 1o...groove, 13...deep groove,
14...Conductor, 15...Substrate, 16...Resin. 1st A Glass base material etching G Resin injection

Claims (1)

[Claims] Two conductors, a slider and a scale, are installed in parallel with a slight distance between them, and by applying an AC voltage to one, a voltage due to electromagnetic induction is induced in the other, and the position is read based on the induced voltage. In the Inductosin pattern forming method, the pattern includes: [1] forming a groove with a width and depth of approximately 1:1 by etching on the surface of a glass base material; [2] filling the groove with a liquid resist; 3] Applying a dry resist or liquid resist having a thickness approximately equal to the depth of the groove on the surface of the base material in which the resist is embedded, [4] Applying the dry resist or liquid resist and the liquid resist embedded in the groove. [5] forming a conductor in the deep groove by electroforming; [6] removing the dry resist or liquid resist applied in [3] above; , [7] placing a substrate at a predetermined distance from the conductor; [8] injecting a resin between the glass base material and the substrate; [9] removing the glass base material and removing the substrate. An inductosyn pattern forming method characterized in that a conductor is formed by electroforming.