JPS61282911A - Input device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Field of application to which the invention pertains] The present invention relates to a high precision input device.

[Prior art]

In conventional devices of this type, when detecting the position of a pressed point on an input device with high precision, it is necessary that the resistance values of the electrodes on the two substrates that make up the input device be completely uniform. there were. However, in order to make the resistance value of the electrodes on this substrate completely uniform, it is necessary to make the film thickness of the electrodes completely constant, but this is actually impossible due to the manufacturing of the electrodes. there were.

[Problem that the invention seeks to solve]

Therefore, in such conventional input devices, the resistance value of the electrode on the board cannot be formed uniformly over the entire surface, so there is a problem that the position of the pressed point cannot be detected with high precision. There was a point.

The present invention was made to solve these conventional problems, and its purpose is to be able to detect the position of a pressed point with high precision even if the resistance value of the electrode on the substrate is not uniform over the entire surface. It is said that

[Means to solve problems]

An input device is constituted by two substrates having electrodes formed almost uniformly on their surfaces and having electrode terminals at both ends of the electrodes, with the electrode surfaces facing each other and aligned in a direction that intersects the electrode terminals. By making cuts in the electrodes outside the effective area as an input device between the electrode terminals, the resistance value between the electrode terminals is changed and the resistance uniformity between the electrodes is improved.

[Effect]

The operation of the present invention will be explained in detail based on the drawings. FIG. 1 shows the basic structure of the invention.

In FIG. 1 (α), the resistance of the electrode 2 between the electrode terminals 3 is corrected by the cut 4. FIG. 1(B) shows the principle of correction. Electric! 2 can be considered by dividing it into R1-R6 in FIG. 1(B), and by the cut 4, J=J=...R,
=R. That is, electrode 2
is divided into a plurality of blocks, and the resistance value of each block is changed and corrected by changing the area.

Next, a method of calculating the area change rate of each block will be explained. dl shown in FIG. dl,...dk...d
,...d are each block. A voltage V is applied between +1 and 3 outside the electrode terminals, and the potential on the electrode 2 is measured at (s x s) locations as shown in FIG. The average potential of each fx line is expressed as (1) First, find ('Is'!...V%]. Next, the theoretical voltage drop of each block. The VTR can be expressed as follows.In addition, each block voltage drop vdx is as follows: u d J: v − v x ・・・−・−
(8)! -1, and then calculate the difference from the theoretical voltage 1) TH.

v (dx-va)=adz-v! n = (4)
The block with the maximum value of v(dx-tH) determined by equation (4) is set as the maximum resistance value block, and the following calculations are performed to set the resistance values of the other blocks to their maximum resistance values. If the voltage drop of the maximum value block is v d max, then the following equation is obtained. That is, if the area of each block is reduced by the ratio of P, the resistance between the electrode terminals 3 approaches uniformity.

〔Example〕

Embodiments of the present invention will be described below based on the drawings.

(Example 1) Figure 3 shows an FFfT (1B8μ) film on the upper substrate, glass (1,1T) on the lower substrate, and vapor deposition on the electrode TO9 electrode terminal. Using paste, a cut was made in the electrode TO using a laser (Young), and a voltage detection type input device was prototyped. A spacer of several tens of microns was placed between the upper and lower substrates, and sealing adhesive was placed on all four sides. The board size is approximately 1100 x 150, and the cut is 20 mm.
As shown in Figure 3, the pitch was placed at two locations outside the effective area in the voltage application direction. The laser spot diameter was about 25μ. The resistance uniformity is significantly improved by this correction, and the difference between the measured potential and the theoretical potential when untreated is reduced to 1/3.
It became below. Also, considering the linearity error when unprocessed 2
-4% was corrected to 17%. This input device is 12
When installed on a liquid crystal display module with 8 x 256 dots (dot pitch 147°) and operated with dot support, the one with 5 dots above the suppression deviation when unprocessed, but after correction,
Corrected to ±2 dots.

(Example 2) When the same correction as in Example 1 was made by changing the cut pitch to 5 wm, the resistance uniformity was better than that in Example 1, and the linearity error was 1.9% a, 5% I was able to.

(Example 5) When the same correction as in Example 1 was made with the cut pitch set to α3 mm, the resistance uniformity was better than that in Example 2, and the linearity error was 2.0%, which was , 4%. In this case, the cut by the laser becomes a curved line starting from the top of the stairs, and at fl/p, the cut is made by the combiator control.
It should be noted that the input device of the present invention may be of a current detection type instead of a voltage detection type, which may be easily implemented. Further, the substrate may be transparent or opaque, and the same applies to the electrodes.

Furthermore, the same effect can be achieved by making cuts by laser, by etching, by using a cutter, etc.

〔Effect of the invention〕

As explained above, according to the present invention, errors in position detection caused by non-uniformity of electrode resistors on a substrate are corrected, and highly accurate position detection becomes possible. In addition, the difficult manufacturing process of uniformly forming electrode resistors on the substrate can be replaced with a method of making cuts using a laser or the like during the process, making it possible to provide a highly accurate input device. It got easier.

[Brief explanation of drawings]

FIG. 1 shows the basic structure of the present invention, FIG. 2 shows an implementation example of the invention, and FIG. 3 shows an input section in an embodiment of the input device of the invention. 1...... Substrate 2... Electrode 5... Electrode terminal 4... Cut 5... ...... Effective area boundary line 6...
...It is a current measurement point. that's all

Claims (2)

[Claims] (1) Two substrates having electrodes formed almost uniformly on their surfaces and having electrode terminals at both ends of the electrodes are arranged so that the electrode surfaces face each other, and the electrode terminals are aligned in a direction to intersect. What is claimed is: 1. An input device comprising: a cut in the electrode; and a resistance value between the electrode terminals of the electrode is changed by the cut. (2) The input device according to claim 1, wherein the cut is made outside an effective area as an input device with a width of several tens of microns to several hundred microns.