JPS61281881A - ドライエツチング装置 - Google Patents
ドライエツチング装置Info
- Publication number
- JPS61281881A JPS61281881A JP12302485A JP12302485A JPS61281881A JP S61281881 A JPS61281881 A JP S61281881A JP 12302485 A JP12302485 A JP 12302485A JP 12302485 A JP12302485 A JP 12302485A JP S61281881 A JPS61281881 A JP S61281881A
- Authority
- JP
- Japan
- Prior art keywords
- gas introduction
- gas
- holes
- etching
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12302485A JPS61281881A (ja) | 1985-06-06 | 1985-06-06 | ドライエツチング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12302485A JPS61281881A (ja) | 1985-06-06 | 1985-06-06 | ドライエツチング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61281881A true JPS61281881A (ja) | 1986-12-12 |
| JPS6341986B2 JPS6341986B2 (enrdf_load_stackoverflow) | 1988-08-19 |
Family
ID=14850329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12302485A Granted JPS61281881A (ja) | 1985-06-06 | 1985-06-06 | ドライエツチング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61281881A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4897171A (en) * | 1985-11-26 | 1990-01-30 | Tadahiro Ohmi | Wafer susceptor |
| JP2015037107A (ja) * | 2013-08-13 | 2015-02-23 | 株式会社ディスコ | プラズマエッチング装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5752423A (en) * | 1980-09-13 | 1982-03-27 | Yukio Ishikawa | High speed steam hot-water heater |
-
1985
- 1985-06-06 JP JP12302485A patent/JPS61281881A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5752423A (en) * | 1980-09-13 | 1982-03-27 | Yukio Ishikawa | High speed steam hot-water heater |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4897171A (en) * | 1985-11-26 | 1990-01-30 | Tadahiro Ohmi | Wafer susceptor |
| JP2015037107A (ja) * | 2013-08-13 | 2015-02-23 | 株式会社ディスコ | プラズマエッチング装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6341986B2 (enrdf_load_stackoverflow) | 1988-08-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5009738A (en) | Apparatus for plasma etching | |
| US5851600A (en) | Plasma process method and apparatus | |
| JP2748886B2 (ja) | プラズマ処理装置 | |
| US5252892A (en) | Plasma processing apparatus | |
| JPH0423429A (ja) | 半導体装置のプラズマ処理装置及びプラズマ処理方法 | |
| JP2550037B2 (ja) | ドライエッチング方法 | |
| JPS61281881A (ja) | ドライエツチング装置 | |
| JPH04297578A (ja) | プラズマ処理装置 | |
| JPS57202733A (en) | Dry etching device | |
| JPH02312231A (ja) | ドライエッチング装置 | |
| JP3940467B2 (ja) | 反応性イオンエッチング装置及び方法 | |
| JP3643549B2 (ja) | マイクロ波プラズマ処理装置およびマイクロ波プラズマ処理方法 | |
| JP3164188B2 (ja) | プラズマ処理装置 | |
| JPS5964779A (ja) | 多チヤンバ−ドライエツチング装置 | |
| JPS60123033A (ja) | プラズマ処理装置 | |
| JPS5943880A (ja) | ドライエツチング装置 | |
| JP3865235B2 (ja) | プラズマ処理装置 | |
| KR100784793B1 (ko) | 플라즈마 처리 장치 및 이를 이용한 기판의 처리 방법 | |
| JP2002043289A (ja) | プラズマ処理方法及び装置 | |
| JPH01107539A (ja) | マイクロ波プラズマ処理装置 | |
| JPH07106315A (ja) | プラズマ処理装置 | |
| JPS5913328A (ja) | ドライエツチング装置 | |
| JPH0637052A (ja) | 半導体加工装置 | |
| JPH01175738A (ja) | ドライエッチング装置 | |
| JP2004119766A (ja) | 半導体製造装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |