JPS61263123A - Wafer supplying apparatus - Google Patents

Wafer supplying apparatus

Info

Publication number
JPS61263123A
JPS61263123A JP60102727A JP10272785A JPS61263123A JP S61263123 A JPS61263123 A JP S61263123A JP 60102727 A JP60102727 A JP 60102727A JP 10272785 A JP10272785 A JP 10272785A JP S61263123 A JPS61263123 A JP S61263123A
Authority
JP
Japan
Prior art keywords
shot
wafer
stepper
amount
alignment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60102727A
Other languages
Japanese (ja)
Other versions
JPH0149007B2 (en
Inventor
Hideki Ine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP60102727A priority Critical patent/JPH0149007B2/ja
Publication of JPS61263123A publication Critical patent/JPS61263123A/en
Priority claimed from US07/273,707 external-priority patent/US4861162A/en
Publication of JPH0149007B2 publication Critical patent/JPH0149007B2/ja
Expired legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70216Systems for imaging mask onto workpiece
    • G03F7/70358Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075Handling workpieces outside exposure position, e.g. SMIF box
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Abstract

PURPOSE:To realize high-speed processing of position alignment with high precision, by detecting and memorizing a mutual position of each chip against wafer, with marks on a holding jig serving as standard, and computing/processing the mutual positions of chips. CONSTITUTION:At an alignment station 21, each shot position of wafer 2 against chuck marks 31 is detected by the use of an off-axis alignment optical system 1. The value of 'a required space', which has been beforehand set and used, is actually measured with each shot position being detected, and the amount of positioning difference generated every shot is measured at the alignment station 21 and memorized in a floppy disk 10 equipped for CPU 9. Successively, a chuck 3, on which the wafer 2 is mounted, is transferred from the alignment station 21 to a light-exposure stage 4' in a stepper 11. The CPU 9 takes out the amount of positioning difference, sending the data into the stepper 11. While a reticle 6 is aligned with the chuck marks 31 inside the stepper 11, every shot-drive from this position, by 'the required space' plus 'the amount of positioning difference', is performed for light exposure.
JP60102727A 1985-05-16 1985-05-16 Expired JPH0149007B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60102727A JPH0149007B2 (en) 1985-05-16 1985-05-16

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60102727A JPH0149007B2 (en) 1985-05-16 1985-05-16
US07/273,707 US4861162A (en) 1985-05-16 1988-11-15 Alignment of an object

Publications (2)

Publication Number Publication Date
JPS61263123A true JPS61263123A (en) 1986-11-21
JPH0149007B2 JPH0149007B2 (en) 1989-10-23

Family

ID=14335291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60102727A Expired JPH0149007B2 (en) 1985-05-16 1985-05-16

Country Status (1)

Country Link
JP (1) JPH0149007B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5386269A (en) * 1988-05-12 1995-01-31 Canon Kabushiki Kaisha Alignment and exposure apparatus
JPH10163100A (en) * 1996-11-28 1998-06-19 Nikon Corp Projection light-exposure device, projection light-exposure method, and scan light-exposure method
KR100309932B1 (en) * 1986-04-28 2001-12-15 제임스 엠. 윌리암스 Wafer transport apparatus and method
JP2014143335A (en) * 2013-01-25 2014-08-07 Dainippon Screen Mfg Co Ltd Drawing device and drawing method
WO2022118468A1 (en) * 2020-12-04 2022-06-09 日本電信電話株式会社 Substrate for wafer conveyance

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3962736B2 (en) 2004-10-08 2007-08-22 キヤノン株式会社 Exposure apparatus and device manufacturing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100309932B1 (en) * 1986-04-28 2001-12-15 제임스 엠. 윌리암스 Wafer transport apparatus and method
US5386269A (en) * 1988-05-12 1995-01-31 Canon Kabushiki Kaisha Alignment and exposure apparatus
JPH10163100A (en) * 1996-11-28 1998-06-19 Nikon Corp Projection light-exposure device, projection light-exposure method, and scan light-exposure method
JP2014143335A (en) * 2013-01-25 2014-08-07 Dainippon Screen Mfg Co Ltd Drawing device and drawing method
WO2022118468A1 (en) * 2020-12-04 2022-06-09 日本電信電話株式会社 Substrate for wafer conveyance

Also Published As

Publication number Publication date
JPH0149007B2 (en) 1989-10-23

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