JPS61258444A - Wafer position detecting device - Google Patents

Wafer position detecting device

Info

Publication number
JPS61258444A
JPS61258444A JP9950785A JP9950785A JPS61258444A JP S61258444 A JPS61258444 A JP S61258444A JP 9950785 A JP9950785 A JP 9950785A JP 9950785 A JP9950785 A JP 9950785A JP S61258444 A JPS61258444 A JP S61258444A
Authority
JP
Japan
Prior art keywords
wafer
finger
laser
photosensor
rotate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9950785A
Other languages
Japanese (ja)
Other versions
JPH0652753B2 (en
Inventor
Takao Ukaji
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP60099507A priority Critical patent/JPH0652753B2/en
Publication of JPS61258444A publication Critical patent/JPS61258444A/en
Publication of JPH0652753B2 publication Critical patent/JPH0652753B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Abstract

PURPOSE:To conduct securely a detection of the position of each wafer and a detection of the aging of the wafer carrying mechanism by a wafer position detecting device in a simple constitution by a method wherein the device is provided with a parallel shifting mechanism for the wafer optical path. CONSTITUTION:A laser beam 2 to be emitted from a laser light source 1 is made to refract by a rotating glass plate 3 to be provided as the luminous flux parallel shifting means for the laser optical path and after the course thereof is changed, the laser beam 2 is emitted by a reflecting mirror 4 in parallel to wafers 7 or a finger 5. The rotating glass plate 3 can be made to rotate toward arbitrary positions and the control unit is capable of knowing the angles to be made to rotate. A carrier stand 9 is made to shift to the upper direction higher than the position of a photosensor 8 in a state that the finger 5 is made to contract, the state between the reflecting mirror 4 and the photosensor 8 is set into such a state that a wafer alone of the wafers 7, which is placed on the finger 5, exists between them, the glass plate 3 is made to rotate, the angle of rotation at the time the output of the photosensor begins falling is memorized, the center in the thickness direction of the wafer 7 is calculated and the position of the finger 5 is calculated from the value of the center calculated. Then, the wafer 7 on the finger 5 is removed and the position of the desired wafer and the position of the wafer to be located under the lower side of the desired wafer are found out.
JP60099507A 1985-05-13 1985-05-13 Substrate loading / unloading device Expired - Lifetime JPH0652753B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60099507A JPH0652753B2 (en) 1985-05-13 1985-05-13 Substrate loading / unloading device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60099507A JPH0652753B2 (en) 1985-05-13 1985-05-13 Substrate loading / unloading device

Publications (2)

Publication Number Publication Date
JPS61258444A true JPS61258444A (en) 1986-11-15
JPH0652753B2 JPH0652753B2 (en) 1994-07-06

Family

ID=14249173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60099507A Expired - Lifetime JPH0652753B2 (en) 1985-05-13 1985-05-13 Substrate loading / unloading device

Country Status (1)

Country Link
JP (1) JPH0652753B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62175365A (en) * 1986-01-29 1987-08-01 Nippon Kogaku Kk <Nikon> Semiconductor substrate conveying arm device
JPH02198926A (en) * 1989-01-27 1990-08-07 Hitachi Electron Eng Co Ltd Wafer taking-out control in cassette
JPH06239404A (en) * 1990-03-05 1994-08-30 Tet Techno Investment Trust Settlement Method and apparatus for holding and carrying plate-shaped base

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5318387A (en) * 1976-08-04 1978-02-20 Fujitsu Ltd Pattern inspection system
JPS5720444A (en) * 1980-07-11 1982-02-02 Citizen Watch Co Ltd Feeding device for semiconductor wafer
JPS58111705A (en) * 1981-12-25 1983-07-02 Mitsutoyo Mfg Co Ltd Optical measuring device
JPS59175740A (en) * 1983-03-25 1984-10-04 Telmec Co Ltd Extractor for wafer in measuring device for semiconductor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5318387A (en) * 1976-08-04 1978-02-20 Fujitsu Ltd Pattern inspection system
JPS5720444A (en) * 1980-07-11 1982-02-02 Citizen Watch Co Ltd Feeding device for semiconductor wafer
JPS58111705A (en) * 1981-12-25 1983-07-02 Mitsutoyo Mfg Co Ltd Optical measuring device
JPS59175740A (en) * 1983-03-25 1984-10-04 Telmec Co Ltd Extractor for wafer in measuring device for semiconductor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62175365A (en) * 1986-01-29 1987-08-01 Nippon Kogaku Kk <Nikon> Semiconductor substrate conveying arm device
JPH02198926A (en) * 1989-01-27 1990-08-07 Hitachi Electron Eng Co Ltd Wafer taking-out control in cassette
JPH06239404A (en) * 1990-03-05 1994-08-30 Tet Techno Investment Trust Settlement Method and apparatus for holding and carrying plate-shaped base

Also Published As

Publication number Publication date
JPH0652753B2 (en) 1994-07-06

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term