JPS6124315A - Manufacture of surface acoustic wave device - Google Patents

Manufacture of surface acoustic wave device

Info

Publication number
JPS6124315A
JPS6124315A JP14541684A JP14541684A JPS6124315A JP S6124315 A JPS6124315 A JP S6124315A JP 14541684 A JP14541684 A JP 14541684A JP 14541684 A JP14541684 A JP 14541684A JP S6124315 A JPS6124315 A JP S6124315A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
printed board
many
element
elements
obtained
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14541684A
Inventor
Jiro Inoue
Hiromichi Yamada
Original Assignee
Murata Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components

Abstract

PURPOSE: To decrease manufacture cost by bonding elements obtained through cutting off of a wafer provided with many interdigital electrodes being a surface wave filter or the like in advance to a printed board having many open holes with an arranging jig and cutting off the printed board so as to increase remarkably number of elements obtained from one wafer.
CONSTITUTION: The printed board 1 is bonded to each element 10 with an adhesives while the side coated with the adhesives is directed downward, and the four corners of each element 10 enter each open hole 2 and notches 4, 6. After the printed board 1 is bonded on many elements 10 in this case, the printed board 1 is cut off from a cut along imaginary lines A, B through the open hole 2 and many partially fabricated items of the surface acoustic filters are obtained. After each element rode 3 and the electrode of the elements 10 of the printed board 1 of the partially fabricated items are soldered by a proper means such as dipping, they are applied with resin molding to form products.
COPYRIGHT: (C)1986,JPO&Japio
JP14541684A 1984-07-12 1984-07-12 Manufacture of surface acoustic wave device Pending JPS6124315A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14541684A JPS6124315A (en) 1984-07-12 1984-07-12 Manufacture of surface acoustic wave device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14541684A JPS6124315A (en) 1984-07-12 1984-07-12 Manufacture of surface acoustic wave device

Publications (1)

Publication Number Publication Date
JPS6124315A true true JPS6124315A (en) 1986-02-03

Family

ID=15384746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14541684A Pending JPS6124315A (en) 1984-07-12 1984-07-12 Manufacture of surface acoustic wave device

Country Status (1)

Country Link
JP (1) JPS6124315A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6266857B1 (en) * 1998-02-17 2001-07-31 Microsound Systems, Inc. Method of producing a backing structure for an ultrasound transceiver

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6266857B1 (en) * 1998-02-17 2001-07-31 Microsound Systems, Inc. Method of producing a backing structure for an ultrasound transceiver

Similar Documents

Publication Publication Date Title
US4836435A (en) Component self alignment
US4429248A (en) Mounting apparatus and method for piezoelectric tuning fork
JPH01134956A (en) Assembly of semiconductor device
JPH01251787A (en) Connecting device for electronic parts
JPS61268001A (en) Chip-shaped electronic component
JPH02186662A (en) Elastic surface wave element package
JPH03225904A (en) Applying method of conductive paste onto multilayer chip
JPS5258468A (en) Production of ceramic package
JPH06244304A (en) Leadless chip carrier package
JPH03214783A (en) Laminated sensor
JPH03106097A (en) Drive circuit device
JPS58156220A (en) Thin film piezoelectric filter
JPH01315122A (en) Chip-type device for fixing to circuit board
JPH02192186A (en) Piezoelectric element
DE19500743A1 (en) Package carrier for semiconductor components
JPH04148553A (en) Manufacture of chip type electronic component
JPH03241802A (en) Chip type electronic parts
JPS60257159A (en) Semiconductor device
JPS63288031A (en) Flip chip bonding
JPS6059980A (en) Piezoelectric drive device
JPH04357801A (en) Manufacture of chip type resistor string
JPS63127557A (en) Chip carrier, chip loading part using same chip carrier and semiconductor chip mounting device structure
JPS58197912A (en) Surface acoustic wave filter having function for dividing wave
GB1487741A (en) Porous laminate and method of manufacture
JPS63122288A (en) Electrostriction effect element