JPS61239648A - 半導体パッケ−ジ用窓枠状ろう材付封着板 - Google Patents

半導体パッケ−ジ用窓枠状ろう材付封着板

Info

Publication number
JPS61239648A
JPS61239648A JP60081092A JP8109285A JPS61239648A JP S61239648 A JPS61239648 A JP S61239648A JP 60081092 A JP60081092 A JP 60081092A JP 8109285 A JP8109285 A JP 8109285A JP S61239648 A JPS61239648 A JP S61239648A
Authority
JP
Japan
Prior art keywords
solder
alloy
sealing board
clad
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60081092A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0334862B2 (https=
Inventor
Naoki Uchiyama
直樹 内山
Kiyoshi Takaku
高久　潔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP60081092A priority Critical patent/JPS61239648A/ja
Publication of JPS61239648A publication Critical patent/JPS61239648A/ja
Publication of JPH0334862B2 publication Critical patent/JPH0334862B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Ceramic Products (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60081092A 1985-04-16 1985-04-16 半導体パッケ−ジ用窓枠状ろう材付封着板 Granted JPS61239648A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60081092A JPS61239648A (ja) 1985-04-16 1985-04-16 半導体パッケ−ジ用窓枠状ろう材付封着板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60081092A JPS61239648A (ja) 1985-04-16 1985-04-16 半導体パッケ−ジ用窓枠状ろう材付封着板

Publications (2)

Publication Number Publication Date
JPS61239648A true JPS61239648A (ja) 1986-10-24
JPH0334862B2 JPH0334862B2 (https=) 1991-05-24

Family

ID=13736743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60081092A Granted JPS61239648A (ja) 1985-04-16 1985-04-16 半導体パッケ−ジ用窓枠状ろう材付封着板

Country Status (1)

Country Link
JP (1) JPS61239648A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6231144A (ja) * 1985-08-02 1987-02-10 Fujitsu Ltd 半導体装置
JPS63155642U (https=) * 1987-03-31 1988-10-12

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6231144A (ja) * 1985-08-02 1987-02-10 Fujitsu Ltd 半導体装置
JPS63155642U (https=) * 1987-03-31 1988-10-12

Also Published As

Publication number Publication date
JPH0334862B2 (https=) 1991-05-24

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